PH12021050081A1 - An apparatus for detecting internal defects in an electronic component and method thereof - Google Patents

An apparatus for detecting internal defects in an electronic component and method thereof

Info

Publication number
PH12021050081A1
PH12021050081A1 PH12021050081A PH12021050081A PH12021050081A1 PH 12021050081 A1 PH12021050081 A1 PH 12021050081A1 PH 12021050081 A PH12021050081 A PH 12021050081A PH 12021050081 A PH12021050081 A PH 12021050081A PH 12021050081 A1 PH12021050081 A1 PH 12021050081A1
Authority
PH
Philippines
Prior art keywords
electronic component
internal defects
detecting internal
light source
cracks
Prior art date
Application number
PH12021050081A
Inventor
Cuan Teng Chee
Original Assignee
Ml Equipment M Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ml Equipment M Sdn Bhd filed Critical Ml Equipment M Sdn Bhd
Publication of PH12021050081A1 publication Critical patent/PH12021050081A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9505—Wafer internal defects, e.g. microcracks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8812—Diffuse illumination, e.g. "sky"
    • G01N2021/8816—Diffuse illumination, e.g. "sky" by using multiple sources, e.g. LEDs
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8867—Grading and classifying of flaws using sequentially two or more inspection runs, e.g. coarse and fine, or detecting then analysing
    • G01N2021/887—Grading and classifying of flaws using sequentially two or more inspection runs, e.g. coarse and fine, or detecting then analysing the measurements made in two or more directions, angles, positions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Signal Processing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)

Abstract

The present invention relates to an apparatus (1) and method (2) for detecting internal defects in an electronic component comprising of an imaging unit (102) facing a first surface (106) of said electronic component (101) wherein said first surface (106) includes bump side of said electronic component (101); at least one infrared (IR) light source (103, 105) which is capable of illuminating internal defects (108) such as micro-cracks or inner cracks of said electronic component (101) caused by a laser grooving process; and said IR light source (103, 105) and said electronic component (101) are tilted to an angle of 0ø to 90ø with reference to their respective horizontal plane (LSHP, ECHP).
PH12021050081A 2020-05-20 2021-03-03 An apparatus for detecting internal defects in an electronic component and method thereof PH12021050081A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI2020002450 2020-05-20

Publications (1)

Publication Number Publication Date
PH12021050081A1 true PH12021050081A1 (en) 2022-02-14

Family

ID=78698106

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12021050081A PH12021050081A1 (en) 2020-05-20 2021-03-03 An apparatus for detecting internal defects in an electronic component and method thereof

Country Status (3)

Country Link
KR (1) KR20210143648A (en)
PH (1) PH12021050081A1 (en)
TW (2) TWM629845U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116539525A (en) * 2022-11-18 2023-08-04 苏州正齐半导体设备有限公司 Device and method for inspecting internal defects of electronic component

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200702656A (en) * 2005-05-25 2007-01-16 Olympus Corp Surface defect inspection apparatus
DE102009017786B3 (en) * 2009-04-20 2010-10-14 Intego Gmbh Method for detecting defects in a thin wafer wafer for a solar element and device for carrying out the method

Also Published As

Publication number Publication date
KR20210143648A (en) 2021-11-29
TWM629845U (en) 2022-07-21
TWI771920B (en) 2022-07-21
TW202144768A (en) 2021-12-01

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