PH12017502415B1 - Bonding capillary - Google Patents
Bonding capillaryInfo
- Publication number
- PH12017502415B1 PH12017502415B1 PH12017502415A PH12017502415A PH12017502415B1 PH 12017502415 B1 PH12017502415 B1 PH 12017502415B1 PH 12017502415 A PH12017502415 A PH 12017502415A PH 12017502415 A PH12017502415 A PH 12017502415A PH 12017502415 B1 PH12017502415 B1 PH 12017502415B1
- Authority
- PH
- Philippines
- Prior art keywords
- face
- insertion hole
- sloping
- sloping face
- tapered
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/745—Apparatus for manufacturing wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
- H01L2224/78303—Shape of the pressing surface, e.g. tip or head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
- H01L2224/78305—Shape of other portions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
- H01L2224/78305—Shape of other portions
- H01L2224/78307—Shape of other portions outside the capillary
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Provided is a bonding capillary that includes a body including an insertion hole in which a wire is inserted, a first pressing face that presses the wire and that includes a first sloping face provided around the insertion hole and inclined with respect to a direction in which the insertion hole extends, and a second pressing face that presses the wire and that includes a tapered face and a second sloping face, the tapered face being provided between the first sloping face and the insertion hole and having a tapered shape, the second sloping face being provided between the tapered face and the first sloping face, wherein a root-mean-square gradient of a roughness curve element on the second sloping face is smaller than a root-mean-square gradient of a roughness curve element of the first sloping face.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015134649 | 2015-07-03 | ||
JP2016018954A JP6064308B2 (en) | 2015-07-03 | 2016-02-03 | Bonding capillary |
PCT/JP2016/069699 WO2017006880A1 (en) | 2015-07-03 | 2016-07-01 | Bonding capillary |
Publications (2)
Publication Number | Publication Date |
---|---|
PH12017502415B1 true PH12017502415B1 (en) | 2018-06-25 |
PH12017502415A1 PH12017502415A1 (en) | 2018-06-25 |
Family
ID=57828318
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12017502415A PH12017502415A1 (en) | 2015-07-03 | 2017-12-22 | Bonding capillary |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP6064308B2 (en) |
KR (1) | KR101907906B1 (en) |
CN (1) | CN107710394B (en) |
PH (1) | PH12017502415A1 (en) |
TW (1) | TW201701982A (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6064308B2 (en) * | 2015-07-03 | 2017-01-25 | Toto株式会社 | Bonding capillary |
US11375624B2 (en) * | 2018-04-27 | 2022-06-28 | Jx Nippon Mining & Metals Corporation | Surface treated copper foil, copper clad laminate, and printed circuit board |
CN110265313A (en) * | 2019-07-25 | 2019-09-20 | 刘欢 | Energy integration welds chopper |
CN111785701A (en) * | 2020-07-24 | 2020-10-16 | 宁波康强电子股份有限公司 | Pre-electroplated nickel-palladium-gold lead frame and preparation method thereof |
CN113787250B (en) * | 2021-07-27 | 2023-01-10 | 中国电子科技集团公司第二十九研究所 | Promote wedge riving knife structure of lead bonding precision |
CN116000511B (en) * | 2022-12-26 | 2024-04-09 | 深圳市海志亿半导体工具有限公司 | Cutter head for enhancing fine-pitch wire feeding forming effect |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2615903B2 (en) * | 1988-09-09 | 1997-06-04 | 富士通株式会社 | Haze evaluation method for semiconductor wafer surface |
US5662261A (en) * | 1995-04-11 | 1997-09-02 | Micron Technology, Inc. | Wire bonding capillary |
TW418468B (en) * | 1997-12-19 | 2001-01-11 | Toto Ltd | Thin tube for wire connection |
US6715658B2 (en) * | 2001-07-17 | 2004-04-06 | Kulicke & Soffa Investments, Inc. | Ultra fine pitch capillary |
JP4129947B2 (en) | 2002-04-01 | 2008-08-06 | 臼井国際産業株式会社 | Adhesion method using capillary condensation effect |
JP3765778B2 (en) * | 2002-08-29 | 2006-04-12 | ローム株式会社 | Capillary for wire bonding and wire bonding method using the same |
US7407080B2 (en) | 2004-04-02 | 2008-08-05 | Chippac, Inc. | Wire bond capillary tip |
CH700833B1 (en) * | 2006-07-03 | 2010-10-29 | Kulicke & Soffa Ind Inc | Bonding tool with improved surface finish. |
US9831393B2 (en) * | 2010-07-30 | 2017-11-28 | Cree Hong Kong Limited | Water resistant surface mount device package |
JP5510691B2 (en) * | 2012-09-26 | 2014-06-04 | Toto株式会社 | Bonding capillary |
KR101482597B1 (en) * | 2012-09-26 | 2015-01-14 | 토토 가부시키가이샤 | Bonding capillary |
JP6064308B2 (en) * | 2015-07-03 | 2017-01-25 | Toto株式会社 | Bonding capillary |
-
2016
- 2016-02-03 JP JP2016018954A patent/JP6064308B2/en active Active
- 2016-06-30 TW TW105120680A patent/TW201701982A/en unknown
- 2016-07-01 CN CN201680038201.8A patent/CN107710394B/en active Active
- 2016-07-01 KR KR1020177037004A patent/KR101907906B1/en active IP Right Grant
- 2016-11-28 JP JP2016230148A patent/JP2017041657A/en active Pending
-
2017
- 2017-12-22 PH PH12017502415A patent/PH12017502415A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN107710394B (en) | 2020-05-19 |
JP2017041657A (en) | 2017-02-23 |
KR20180011249A (en) | 2018-01-31 |
PH12017502415A1 (en) | 2018-06-25 |
TWI562847B (en) | 2016-12-21 |
TW201701982A (en) | 2017-01-16 |
CN107710394A (en) | 2018-02-16 |
JP6064308B2 (en) | 2017-01-25 |
KR101907906B1 (en) | 2018-10-15 |
JP2017017306A (en) | 2017-01-19 |
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