PH12017502415B1 - Bonding capillary - Google Patents

Bonding capillary

Info

Publication number
PH12017502415B1
PH12017502415B1 PH12017502415A PH12017502415A PH12017502415B1 PH 12017502415 B1 PH12017502415 B1 PH 12017502415B1 PH 12017502415 A PH12017502415 A PH 12017502415A PH 12017502415 A PH12017502415 A PH 12017502415A PH 12017502415 B1 PH12017502415 B1 PH 12017502415B1
Authority
PH
Philippines
Prior art keywords
face
insertion hole
sloping
sloping face
tapered
Prior art date
Application number
PH12017502415A
Other versions
PH12017502415A1 (en
Inventor
Soichiro Oka
Jumpei Onishi
Yuji Ishitsuka
Kenichi Motomura
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2016/069699 external-priority patent/WO2017006880A1/en
Application filed by Toto Ltd filed Critical Toto Ltd
Publication of PH12017502415B1 publication Critical patent/PH12017502415B1/en
Publication of PH12017502415A1 publication Critical patent/PH12017502415A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/745—Apparatus for manufacturing wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H01L2224/78303—Shape of the pressing surface, e.g. tip or head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H01L2224/78305—Shape of other portions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H01L2224/78305—Shape of other portions
    • H01L2224/78307—Shape of other portions outside the capillary

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

Provided is a bonding capillary that includes a body including an insertion hole in which a wire is inserted, a first pressing face that presses the wire and that includes a first sloping face provided around the insertion hole and inclined with respect to a direction in which the insertion hole extends, and a second pressing face that presses the wire and that includes a tapered face and a second sloping face, the tapered face being provided between the first sloping face and the insertion hole and having a tapered shape, the second sloping face being provided between the tapered face and the first sloping face, wherein a root-mean-square gradient of a roughness curve element on the second sloping face is smaller than a root-mean-square gradient of a roughness curve element of the first sloping face.
PH12017502415A 2015-07-03 2017-12-22 Bonding capillary PH12017502415A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015134649 2015-07-03
JP2016018954A JP6064308B2 (en) 2015-07-03 2016-02-03 Bonding capillary
PCT/JP2016/069699 WO2017006880A1 (en) 2015-07-03 2016-07-01 Bonding capillary

Publications (2)

Publication Number Publication Date
PH12017502415B1 true PH12017502415B1 (en) 2018-06-25
PH12017502415A1 PH12017502415A1 (en) 2018-06-25

Family

ID=57828318

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12017502415A PH12017502415A1 (en) 2015-07-03 2017-12-22 Bonding capillary

Country Status (5)

Country Link
JP (2) JP6064308B2 (en)
KR (1) KR101907906B1 (en)
CN (1) CN107710394B (en)
PH (1) PH12017502415A1 (en)
TW (1) TW201701982A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6064308B2 (en) * 2015-07-03 2017-01-25 Toto株式会社 Bonding capillary
US11375624B2 (en) * 2018-04-27 2022-06-28 Jx Nippon Mining & Metals Corporation Surface treated copper foil, copper clad laminate, and printed circuit board
CN110265313A (en) * 2019-07-25 2019-09-20 刘欢 Energy integration welds chopper
CN111785701A (en) * 2020-07-24 2020-10-16 宁波康强电子股份有限公司 Pre-electroplated nickel-palladium-gold lead frame and preparation method thereof
CN113787250B (en) * 2021-07-27 2023-01-10 中国电子科技集团公司第二十九研究所 Promote wedge riving knife structure of lead bonding precision
CN116000511B (en) * 2022-12-26 2024-04-09 深圳市海志亿半导体工具有限公司 Cutter head for enhancing fine-pitch wire feeding forming effect

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2615903B2 (en) * 1988-09-09 1997-06-04 富士通株式会社 Haze evaluation method for semiconductor wafer surface
US5662261A (en) * 1995-04-11 1997-09-02 Micron Technology, Inc. Wire bonding capillary
TW418468B (en) * 1997-12-19 2001-01-11 Toto Ltd Thin tube for wire connection
US6715658B2 (en) * 2001-07-17 2004-04-06 Kulicke & Soffa Investments, Inc. Ultra fine pitch capillary
JP4129947B2 (en) 2002-04-01 2008-08-06 臼井国際産業株式会社 Adhesion method using capillary condensation effect
JP3765778B2 (en) * 2002-08-29 2006-04-12 ローム株式会社 Capillary for wire bonding and wire bonding method using the same
US7407080B2 (en) 2004-04-02 2008-08-05 Chippac, Inc. Wire bond capillary tip
CH700833B1 (en) * 2006-07-03 2010-10-29 Kulicke & Soffa Ind Inc Bonding tool with improved surface finish.
US9831393B2 (en) * 2010-07-30 2017-11-28 Cree Hong Kong Limited Water resistant surface mount device package
JP5510691B2 (en) * 2012-09-26 2014-06-04 Ｔｏｔｏ株式会社 Bonding capillary
KR101482597B1 (en) * 2012-09-26 2015-01-14 토토 가부시키가이샤 Bonding capillary
JP6064308B2 (en) * 2015-07-03 2017-01-25 Toto株式会社 Bonding capillary

Also Published As

Publication number Publication date
CN107710394B (en) 2020-05-19
JP2017041657A (en) 2017-02-23
KR20180011249A (en) 2018-01-31
PH12017502415A1 (en) 2018-06-25
TWI562847B (en) 2016-12-21
TW201701982A (en) 2017-01-16
CN107710394A (en) 2018-02-16
JP6064308B2 (en) 2017-01-25
KR101907906B1 (en) 2018-10-15
JP2017017306A (en) 2017-01-19

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