CN107710394A - Weld chopper - Google Patents
Weld chopper Download PDFInfo
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- CN107710394A CN107710394A CN201680038201.8A CN201680038201A CN107710394A CN 107710394 A CN107710394 A CN 107710394A CN 201680038201 A CN201680038201 A CN 201680038201A CN 107710394 A CN107710394 A CN 107710394A
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- inclined plane
- filament
- chopper
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- welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/745—Apparatus for manufacturing wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
- H01L2224/78303—Shape of the pressing surface, e.g. tip or head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
- H01L2224/78305—Shape of other portions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
- H01L2224/78305—Shape of other portions
- H01L2224/78307—Shape of other portions outside the capillary
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The present invention provides a kind of welding chopper, possesses body, has：Reach through hole, break-through filament；1st press surface, the filament is pressed, have and be arranged on around the reach through hole and relative to direction and inclined 1st inclined plane existing for reach through hole extension；And the 2nd press surface, press the filament, with the tapered conical surface being arranged between the 1st inclined plane and the reach through hole, the 2nd inclined plane being arranged between the conical surface and the 1st inclined plane, it is characterized in that the square mean square root gradient of the roughness curve key element of the 2nd inclined plane is less than the square mean square root gradient of the roughness curve key element of the 1st inclined plane.
Description
Technical field
The form of the present invention relates generally to a kind of welding chopper.
Background technology
In the manufacturing process of semiconductor device, carry out connecting semiconductor element by welding wire (hereinafter referred to as " filament ")
The wire bond of part and lead frame.In wire bond, one end of filament is engaged in the electronic pads (first of semiconductor element with welding chopper
Secondary welding).Next haul filament and be engaged in lead (second of welding).When engaging filament, thin with welding chopper pressing
Additional ultrasonic wave in the state of silk.
For example, formed in being welded at second：This of filament and lead junction surface (stitch bonding socket part)；And filament is with drawing
The interim junction surface (buttock line weld part) of line.After such second is welded, cut from the filament of buttock line weld part extension
Disconnected (cut-out).Afterwards, the semiconductor element and lead frame connected by using sealing resin encapsulation by filament, partly leads so as to manufacture
Body device.
In recent years, semiconductor device made such as being used in vehicle-mounted electronic device under harsh temperature cycles environment
With.When semiconductor device is used under harsh temperature cycles environment, have because of the hot exapnsion difference between sealing resin and metal
There may be the problem of sealing resin is peeling-off, crackle.Therefore, in semiconductor device manufactured as above, it is desirable to higher
Environmental reliability (temperature cycle reliability).
In addition, in recent years, as the material of filament, widespread attempt uses the copper more inexpensive than gold.From metal and sealing
From the viewpoint of the adhesion of resin, when changing the material of filament, the material of sealing resin is also changed.But work as filament
During using copper, in order to meet the requirement to higher environmental reliability, it is desirable to further to improve.
On the other hand, for example propose using the method for being referred to as the lead frame for being roughened lead frame.In roughening lead
Formed with the relatively thickness coating comprising nickel etc. on the surface of framework, roughening processing is implemented on the surface of the coating.Due to table
Face is rougher, therefore can improve the adhesion of lead frame and sealing resin.
But if using such roughening lead frame, when weld for the second time, it will can include compared with hard copper
Filament press on thicker coating.Now, filament can be embedded in thicker coating, it is possible to reduce the engagement of filament and lead
Property.Moreover, after second is welded, the truncating of filament is deteriorated.If the truncating of filament is deteriorated, presence can occur to cut
The problem of bad (the peeling off bad) that junction surface can peel off during disconnected filament is such.Be additionally, since to the rougher coating in surface by
Pressure welding connects chopper, therefore welds chopper and easily wear away.The life-span of welding chopper is possible to be deteriorated.
Patent document 1：Japan spy table 2009-540624 publications
Patent document 2：The flat 2-163951 publications of Japanese Laid-Open
The content of the invention
The present invention be based on it is such the problem of understanding and carry out, technical problem to be solved is to provide a kind of welding
Chopper, it improves bond strength, improves the truncating of filament, can suppress to wear away.
1st invention is a kind of welding chopper, possesses body, has：Reach through hole, break-through filament；1st press surface, pressing
The filament, have be arranged on around the reach through hole and relative to direction existing for reach through hole extension and inclined the
1 inclined plane；And the 2nd press surface, the filament is pressed, has to be arranged between the 1st inclined plane and the reach through hole and is in
The conical surface of taper, the 2nd inclined plane being arranged between the conical surface and the 1st inclined plane, it is characterized in that, the described 2nd tilts
The square mean square root gradient of the roughness curve key element in face is less than square of the roughness curve key element of the 1st inclined plane
Mean square root gradient.
According to the welding chopper, when carrying out this engagement, filament can be pushed down by the 1st rougher inclined plane, can
Ensure the bond strength of stitch bonding socket part.Moreover, when being engaged temporarily, due to being pushed down carefully by the 2nd inclined plane, the conical surface
Silk, therefore the contact area for welding chopper and filament increases, it is possible to increase the bond strength of buttock line weld part.In addition, engaging
When blocking filament afterwards, produced because of the 1st inclined plane with larger square mean square root gradient on filament larger
Tensile force.On the other hand, by the 2nd inclined plane with compared with small square mean square root gradient, it is difficult to produce drawing on filament
Stretch.By the effect, blocking position in the filament near the border of the 1st inclined plane and the 2nd inclined plane, (such as filament is most
Thin part), stress is maximum.Therefore, small cracking is promoted, and the variant of small cracking is pattern I (openings
Pattern), cracking development.Thereby, it is possible to improve the truncating of filament.Moreover, with the square mean smaller than the 1st inclined plane
In 2nd inclined plane of square root gradient, disperseed in stress caused by pressing filament, can suppress to weld the abrasion of chopper.
2nd invention is a kind of welding chopper, it is characterized in that, in the 1st invention, the roughness curve of the 1st inclined plane
The square mean square root gradient of key element is more than 8 °, the square mean square of the roughness curve key element of the 2nd inclined plane
Root gradient is less than 5 °.
According to the welding chopper, because the square mean square root gradient of the 1st inclined plane is more than 8 °, therefore filament is blocked
When larger tensile force can be produced on filament by the 1st inclined plane.Further, since the square mean square of the 2nd inclined plane
Root gradient is less than 5 °, therefore less tensile force can be produced on filament by the 2nd inclined plane when blocking filament.Therefore,
The variant that the small cracking of position generation is blocked in filament is pattern I (opening pattern), cracking development.Thereby, it is possible to carry
The truncating of high filament.
3rd invention is a kind of welding chopper, it is characterized in that, in the 1st or the 2nd invention, the roughness of the 1st inclined plane
The square mean square root gradient of curve element is more than 11 °, the square mean of the roughness curve key element of the 2nd inclined plane
Square root gradient is less than 2 °.
According to the welding chopper, because the square mean square root gradient of the 1st inclined plane is more than 11 °, the 2nd inclined plane
Square mean square root gradient be less than 2 °, therefore even if welding chopper wear away, also easily by the 1st inclined plane square put down
The difference of the square mean square root gradient of mean square root gradient and the 2nd inclined plane is remained more than certain.Therefore, it is possible to suppress
1 inclined plane is to the reduction of tensile force caused by filament and the 2nd inclined plane to the difference of tensile force caused by filament.Thus, even if weldering
Connect chopper to wear away, the variant that the small cracking of position generation is blocked in filament is also pattern I, cracking development.So as to,
The truncating of filament can be improved.
4th invention is a kind of welding chopper, it is characterized in that, in the 1st~the 3rd any 1 invention, when along the axle
To during observation, the width of the 2nd inclined plane is more than 2%, less than the 8% of the external diameter of the 1st press surface.
According to the welding chopper, because when axially observing, the width of the 2nd inclined plane is the external diameter of the 1st press surface
More than 2%, therefore relative to the limit stress that wears away of raw material of welding chopper, can make welding the top of chopper
Caused maximum stress is lower.Thereby, it is possible to suppress the abrasion of welding chopper on larger width.It is additionally, since and works as along axle
To during observation, the width of the 2nd inclined plane is less than the 8% of the external diameter of press surface, therefore can produce and can obtain sufficient buttock line
The stress of the bond strength of weld part.
5th invention is a kind of welding chopper, it is characterized in that, in the 1st~the 4th any 1 invention, the described 1st tilts
The maximum height Rz in face is more than 0.2 micron, and the maximum height Rz of the 2nd inclined plane is less than 0.16 micron.
According to the welding chopper, because the maximum height Rz of the 1st inclined plane is more than 0.2 micron (μm), therefore can lead to
The 1st inclined plane pressing filament is crossed, so sufficient bond strength can be obtained.Further, since the maximum height Rz of the 2nd inclined plane
For less than 0.16 micron, therefore slip of the filament with welding chopper is promoted.Thereby, it is possible to improve the truncating of filament.By
This, it is bad can to suppress generation peeling.
6th invention is a kind of welding chopper, it is characterized in that, in the 1st~the 5th any 1 invention, the described 1st tilts
The maximum height Rz in face is more than 0.3 micron, and the maximum height Rz of the 2nd inclined plane is less than 0.10 micron.
According to the welding chopper, because the maximum height Rz of the 1st inclined plane is more than 0.3 micron, therefore even if welding is split
Knife is worn away, and can also be remained the maximum height Rz of the 1st inclined plane more than certain.Thus, even if welding chopper
Abrasion, also due to pressing filament by the 1st inclined plane, therefore sufficient bond strength can be obtained.In addition, even if welding chopper
Wear away, also due to the maximum height Rz of the 2nd inclined plane is less than 0.10 micron, therefore filament is with welding sliding for chopper
To promotion.Thereby, it is possible to improve the truncating of filament.
7th invention is a kind of welding chopper, it is characterized in that, in the 1st~the 6th any 1 invention, by perpendicular to described
The angle that the face of axial direction is formed with the 2nd inclined plane, less than by being tilted perpendicular to the axial face and the described 1st
The angle that face is formed.
According to the welding chopper, because filament is pushed down by the 2nd inclined plane during interim engagement, therefore buttock line welding can be improved
The bond strength in portion.
8th invention is a kind of welding chopper, it is characterized in that, in the 1st~the 7th any 1 invention, by perpendicular to described
The face of axial direction is less than 11 degree with the angle that the 2nd inclined plane is formed.
According to the welding chopper, by the angle by being formed perpendicular to the face of axial direction with the 2nd inclined plane is less than 11 degree,
Therefore the stress of the bond strength that sufficient buttock line weld part is can obtain during interim engagement being produced, (the 2nd press surface is pushed down carefully
The power of silk).
9th invention is a kind of welding chopper, it is characterized in that, in the 1st~the 8th any 1 invention, when along the axle
To during observation, the border of the 1st inclined plane and the 2nd inclined plane is serrated.
According to the welding chopper, because the border of the 1st inclined plane and the 2nd inclined plane is serrated, therefore during welding action
Stress is iteratively produced on filament.Thus, small cracking is easily produced on filament.Thus, it is possible to improve the truncating of filament, energy
It is bad that peeling occurs for enough suppression.
10th invention is a kind of welding chopper, it is characterized in that, in the 1st~the 9th any 1 invention, the described 1st tilts
The degree of bias in face is below -0.3, and the average height of the 1st inclined plane is more than 0.06 micron, less than 0.3 micron.
According to the welding chopper, can reduce with the change in shape worn away in use.Even if welding is repeated, also can
Reach the filament truncating for remaining initial for a long time and bond strength.
11st invention is a kind of welding chopper, it is characterized in that, in the 1st~the 10th any 1 invention, the described 2nd inclines
The kurtosis on inclined-plane is less than 5.0.
According to the welding chopper, because the kurtosis of the 2nd inclined plane is less than 5.0, therefore the slip of filament and welding chopper
It is promoted, it is possible to increase the truncating of filament.
Brief description of the drawings
Fig. 1 is the ideograph for illustrating the welding chopper involved by present embodiment.
Fig. 2 is the medelling enlarged drawing on the top for illustrating the welding chopper involved by present embodiment.
Fig. 3 is the medelling enlarged drawing on the top for illustrating the welding chopper involved by present embodiment.
Fig. 4 (a) and Fig. 4 (b) is the medelling sectional view on the top for illustrating the welding chopper involved by present embodiment.
Fig. 5 is the medelling sectional view on the top for illustrating the welding chopper involved by present embodiment.
Fig. 6 is the medelling sectional view for illustrating wire bond state.
Fig. 7 (a) and Fig. 7 (b) is the photograph for illustrating welding wire and lead.
Fig. 8 (a) and Fig. 8 (b) is to illustrate the ideograph that the filament of the welding chopper involved by present embodiment blocks.
Fig. 9 is the figure for the evaluation result for illustrating welding chopper.
Figure 10 is the figure for the evaluation result for illustrating welding chopper.
Figure 11 is the figure for the evaluation result for illustrating welding chopper.
Figure 12 is the figure for the evaluation result for illustrating welding chopper.
Figure 13 (a) and Figure 13 (b) is the figure on the top for illustrating the welding chopper involved by present embodiment.
Figure 14 is the figure for the evaluation result for illustrating welding chopper.
Figure 15 is the figure for the evaluation result for illustrating welding chopper.
Symbol description
10- bodies；11- cylindrical portions；12- conus portions；13- neck parts；20- reach through holes；20a- central shafts；21- tapered holes；
The linear holes of 22-；The press surfaces of 51- the 1st；The inclined planes of 51- the 1st；The press surfaces of 52- the 2nd；The inclined planes of 52f- the 2nd；The 52t- conical surfaces；
110- welds chopper；200- leads；A, B, C, D- region；B1- borders；F1, F11, F12, F2, F21, F22- vector；BW- is thin
Silk；Cr- imaginary circles；Da- axial directions；Dc- is circumferential；D1- external diameters；D2- internal diameters；P1- faces；SB- stitch bonding socket parts；TB- buttock lines weld
Socket part；T- top end diameters；W1- width；θ 1~6- angles
Embodiment
Hereinafter, embodiments of the present invention are illustrated referring to the drawings.Also, in the drawings, to same composition
Key element marks identical symbol and appropriate detailed description will be omitted.
Embodiment
Fig. 1 is the ideograph for illustrating the welding chopper involved by present embodiment.
Fig. 2 is the medelling enlarged drawing for the end shape for illustrating the welding chopper involved by present embodiment.
The entirety of welding chopper 110 is shown in Fig. 1.The figure of the region A shown in enlarged drawing 1 is shown in Fig. 2.
As shown in figure 1, welding chopper (following, otherwise referred to as " chopper ") 110 has body 10.Body 10 is cylinder
Shape component, there is reach through hole 20.Reach through hole 20 is the through hole existing for extension on the axial Da of body 10.Using chopper
When, the filament break-through reach through hole 20.
It is provided with body 10：Cylindrical portion 11；Conus portion 12, it is arranged on the tip side of cylindrical portion 11；And neck part 13,
It is arranged on the tip side of conus portion 12.Reach through hole 20 is disposed through above-mentioned cylindrical portion 11, conus portion 12 and neck part 13.
Also, in present specification, tip side or top orientation refer to from the end of the side of cylindrical portion 11 towards bottleneck
The direction of the end of the side of portion 13.The top of chopper (body) refers to the end of the side of neck part 13.
Cylindrical portion 11 has the diameter for being used for that the mechanicalness of chopper 110 to be fixed on to welder.
The diameter of conus portion 12 is adjoint to diminish towards tip side.Conus portion 12 is for example with truncated cone shape.Conus portion
The diameter of the end of 12 side of cylindrical portion 11 is approximately equal to the diameter of cylindrical portion 11.
The diameter of neck part 13 is less than the diameter of conus portion 12.For example, the diameter of neck part 13 is gradual along top orientation
Diminish.By reducing the diameter of neck part 13, assigned position is carried out so as to avoid wired adjacent filament
Wire bond.
Also, chopper 110 is for example formed by ceramics.As the material of chopper 110, such as aluminum oxide etc. can be used.Or
Person, as the material of chopper 110, it can also use comprising at least any one compound in aluminum oxide, zirconium oxide and chromium oxide
Material etc..
Fig. 3 is the medelling enlarged drawing on the top for illustrating the welding chopper involved by present embodiment.Fig. 3 is from obliquely downward
Observe the stereogram on the chopper top shown in Fig. 2.
As shown in figure 3, body 10 is arranged on axial end, there is the 1st press surface 51 and the 2nd press surface 52.
1st press surface 51 is arranged at around reach through hole 20 on the top of body 10.1st press surface 51 is neck part 13
The part on surface, such as shape in curved surface.
2nd press surface 52 is arranged between the press surface 51 of reach through hole 20 and the 1st.2nd press surface 52 is the surface of neck part 13
A part, be and 51 continuous face of the 1st press surface.
As described later, the 1st press surface 51 and the 2nd press surface 52 are the faces that filament is pressed on to lead frame in wire bond.Example
Such as, the 1st press surface 51 is the press surface to form this engagement, and the 2nd press surface 52 is to form the press surface engaged temporarily.
The shape of the 1st press surface 51 and the 2nd press surface 52 is further described.
Fig. 4 (a), Fig. 4 (b) and Fig. 5 are the medelling sectional views on the top for illustrating the welding chopper involved by present embodiment.
Fig. 4 (a) represents the section on the A1-A2 lines shown in Fig. 3.That is, Fig. 4 (a) is represented on the plane parallel to axial Da
Section.Fig. 4 (b) illustrates the section of the region B shown in enlarged drawing 4 (a).
As shown in Fig. 4 (b), reach through hole 20 has tapered hole 21 and linear hole 22.Tapered hole 21 is arranged on linear hole
22 tip side, it is connected to linear hole 22.The diameter of tapered hole 21 becomes big with towards tip side.
1st press surface 51 has the 1st inclined plane 51s being arranged on around reach through hole 20.1st inclined plane 51s is relative to axle
To Da and radial direction (perpendicular to axial Da direction) run-off the straight.Moreover, the 1st inclined plane 51s diameter is adjoint towards body
10 tip side and diminish.That is, the distance between central shaft 20a and the 1st inclined plane 51s of reach through hole 20 become along top orientation
It is short.In this example embodiment, both can be in straight although the cross sectional shape of the 1st inclined plane 51s in Fig. 4 (b) includes curved portion
Wire, it can also be made up of straight line and curve.
2nd press surface 52 has conical surface 52t and the 2nd inclined plane 52f.
Conical surface 52t is arranged at around reach through hole 20 between the 1st inclined plane 51s and reach through hole 20.Conical surface 52t is the 2nd press surface
The part towards tapered hole 21 in 52.Conical surface 52t has the taper towards top extension.That is, the central shaft 20a of reach through hole 20
The distance between conical surface 52t is elongated along top orientation.
2nd inclined plane 52f is arranged between conical surface 52t and the 1st inclined plane 51s.2nd inclined plane 52f be with conical surface 52t,
The 1st continuous faces of inclined plane 51s, positioned at the top side of neck part 13.In this example embodiment, the 2nd inclined plane 52f along perpendicular to
(θ 1=0 ° i.e. described later) be present in axial Da plane extension.But the 2nd inclined plane 52f can also be from perpendicular to axial Da's
Plane is slightly tilted (＞ 0 of θ 1).
In present embodiment, the surface of the 1st press surface 51 is formed as more more coarse than the surface of the 2nd press surface 52.That is, the 2nd
Inclined plane 52f and conical surface 52t are more smooth than the 1st inclined plane 51s.The concaveconvex shape on the 2nd inclined plane 52f surface tilts than the 1st
The concaveconvex shape on face 51s surface is smaller, the concave-convex on the surface of the concaveconvex shape than the 1st inclined plane 51s on conical surface 52t surface
Shape is smaller.Specifically, (R Δs q) is less than the 1st to the square mean square root gradient of the 2nd inclined plane 52f roughness curve key element
Square mean square root gradient (the R Δs q) of inclined plane 51s roughness curve key element.In addition, for example, conical surface 52t roughness
The square mean square root gradient (square mean of roughness curve key elements of the R Δs q) less than the 1st inclined plane 51s of curve element
Square root gradient (R Δs q).Roughness curve key element square mean square root gradient (R Δs q) represent surface concaveconvex shape,
Correspond to the parameter of the gradient size of bumps.
Fig. 5 illustrates the section of further enlarged drawing 4 (b).In the example as shown in fig. 5, the 2nd inclined plane 52f diameter companion
Diminish with the tip side towards body 10.That is, the distance between central shaft 20a and the 2nd inclined plane 52f of reach through hole 20 edge
Top orientation to shorten.For example, conical surface 52t and the 2nd inclined plane 52f intersection point (intersection) is located at the top of body 10.
As shown in figure 5, angle, θ 1 is less than angle, θ 2.Here, angle, θ 1 is by being tilted perpendicular to axial Da face P1 and the 2nd
The angle that face 52f is formed.Angle, θ 2 is the angle formed by the face P1 perpendicular to axial Da and the 1st inclined plane.Preferred angle
It is more than 0 degree, less than 11 degree to spend θ 1.Optimized angle θ 2 is, for example, more than 2 degree, less than 45 degree.
Next, to being illustrated using the engagement (second of welding) for welding chopper.
Fig. 6 is the medelling sectional view for illustrating wire bond state.
The filament BW of the reach through hole 20 of break-through chopper 110 is welded in electrode of semiconductor element (not shown) etc. for the first time.It
Afterwards, chopper 110 is pulled on lead 200 by regulation track and forms annular filament BW.It is engaged in next, entering to be about to filament BW
Second of welding of lead 200.The lead 200 of bonding wire framework and filament BW second of welded condition are shown in Fig. 6.
The lead frame used in present embodiment is, for example, to be roughened lead frame.That is, set on the surface of lead 200
There is thicker Ni coating for implementing roughening processing etc..The thickness of coating is, for example, 20 μm or so.In addition, as filament BW materials
Material is for example using copper.
During second is welded, chopper 110 is pressed on lead 200.Thus, filament BW is sandwiched in the 1st press surface 51
(the 1st inclined plane 51s) is between lead 200.Moreover, filament BW is sandwiched between the 2nd press surface 52 and lead 200.
Because the 1st inclined plane 51s tilts towards the 2nd inclined plane 52f, therefore the 1st inclined plane 51s and lead 200 interval
Narrow along towards the direction of the inner side of chopper 110.So as to the thickness for the filament BW being clipped between the 1st inclined plane 51s and lead 200
Degree is thinning along the direction towards the inner side of chopper 110.
Moreover, filament BW thickness is most thin between the 2nd inclined plane 52f and lead 200.Because conical surface 52t has taper,
Therefore conical surface 52t and lead 200 interval broaden along towards the direction of the inner side of chopper 110.So as to be clipped in conical surface 52t with drawing
The thickness of filament BW between line 200 is thickening along the direction towards the inner side of chopper 110.
So, in the state of fine rule BW is clipped between chopper 110 and lead 200, for example additional ultrasound of broadsword v.broadsword 110
Ripple.Thus, filament BW is crimped on lead 200.This is formed between lead 200 in the 1st press surface 51 (the 1st inclined plane 51s)
Junction surface (stitch bonding socket part SB), formed in the 2nd press surface 52 (the 2nd inclined plane 52f and conical surface 52t) between lead 200
Interim junction surface (buttock line weld part TB).
After filament BW is crimped, chopper 110 is set to increase in the state of filament BW is clamped with chopper 110.Thus, filament
BW blocks from buttock line weld part TB.For example, cutting edge of a knife or a sword compared with being formed as due to the 2nd inclined plane 52f with conical surface 52t intersection point (intersection)
Profit, therefore filament BW is blocked at the part pressed by the intersection point.
Fig. 7 (a) and Fig. 7 (b) is the photograph for illustrating welding wire and lead 200.Enlarged representation is carried out in Fig. 7 (a) and Fig. 7 (b)
Junction surface after second of welding.
As shown in Fig. 7 (a), after using the welding of second of the chopper 110 involved by present embodiment, filament BW connects
Together in lead 200, blocked from buttock line weld part TB.
In such second is welded, when using lead frame is roughened, the filament when chopper is pressed on into lead
Easily embedded lead.Therefore, it is possible to bond strength is deteriorated and the truncating of filament variation.
Fig. 7 (b) illustrates the unfavorable condition occurred when the truncating of filament is deteriorated.When the truncating of filament is deteriorated, such as
Region C shown in Fig. 7 (b), when blocking filament, the part of junction surface (such as stitch bonding socket part SB) is peeled off and is possible to
Generation peeling and referred to as fish tail shape weld bad.
On the other hand, in the chopper 110 involved by present embodiment, the top of chopper 110 is provided with rougher surface shape
1st inclined plane 51s of state.Therefore, it is possible to which filament BW efficiently is pressed in into lead 200 by the 1st inclined plane 51s.So as to energy
Enough ensure stitch bonding socket part SB bond strength.
In addition, in the chopper 110 involved by present embodiment, the top of chopper 110 is provided with the 2nd smooth inclined plane
52f and conical surface 52t.Filament BW is pressed in lead 200 by such 2nd inclined plane 52f and conical surface 52t.Therefore, with being not provided with
2nd inclined plane 52f situation is compared, and chopper 110 and filament BW contact area increases, it is possible to increase buttock line weld part TB's connects
Close intensity.
In addition, when blocking filament after splicing, filament BW is pushed down by the 1st rougher inclined plane 51s, by smooth
The 2nd inclined plane 52f promote filament BW and chopper 110 slip.Thereby, it is possible to improve the truncating of filament.
Fig. 8 (a) and Fig. 8 (b) is to illustrate the ideograph that the filament of the welding chopper involved by present embodiment blocks.
Fig. 8 (a) is the concept map that chopper when explanation blocks filament acts on.Shown in Fig. 8 (a) in the 1st inclined plane 51s and
The amplification section of the contact area of chopper 110 and filament BW near 2 inclined plane 52f border.The region is equivalent to filament BW
Filament block the i.e. most thin filament BW part in position.
The left side of chopper 110 in figure corresponds to the 1st inclined plane with larger R Δs q (square mean square root gradient)
51s, right side correspond to the 2nd inclined plane 52f with smaller R Δs q.Represent the bigger sides of R Δs q of concaveconvex shape relative to
The bigger situation of the concavo-convex gradients of filament surfaces.That is, for example, the angle, θ 3 shown in Fig. 8 (a) is more than angle, θ 4.
When blocking filament BW, the additional ultrasonic wave in the state of chopper 110 shown in such as Fig. 8 (a) contacts filament BW.By
This, the applying power of broadsword v.broadsword 110.For example, to the power (vector F 1) of the 1st additional horizontal directions of inclined plane 51s, to the 2nd inclined plane 52f
The power (vector F 2) of additional horizontal direction.Here, for convenience of description, the size of vector F 1 and direction are same as the big of vector F 2
Small and direction.
For example, vector F 2 can be decomposed into vector F 21 and vector F 22.Vector F 21 is along to the 2nd inclined plane 52f surfaces
Direction vector.Vector F 22 is perpendicular to the vector in the direction of vector F 21.Here, R Δs q is smaller, then vector F 21 is bigger.
That is, R Δs q is smaller, then as vector F 21, composition upward are bigger.Therefore, it is delivered to filament BW's from the surface of chopper 110
Power diminishes.So as to smaller to tensile force FT2 caused by filament BW as the less 2nd inclined plane 52f of R Δs q.
Equally, vector F 1 can be decomposed into vector F 11 and vector F 12.Vector F 11 is along to the 1st inclined plane 51s surfaces
Direction vector.Vector F 12 is perpendicular to the vector in the direction of vector F 11.On 1st inclined plane 51s, because R Δs q is larger,
Therefore such as vector F 11, the composition for being inclined to top is smaller.Therefore, as the 1st larger R Δs q inclined plane 51s to caused by filament BW
Tensile force FT1 is bigger.
In the chopper 110 involved by present embodiment, the 1st larger inclined planes of R Δs q are provided with adjacent manner
The 51s and less 2nd inclined plane 52f of R Δs q.Therefore, it is thin near the 1st inclined plane 51s and the 2nd inclined plane 52f border
Silk blocks position, and larger stress is produced because of tensile force FT1 and tensile force FT2 difference.Therefore, as shown in Fig. 8 (a), the 1st
Near inclined plane 51s and the 2nd inclined plane 52f border, promote the generation of small cracking.Moreover, in the small cracking occurred
In, the variant of small cracking is the pattern I (opening pattern) as shown in Fig. 8 (b).Thus, such as Fig. 8 (a) region D, tortoise
Split development, it is possible to increase the truncating of filament.As a result, it is bad to suppress generation peeling etc..
Further, since roughening lead frame surface it is relatively rough, therefore because of the pressing of chopper and chopper top is easy
Abrasion.On the other hand, the surface that the 2nd inclined plane 52f is disposed relative to lead 200 is almost parallel.Further, since the 2nd inclined plane 52f
R Δs q it is smaller, therefore as shown in Fig. 8 (a), the top angle θ 5 of the 2nd inclined plane 52f convex portion is larger.For example, top angle θ 5 is big
Top angle θ 6 in the 1st inclined plane 51s convex portion.Therefore, it is possible to suppress stress concentration on the top of chopper 110, can suppress
The abrasion of chopper.
Hereinafter, with reference to the evaluation result on welding chopper, the embodiment of the chopper 110 involved by present embodiment is entered
Row explanation.
Also, in present specification, chopper surface is calculated according to JIS (Japanese Industrial Standards) B 0601-2001
Concaveconvex shape (R Δs q, Rz, Rc, Rsk, Rp, Rku etc.).In addition, in each evaluation, roughness curve is determined by following condition.
Concaveconvex shape is calculated by the measurement result of roughness curve.
Determining instrument：Laser microscope (Japanese Olympus company system, OLS4000)
Determine multiplying power：50 times
Evaluation length：125 μm~400 μm
End (phase compensation type high-pass filter) λ c：25μm
Fig. 9 is the figure for the evaluation result for illustrating welding chopper.
Fig. 9 represents the square mean square root gradient R Δ q (°) and the 2nd inclined plane of the 1st inclined plane 51s roughness curve key element
Example (comparative example 1~4, the reality of the square mean square root gradient R Δ q (°) of 52f roughness curve key element various combination
Apply example 1~8) evaluation result.In this evaluation, the 1st inclined plane 51s R Δs q is made 5.4 °~12.4 °.In addition, the 2nd is inclined
Inclined-plane 52f R Δs q makes 1.8 °~13.4 °.Also, conical surface 52t R Δs q is made into the R Δ q phases with the 2nd inclined plane 52f
Together.
Further, it is possible to the square mean square root gradient R Δs q of roughness curve key element is calculated according to following formula (1).l
It is datum length, Z (x) is height value on roughness curve.
Formula 1
Fig. 9 represents to peel off the evaluation result of bad occurrence frequency.Here, " peeling occurrence frequency " this project represents to weld for second
Peeling occurrence frequency afterwards.On the comparative example 1~4 and embodiment 1~8 shown in Fig. 9, sample size is made 32 respectively
Or 128."×" represents to be peeled off in 32 samples.That is, the occurrence frequency that "×" represents to peel off is more than 1/32.“○”
Although expression is not peeled off in 32 samples, if increase sample size, then peel off."○" represents what is peeled off
Occurrence frequency is more than 1/127, less than 1/32." ◎ " represents not peel off in 128 samples.That is, " ◎ " represents what is peeled off
Occurrence frequency is less than 1/128.
Such as comparative example 1~3, it is known that following situation, as the 1st inclined plane 51s R Δs q and the 2nd inclined plane 52f R Δs q
Simultaneously bigger or hour, easily peel off.
On the other hand, such as embodiment 1~8, when the 1st inclined plane 51s R Δs q is more than 8 ° and the 2nd inclined plane 52f R Δs q is
At less than 5 °, the occurrence frequency of peeling is relatively low.In addition, such as embodiment 7,8, when the 1st inclined plane 51s R Δs q for more than 11 ° and
When 2nd inclined plane 52f R Δs q is less than 2 °, it can further suppress peeling.Why so to think, be because as closed
In Fig. 8 (a) and Fig. 8 (b) explanation, the 1st inclined plane 51s tensile force is larger and the 2nd inclined plane 52f tensile force is smaller.
Filament blocks position, and small cracking is promoted, and the variant of small cracking is pattern I (opening pattern), cracking
Development.Thus, the truncating of filament is improved.
In addition, when the 1st inclined plane 51s R Δs q is more than 11 ° and the 2nd inclined plane 52f R Δs q is below 2 °, even if
Welding chopper is worn away, and also easily remains the 1st inclined plane 51s R Δs q and the 2nd inclined plane 52f R Δs q difference necessarily
More than.Therefore, it is possible to keep because of the difference of tensile force and on filament BW caused by stress.
Figure 10 is the figure for the evaluation result for illustrating welding chopper.
Figure 10 is to represent commenting when the 2nd inclined plane 52f of the top end diameter T relative to chopper 110 width W1 changes
The figure of valency result.
Here, the 2nd inclined plane 52f width W1 is the width of the 2nd inclined plane 52f when axially observing chopper 110
Degree.When axially observing, the 2nd inclined plane 52f be shaped as having outer diameter D 1 and internal diameter D2 ring-type (reference picture 4 (a) and
Fig. 4 (b)).Now, width W1 is 1/2 times of outer diameter D 1 and internal diameter D2 difference.Also, when external diameter circumferentially changes,
Circumferential average value can also be used as outer diameter D 1.When internal diameter circumferentially changes, can also make as internal diameter D2
With the average value of circumference.
When axially observing, the top end diameter T of chopper 110 is the 1st inclined plane 51s (the 1st press surface 51) of ring-type
External diameter.Specifically, for example, the elongated surfaces that the 1st inclined plane 51s external diameter is the outer peripheral face of neck part 13 tilt with including the 2nd
The diameter (reference picture 4 (a) and Fig. 4 (b)) for the imaginary circle Cr that face 52f plane occurs to intersect and formed.
Figure 10 represents to peel off the evaluation result of bad occurrence frequency.Here, " peeling occurrence frequency " this project represents second
Peeling occurrence frequency after secondary welding.In this evaluation, the ratio on the width W1 relative to top end diameter T shown in Figure 10
Rate, sample size is made 32 respectively."○" represents not peel off.That is, the occurrence frequency that "○" represents to peel off is less than 1/
32."×" represents to be peeled off.That is, the occurrence frequency that "×" represents to peel off is more than 1/32.Also, used in evaluating straight
Footpath is 25 μm of filament.In addition, the top end diameter T of chopper 110 is 75 μm.
It was found from evaluation result as shown in from Figure 10, when the width W1 relative to top end diameter T ratio for more than 2%,
When less than 8%, do not peel off.That is, preferably the 2nd inclined plane 52f width W1 be top end diameter T more than 2%, 8% with
Under.When the width W1 ratio relative to top end diameter T is more than 8%, it is difficult to sufficient stress is produced on the top of chopper 110,
Bond strength reduces.On the other hand, when the width W1 ratio relative to top end diameter T is less than 2%, the production of the top of chopper 110
Raw stress is larger, and the top of chopper 110 is easily worn away.In embodiment, by the ratio relative to top end diameter T for making width W1
Example is more than 2%, less than 8%, so as to obtain sufficient bond strength while the abrasion of chopper 110 are suppressed.
Figure 11 is the figure for the evaluation result for illustrating welding chopper.
Figure 11 represents the example of the 1st inclined plane 51s maximum height Rz and the 2nd inclined plane 52f maximum height Rz various combination
The evaluation result of sub (comparative example 5~9, embodiment 9~14).Also, conical surface 52t maximum height Rz is made and tilted with the 2nd
Face 52f maximum height Rz is identical.Maximum height Rz is the maximum of the peak height on the datum length maximum sum deep with paddy.
Figure 11 represents to peel off the evaluation result of bad occurrence frequency.It is same with the explanation in Fig. 9, " peeling occurrence frequency " this
Project represents the peeling occurrence frequency after welding second.That is, in each example (each condition), " ◎ " is represented in 128 samples
Do not peel off, "○" represents not peel off in 32 samples, and "×" represents to be peeled off in 32 samples.
It was found from evaluation result as shown in from Figure 11, when the maximum height Rz on the 1st inclined plane 51s be more than 0.2 μm and
When maximum height Rz on 2nd inclined plane 52f is less than 0.16 μm, peeling occurrence frequency is "○".Moreover, such as embodiment 13,
14, when the 1st inclined plane 51s maximum height Rz be more than 0.3 μm and the 2nd inclined plane 52f maximum height Rz be 0.10 μm with
When lower, it is " ◎ " to peel off occurrence frequency.
Because the 1st inclined plane 51s maximum height Rz is more than 0.2 μm, therefore it can suppress thin with the 1st inclined plane 51s
Silk BW, so sufficient bond strength can be obtained.Further, since the 2nd inclined plane 52f maximum height Rz and conical surface 52t
Maximum height Rz is respectively less than 0.16 μm, therefore slips of the filament BW with welding chopper is promoted.It is thin thereby, it is possible to improve
Silk BW truncating.It is bad thereby, it is possible to suppress generation peeling.In addition, when the 1st inclined plane 51s maximum height Rz is 0.3 μm
Above and the 2nd inclined plane 52f maximum height Rz be less than 0.10 μm when, even if chopper is worn away, also can will maximum height
Degree Rz is remained more than certain.Thus, such as the above, it is possible to increase the truncating of filament.
Figure 12 is the figure for the evaluation result for illustrating welding chopper.
Figure 12 represents the evaluation result when changing the 2nd inclined plane 52f angle, θ 1 (reference picture 5).In this evaluation, by angle, θ 1
Make more than 0.5 degree, less than 17 degree.In addition, the angle, θ 2 of the 1st inclined plane is made 20 degree, by the 2nd inclined plane 52f width
W1 makes 4 μm.
Same with the explanation in Fig. 9, Figure 12 " peeling occurrence frequency " this project represents the peeling after welding second
Occurrence frequency.That is, when being evaluated the sample size of each condition of angle, θ 1 is made into 32, "○" represents not shell
Fall, "×" represents to be peeled off.
Optimized angle θ 1 is less than angle, θ 2.The 2nd inclined plane 52f can push down filament when thus, due to interim engagement, therefore
The bond strength of buttock line weld part can be improved.In addition, it was found from evaluation result as shown in from Figure 12, when angle, θ 1 is 0.5 degree
More than, less than 11 degree when, do not peel off bad.If angle, θ 1 is less than 11 degree, can incline temporarily during engagement by the 2nd
Inclined-plane 52f pushes down filament.Thereby, it is possible to produce the stress for the bond strength that can obtain sufficient buttock line weld part.Thus, it is possible to
It is bad to suppress generation peeling.
Figure 13 (a) and Figure 13 (b) is the figure of the welding chopper involved by illustrated embodiment.
Figure 13 (a) and Figure 13 (b) represents that (the 1st press surface the 51 and the 2nd presses on the top of axially observation welding chopper 110
Face 52) when situation.Figure 13 (a) is laser microscope image, and Figure 13 (b) corresponds to Figure 13 (a) top view.
As shown in Figure 13 (b), the 1st inclined plane 51s and the 2nd inclined plane 52f boundary B 1 be, for example, using central shaft 20a in
The circular of the heart.But when axially observing, the shape of boundary B 1 is not proper circle (or oval), but sawtooth
Shape (zigzag, hackle mark).That is, the distance L1 from central shaft 20a untill the point in boundary B 1, circumferentially Dc become
Change.Specifically, the point in boundary B 1 from approximate (or smoothing) in the shape of boundary B 1 such as 1.5 μm of circle (or oval) with
Disperse to exist in interior scope.
Explanation such as on Fig. 8 (a) and Fig. 8 (b), filament BW is on contact the 1st inclined plane 51s and the 2nd inclined plane 52f side
Near boundary B1, the larger stress from chopper is born.Moreover, such as Figure 13 (a) and Figure 13 (b), because boundary B 1 is serrated,
Therefore boundary B 1 further contacts filament BW.That is, the boundary B 1 and filament BW contact portion of larger stress are produced to filament BW
Increase.Thus, such as in additional ultrasonic wave, stress is iteratively produced on filament BW.Thus, small cracking easily occurs, can
Improve the truncating of filament.
Figure 14 is the figure for the evaluation result for illustrating welding chopper.
Figure 14 is represented in the different example of the 1st inclined plane 51s concaveconvex shape (comparative example 10~12, embodiment 15~20)
The result of determination of bond strength.In the evaluation, the 1st inclined plane 51s is in concaveconvex shape, the average height of roughness curve key element
The maximum peak height Rp of Rc, the degree of bias Rsk of roughness curve and roughness curve changes.
By obtaining average height Rc with following formula (2).By obtaining degree of bias Rsk with following formula (3).
Formula 2
Formula 3
In formula (2), m is the quantity of contour curve key element, and Zti is the average value of the height of contour curve key element.Formula (3)
In, Zq is square mean square root height, and Zn is the height value on roughness curve.Maximum peak height Rp is on roughness curve
The maximum of height.
Degree of bias Rsk represents the peak (convex) of concaveconvex shape and the symmetry of paddy (recessed).If concaveconvex shape is Sine distribution,
Degree of bias Rsk turns into 0.Negative degree of bias Rsk represents to be more than the area of paddy (recessed) by the area of peak (convex) that (sharpness of convex portion is less than recess
Sharpness).
Average height Rc, the degree of bias Rsk in each example (each condition) and maximum peak height Rp are shown in Figure 14.The evaluation
In, bond strength determined according to the process capability index Cp k of bond strength.In each example shown in Figure 14, work as filament
When BW average splice intensity is Ave, the lower limit standard of bond strength is 3 grammes per square metres (gf), by Cpk=(Ave-3gf)/3 σ come
Calculated.Bond strength is the intensity of the tensile test in the second welding.Sample size is 30.In general, it is desirable to silk
The Cpk of bond strength in weldering is more than 1.67.
In Figure 14 " bond strength judgement " this project, represented when Cpk is more than 1.67 with "Yes", when Cpk is less than
Represented when 1.67 with "No".In each example (Rc, Rsk and Rp each combination), 500,000 times, 1,000,000 times and 1,500,000 times silks are initially at
Judged after weldering.
In embodiment 15~20 and comparative example 10~12, it is all "Yes" that initial bond strength, which judges,.At 500,000 times
After wire bond, although embodiment 15~20 is "Yes", comparative example 10~12 is all "No".After 1,000,000 wire bonds,
Embodiment 15~17,19 and 20 is "Yes", and embodiment 18 and comparative example 10~12 are "No".After 1,500,000 wire bonds, implement
Example 19 and 20 is "Yes", and embodiment 15~18 and comparative example 10~12 are "No".
Drawn from result above, preferably the 1st inclined plane 51s degree of bias Rsk is more than about -1.2, below -0.3, and the 1st inclines
Inclined-plane 51s average height Rc is more than 0.06 μm, less than 0.3 μm.If average height Rc be less than 0.06 μm, clamping force compared with
It is small, especially it can not obtain sufficient bond strength when using the filament BW of copper cash.In addition, if average height Rc is more than 0.3 μ
M, then it is difficult to be formed as degree of bias Rsk and the bumps below -0.3.In addition, the degree of bias Rsk of more preferably top end face 50 is about -1.2
Above, below -0.43, and the average height Rc of top end face 50 is more than 0.16 μm, less than 0.3 μm.Thus, initially opened from welding
Begin that after 1,500,000 times initial bond strength can also be maintained.
Additionally, it is preferred that the 1st inclined plane 51s maximum peak height Rp is average height Rc less than 0.9 times (Rp/Rc≤0.9).
In addition, Rp/Rc can be more than 0.5 times.When Rp/Rc is more than 0.9, it is difficult to maintain initial bond strength for a long time.The opposing party
Face, when Rp/Rc is less than 0.9, with the abrasion in use, caused change in shape is less, can remain initial for a long time
Bond strength.
Figure 15 is the figure for the evaluation result for illustrating welding chopper.
Figure 15 represents different example (comparative example 13,14, the embodiments 21 of the kurtosis Rku of the 2nd inclined plane 52f roughness curve
~23) evaluation result.By obtaining kurtosis Rku with following formula (4).
Formula 4
Rq is the square mean square root height of roughness curve, and lr is datum length, and Z (x) is the roughness curve (height at peak
Degree).That is, kurtosis (Rku) is to multiply average value with four of the Z (x) on the subduplicate four multiplication and division datum length of square mean.Kurtosis
Rku represents " sharpness " of roughness curve.Rku is bigger, then the bumps in face are more sharp.
Same with the explanation in Fig. 9, Figure 15 " peeling occurrence frequency " this project represents the peeling after welding second
Occurrence frequency.That is, when the sample size of each example is evaluated as 32, "○" represents not peel off, "×"
Expression is peeled off.
Obtained from Figure 15 result, preferably the 2nd inclined plane 52f kurtosis Rku is less than 5.0, more preferably less than 3.0.By
In the 2nd inclined plane 52f kurtosis Rku be less than 5 μm, therefore when blocking filament, filament BW and the 2nd inclined plane 52f slip
It is promoted.Thereby, it is possible to improve the truncating of filament.
More than, embodiments of the present invention are illustrated.But the invention is not limited in these describe content.
As long as possessing the feature of the present invention, then those skilled in the art are subject to the technology of appropriately designed change to above-mentioned embodiment and also wrapped
Containing within the scope of the invention.For example, the shape of each key element of possessed such as reach through hole, the 1st press surface and the 2nd press surface, chi
Very little, material, configuration, set-up mode etc., it is not limited to the content of illustration, but can suitably be changed.As long as in addition, technology
It is upper feasible, then foregoing each each key element of embodiment possessed can be combined, as long as including the feature of the present invention, combination
These technology is also contained in the scope of the present invention.
According to the form of the present invention, using the teaching of the invention it is possible to provide one kind welding chopper, it improves bond strength, improves blocking for filament
Property, it can suppress to wear away.
Claims (11)
1. one kind welding chopper, possesses body, has：
Reach through hole, break-through filament；
1st press surface, the filament is pressed, have and be arranged on around the reach through hole and deposited relative to reach through hole extension
Axial direction and inclined 1st inclined plane；
And the 2nd press surface, press the filament, have be arranged on it is tapered between the 1st inclined plane and the reach through hole
The conical surface, the 2nd inclined plane that is arranged between the conical surface and the 1st inclined plane, it is characterized in that,
The square mean square root gradient of the roughness curve key element of 2nd inclined plane is less than the coarse of the 1st inclined plane
Write music the square mean square root gradient of line feature.
2. welding chopper according to claim 1, it is characterized in that,
The square mean square root gradient of the roughness curve key element of 1st inclined plane is more than 8 °,
The square mean square root gradient of the roughness curve key element of 2nd inclined plane is less than 5 °.
3. welding chopper according to claim 1 or 2, it is characterized in that,
The square mean square root gradient of the roughness curve key element of 1st inclined plane is more than 11 °,
The square mean square root gradient of the roughness curve key element of 2nd inclined plane is less than 2 °.
4. according to the welding chopper described in any 1 in claims 1 to 3, it is characterized in that, when along the end on observation,
The width of 2nd inclined plane is more than 2%, less than the 8% of the external diameter of the 1st press surface.
5. according to the welding chopper described in any 1 in Claims 1 to 4, it is characterized in that,
The maximum height Rz of 1st inclined plane is more than 0.2 micron,
The maximum height Rz of 2nd inclined plane is less than 0.16 micron.
6. according to the welding chopper described in any 1 in Claims 1 to 5, it is characterized in that,
The maximum height Rz of 1st inclined plane is more than 0.3 micron,
The maximum height Rz of 2nd inclined plane is less than 0.10 micron.
7. according to the welding chopper described in any 1 in claim 1~6, it is characterized in that, by perpendicular to described axial vertical
The angle that face is formed with the 2nd inclined plane, less than by perpendicular to the axial face and the 1st inclined plane institute shape
Into angle.
8. according to the welding chopper described in any 1 in claim 1~7, it is characterized in that, by perpendicular to the axial face with
The angle that 2nd inclined plane is formed is less than 11 degree.
9. according to the welding chopper described in any 1 in claim 1~8, it is characterized in that, when along the end on observation,
The border of 1st inclined plane and the 2nd inclined plane is serrated.
10. according to the welding chopper described in any 1 in claim 1~9, it is characterized in that,
The degree of bias of 1st inclined plane be below -0.3,
The average height of 1st inclined plane is more than 0.06 micron, less than 0.3 micron.
11. according to the welding chopper described in any 1 in claim 1~10, it is characterized in that, the kurtosis of the 2nd inclined plane
For less than 5.0.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015134649 | 2015-07-03 | ||
| JP2015-134649 | 2015-07-03 | ||
| JP2016018954A JP6064308B2 (en) | 2015-07-03 | 2016-02-03 | Bonding capillary |
| JP2016-018954 | 2016-02-03 | ||
| PCT/JP2016/069699 WO2017006880A1 (en) | 2015-07-03 | 2016-07-01 | Bonding capillary |
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| Publication Number | Publication Date |
|---|---|
| CN107710394A true CN107710394A (en) | 2018-02-16 |
| CN107710394B CN107710394B (en) | 2020-05-19 |
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| CN201680038201.8A Active CN107710394B (en) | 2015-07-03 | 2016-07-01 | Welding chopper |
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| JP (2) | JP6064308B2 (en) |
| KR (1) | KR101907906B1 (en) |
| CN (1) | CN107710394B (en) |
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| CN110265313A (en) * | 2019-07-25 | 2019-09-20 | 刘欢 | Energy integration welds chopper |
| CN107710394B (en) * | 2015-07-03 | 2020-05-19 | Toto株式会社 | Welding chopper |
| CN111785701A (en) * | 2020-07-24 | 2020-10-16 | 宁波康强电子股份有限公司 | Pre-electroplated nickel-palladium-gold lead frame and preparation method thereof |
| CN113787250A (en) * | 2021-07-27 | 2021-12-14 | 中国电子科技集团公司第二十九研究所 | Wedge-shaped cleaver structure for improving lead bonding precision |
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| KR102394732B1 (en) * | 2018-04-27 | 2022-05-09 | 제이엑스금속주식회사 | Surface-treated copper foil, copper clad laminate and printed wiring board |
| CN116000511B (en) * | 2022-12-26 | 2024-04-09 | 深圳市海志亿半导体工具有限公司 | Cutter head for enhancing fine-pitch wire feeding forming effect |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107710394B (en) * | 2015-07-03 | 2020-05-19 | Toto株式会社 | Welding chopper |
| CN110265313A (en) * | 2019-07-25 | 2019-09-20 | 刘欢 | Energy integration welds chopper |
| CN111785701A (en) * | 2020-07-24 | 2020-10-16 | 宁波康强电子股份有限公司 | Pre-electroplated nickel-palladium-gold lead frame and preparation method thereof |
| CN113787250A (en) * | 2021-07-27 | 2021-12-14 | 中国电子科技集团公司第二十九研究所 | Wedge-shaped cleaver structure for improving lead bonding precision |
| CN113787250B (en) * | 2021-07-27 | 2023-01-10 | 中国电子科技集团公司第二十九研究所 | Promote wedge riving knife structure of lead bonding precision |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107710394B (en) | 2020-05-19 |
| KR20180011249A (en) | 2018-01-31 |
| PH12017502415B1 (en) | 2018-06-25 |
| TW201701982A (en) | 2017-01-16 |
| KR101907906B1 (en) | 2018-10-15 |
| JP2017017306A (en) | 2017-01-19 |
| TWI562847B (en) | 2016-12-21 |
| JP2017041657A (en) | 2017-02-23 |
| JP6064308B2 (en) | 2017-01-25 |
| PH12017502415A1 (en) | 2018-06-25 |
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