KR20210143648A - An apparatus for detecting internal defects in an electronic component and method thereof - Google Patents

Abstract

The present invention relates to an apparatus (1) and a method (2) for detecting internal defects in an electronic component, which comprises: an imaging unit (102) facing a first surface (106) of the electronic component (101), wherein the first surface (106) includes a bump side surface of the electronic component (101); and at least one infrared (IR) light source (103, 105) capable of lighting an internal crack (108), such as a fine crack or an inner crack of the electronic component (101) caused by a laser grooving processing process. The IR light source (103, 105) and the electronic component (101) are inclined at 0 to 90 degrees based on each of the horizontal planes (LSHP, ECHP). According to the present invention, an image of the inner defect can be captured with minimized noise.

Description

Apparatus and method for detecting internal defects of electronic components

The present invention relates to an apparatus and method for detecting internal defects of an electronic component, comprising: an imaging unit facing a first surface of the electronic component, the first surface comprising a bump side of the electronic component; at least one infrared (IR) light source capable of illuminating internal cracks, such as microcracks or eye defects, of the electronic component caused by a laser grooving process, wherein the IR light source and the electronic component are disposed in respective horizontal planes It is inclined at an angle of 0° to 90° with respect to .

Wafer dicing is a core process in a semiconductor integrated circuit (IC) manufacturing site, and as a sawing process for separating individual semiconductor dies from a wafer, the sawing process may be performed through a mechanical sawing process or a laser grooving process. It is well known that laser grooving is the newest and most advanced technology compared to the traditional mechanical sawing process using blades. Nevertheless, the laser grooving process results in microcracks or internal cracks in the semiconductor die, resulting in a low throughput process. While sidewall infrared (IR) inspection of semiconductor die cannot inspect internal defects caused by laser grooving, IR surface inspection faces difficulties due to the gray value difference between the background and the defect.

Kim Kyung-beom (KR 101234603 B1) disclosed a surface defect inspection apparatus using Raman scattering. The apparatus for inspecting surface defects on a subject includes: a seating unit on which the subject is seated; a light source unit irradiating Raman laser light to the subject; a light detector for detecting scattered light scattered by the subject; and Raman spectra and Raman shifts electrically connected to the photodetector and measuring Raman spectra and Raman shifts from the detected scattered light, and comparing the measured Raman shifts with a plurality of defect determination Raman shifts preset for each type of binding; and a defect determination unit for determining the presence or absence of a defect and a defect type. It also provides a method for examining sample surface defects using Raman scattering. Nevertheless, KR 101234603 B1 has some limitations because it is only for surface defect inspection and cannot detect the presence or absence of internal defects of a semiconductor device.

In addition to KR 101234603 B1, methods and systems for determining the presence of macro defects are provided, as disclosed in US 6818459 B2 by Wack et al.

The system may include a stage configured to support the sample and coupled to the measurement device. The measuring device may include an illumination system and a detection system. The illumination system and detection system may be configured such that the system may be configured to determine various properties of a sample. For example, a system can be configured to determine several properties of a sample, including, but not limited to, the presence of macro defects and overlay of the sample. In this way, the measuring device may perform multiple optical and/or non-optical metrology and/or inspection techniques. This method, like KR 101234603 B1, has some disadvantages, as the system and method are for determining the presence of macro defects excluding internal defects such as microcracks.

Therefore, by inspecting the electronic component at different angles during infrared (IR) projection, or by setting the camera position facing the electronic component at different angles [wherein at least one infrared (IR) light source and the electronic component are each It would be advantageous to alleviate the disadvantage by having an apparatus and method for detecting internal defects such as inclination at an angle of 0° to 90° with respect to the horizontal plane of the electronic component, microcracks or internal cracks in electronic components.

Accordingly, the main object of the present invention is to provide an apparatus and method that allows different angles upon infrared (IR) projection, or different angles of the camera position towards the electronic component, to detect internal defects such as microcracks or internal cracks in electronic components. will do

Another object of the present invention is to provide an apparatus and method for detecting internal defects of an electronic component, whereby the apparatus and method can capture images of internal defects with minimal noise.

Another object of the present invention is to provide an apparatus and method for detecting internal defects of an electronic component, whereby the apparatus and method can improve production throughput.

Another object of the present invention is to provide an apparatus and method for detecting internal defects of an electronic component, and the method enables the detection and inspection of microcracks more accurately and precisely.

Other further objects of the present invention will become apparent from the understanding of the following detailed description of the present invention or from the practical application of the present invention.

According to a preferred embodiment of the present invention there is provided:

A device for detecting internal defects of an electronic component, comprising:

an imaging unit facing a first surface of the electronic component, the first surface comprising a bump side of the electronic component; and

at least one infrared (IR) light source;

including,

the IR light source is arranged in such a way that the IR light source can illuminate an internal defect of the electronic component caused by a laser grooving process; and

The IR light source and the electronic component are inclined at an angle of 0° to 90° with respect to each horizontal plane.

In another embodiment of the present invention is provided:

A method for detecting internal defects of an electronic component, comprising:

(i) transferring the electronic component from a rotating turret station to an inspection station;

(ii) inspecting a first sidewall of the electronic component by an imaging unit with at least one infrared (IR) light source while the electronic component moves along the X-axis direction;

(iii) rotating the electronic component along a plane of the electronic component, and inspecting a second sidewall of the electronic component by the imaging unit after rotation of the electronic component;

(iv) rotating the electronic component along the plane of the electronic component and inspecting the second sidewall of the electronic component by the imaging unit after rotation of the electronic component (iii) inspecting four sidewalls of the electronic component Repeat steps for

(v) transferring the electronic component to a standby position along the X-axis direction; and

(vi) transferring the electronic component back to the rotating turret station;

including,

the IR light source is arranged in such a way that the IR light source can illuminate an internal defect of the electronic component caused by a laser grooving process; and

The IR light source and the electronic component are inclined at an angle of 0° to 90° with respect to each horizontal plane.

Other aspects and advantages of the present invention will be identified after review of the detailed description in conjunction with the accompanying drawings.
1A shows an exemplary diagram of the present invention, with an imaging unit facing a first surface of the electronic component and an infrared (IR) light source facing a second surface of the electronic component.
1B shows another exemplary diagram of the present invention while the imaging unit is facing a first surface of the electronic component and an IR light source is positioned on one sidewall of the electronic component.
1C shows another exemplary diagram of the present invention, while
Another example of the present invention while an imaging unit is facing a first surface of the electronic component, one of the IR light sources is facing a second surface of the electronic component, and the other IR light source is positioned on a sidewall of the electronic component. shows a schematic diagram.
1D shows another exemplary diagram of the present invention while the imaging unit is housed with a built-in IR light source.
2 depicts an exemplary method flow of the present invention during detection of an internal defect of an electronic component.
3 shows an exemplary diagram of the present invention during detection of internal defects of an electronic component at an inspection station.

In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, and/or components have not been described in detail so as not to obscure the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention will be understood more clearly from the following detailed description of embodiments given by way of example only, with reference to the accompanying drawings, which are not drawn to scale.

As used in this disclosure and in the claims appended hereto, the singular forms “a”, “an” and “the” include plural referents unless the context clearly dictates or indicates otherwise.

Throughout the disclosure and claims of this specification, variations of words such as "comprises" and "comprising" and "comprising" mean "including but not limited to", e.g., other elements , it is not intended to exclude integers or steps. “Exemplary” means “some examples” and is not intended to convey indications of preferred or ideal embodiments, and “eg” is used for illustrative purposes and not in a limiting sense.

In general, the present invention claims an apparatus ( 1 ) for detecting an internal defect ( 108 ) of an electronic component ( 101 ) for capturing an image of the internal defect ( 108 ). an imaging unit (102) facing a first surface (106) of an imaging unit (102) comprising a bump side of the electronic component (101); at least one infrared (IR) light source (103, 105) positioned in a configuration such that the IR light source (103, 105) is capable of illuminating an internal defect (108) of the electronic component (101) caused by a laser grooving process 105), wherein the IR light sources 103 and 105 and the electronic component 101 are inclined at an angle of 0° to 90° with respect to each of the horizontal planes LSHP and ECHP. Different configurations or arrangements of the imaging unit 102 and the IR light sources 103 and 105 will be described in FIGS. 1A-1D .

Referring to FIG. 1A , there is shown an exemplary diagram for detecting an internal defect 108 , such as a microcrack or internal crack of an electronic component 101 , wherein the internal defect 108 is the electronic component 101 . ) can occur throughout.

The imaging unit 102 faces the first surface 106 of the electronic component 101 , the electronic component 101 is inclined at an angle of 0° to 90° with respect to the horizontal plane ECHP, and the IR light source 103 faces the second surface 109 of the electronic component 101 . The first surface 106 includes the bump side of the electronic component 101 , and the second surface 109 refers to the rear side of the electronic component 101 . Alternatively, the IR light source 105 may be disposed on one sidewall ( 111) may be located.

Referring to FIG. 1C , another arrangement of imaging unit 102 and IR light sources 103 , 105 is shown. In this arrangement, the imaging unit 102 faces the first surface 106 of the electronic component 101 , the electronic component 101 being inclined at an angle of 0° to 90° with respect to the horizontal plane ECHP. . There will be two units of IR light sources 103 , 105 , wherein one of the IR light sources 103 is facing the second surface 109 of the electronic component 101 , and the second IR light source 105 is the It is positioned on one sidewall 111 of the electronic component 101 at an inclination angle of 0° to 90° with respect to the horizontal plane LSHP of the IR light source 105 . Optionally, the imaging unit 102 comprises an embedded IR light source 107 , whereby the imaging unit 102 works with the embedded IR light source 107 as a single entity. The imaging unit 102 in which the IR light source 107 is embedded is disposed on the second surface 109 of the electronic component 101, and the IR light source 107 detects internal defects caused by the laser grooving process. can be illuminated Meanwhile, the imaging unit 102 may capture a clearer image of the internal defect with reference to FIG. 1D .

2 and 3 , an exemplary method and apparatus for detecting an internal defect 108 of an electronic component 101 at an inspection station 113 is illustrated in FIG. 3 . First, (i) the electronic component 101 will be transferred 201 from the rotary turret station 112 to the inspection station 113; Then (ii) the electronic component 101 is moved in a linear motion along the X-axis direction by the imaging unit 102 together with at least one infrared (IR) light source 103 , 105 . inspect (203) the first sidewall of (101); and then (iii) rotating the electronic component 101 along the plane of the electronic component 101 , and after the rotation of the electronic component 101 , the second of the electronic component 101 is performed by the imaging unit 102 . 2 The sidewall is inspected (205).

rotating the electronic component 101 along the plane of the electronic component 101 and inspecting the second sidewall of the electronic component 101 by the imaging unit 102 after the rotation of the electronic component 101 Step (iii) (205) is repeated (207) for the inspection of four sidewalls of the electronic component (101); The electronic component 101 is transferred to the standby position 209 along the X-axis direction. Finally, the electronic component 101 is transferred back to the rotary turret station 112 (211). Further, the IR light source 103, 105 can illuminate the internal defects 108, such as internal cracks and microcracks of the electronic component 101 caused by the laser grooving process; The IR light sources 103 and 105 and the electronic component 101 are inclined at an angle of 0° to 90° with respect to the respective horizontal planes LSHP and ECHP. In addition, the method (1) further comprises the step of moving the electronic component 101 in the Y-axis direction (linear movement) when a stitching image is required, and after step (v), the electronic component 101 is It is transferred (209) to the standby position along the X-axis direction.

One of the IR light sources 103 is disposed below the second surface 109 of the electronic component 101 , and/or the other IR light source 105 is zero relative to the horizontal plane LSHP of the IR light source 105 . By applying a different angle to the illumination projection, such as disposed on one sidewall 111 of the electronic component 101 at an angle of inclination of between ° and 90 °, captured by the imaging unit 102 compared to a conventional inspection system is Since the image will be sharper, internal defects or microcracks can be detected and inspected under minimal noise. The present invention uses reflection and refraction theory to gather images captured by imaging unit 102 to achieve important results.

Claims (6)

A device (1) for detecting an internal defect (108) of an electronic component (101), comprising:
an imaging unit (102) facing a first surface (106) of the electronic component (101), wherein the first surface (106) comprises a bump side of the electronic component (101); and
at least one infrared (IR) light source (103, 105);
including,
the IR light source (103, 105) is arranged in such a way that the IR light source (103, 105) can illuminate the internal defect (108) of the electronic component (101) caused by the laser grooving process; and
The IR light sources 103 and 105 and the electronic component 101 are inclined at an angle of 0° to 90° with respect to the respective horizontal planes (LSHP, ECHP), and the internal defect 108 of the electronic component 101 is eliminated. Device (1) for detecting. 2. The method of claim 1, wherein one of the IR light sources (103) faces a second surface (109) of the electronic component (101), wherein the second surface (109) faces a rear side of the electronic component (101). A device ( 1 ) for detecting an internal defect ( 108 ) of an electronic component ( 101 ), comprising: The one of the electronic component (101) according to claim 1 or 2, wherein one of the IR light sources (105) has an inclination angle of 0° to 90° with respect to the horizontal plane (LSHP) of the IR light source (105). A device ( 1 ) for detecting an internal defect ( 108 ) of an electronic component ( 101 ), located on a side wall ( 111 ). The electronic component (101) of claim 1, wherein the imaging unit (102) comprises a built-in IR light source (107), whereby the imaging unit (102) works in conjunction with the built-in IR light source (107). ) device (1) for detecting an internal defect (108). A method (2) for detecting an internal defect (108) of an electronic component (101), comprising:
(i) transferring (201) the electronic component (101) from the rotating turret station (112) to the inspection station (113);
(ii) the second movement of the electronic component 101 by the imaging unit 102 together with at least one infrared (IR) light source 103 , 105 while the electronic component 101 moves along the X-axis direction 1 inspecting the sidewall (203);
(iii) rotating the electronic component 101 along the plane of the electronic component 101 , and after rotation of the electronic component 101 by the imaging unit 102 , a second sidewall of the electronic component 101 . checking (205);
(iv) rotating the electronic component 101 along the plane of the electronic component 101 and turning the second sidewall of the electronic component 101 by the imaging unit 102 after the rotation of the electronic component 101 repeating (207) inspecting (iii) (205) for the inspection of four sidewalls of the electronic component (101);
(v) transferring (209) the electronic component (101) to the standby position (209) along the X-axis direction; and
(vi) transferring (211) the electronic component (101) back to the rotating turret station (112);
including,
the IR light source (103, 105) is arranged in such a way that the IR light source (103, 105) can illuminate the internal defect (108) of the electronic component (101) caused by the laser grooving process; and
The IR light sources 103 and 105 and the electronic component 101 are inclined at an angle of 0° to 90° with respect to the respective horizontal planes (LSHP, ECHP), and the internal defect 108 of the electronic component 101 is eliminated. How to detect (2). 6. The method according to claim 5, wherein the method (1) further comprises the step of moving the electronic component (101) in the Y-axis direction when a stitched image is required, and after step (v) the electronic component (101) is moved to the X A method (2) for detecting an internal defect (108) of an electronic component (101), which is transported along an axial direction to a standby position (209).

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