MY176148A - Bonding capillary - Google Patents

Bonding capillary

Info

Publication number
MY176148A
MY176148A MYPI2017001707A MYPI2017001707A MY176148A MY 176148 A MY176148 A MY 176148A MY PI2017001707 A MYPI2017001707 A MY PI2017001707A MY PI2017001707 A MYPI2017001707 A MY PI2017001707A MY 176148 A MY176148 A MY 176148A
Authority
MY
Malaysia
Prior art keywords
sectional area
disposed
bonding capillary
tip
tip side
Prior art date
Application number
MYPI2017001707A
Inventor
Ishitsuka Yuji
Onishi Jumpei
Shimohara Yuichi
Nakamura Asuka
Original Assignee
Toto Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd filed Critical Toto Ltd
Publication of MY176148A publication Critical patent/MY176148A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/02—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops, or having an outlet of particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H01L2224/78305—Shape of other portions
    • H01L2224/78307—Shape of other portions outside the capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

[Object] To provide a bonding capillary that can achieve high bond strength. [Solution] Provided is a bonding capillary including a first body (11) extending in an axial direction; a second body (12) that is disposed on a tip side of the first body (11) and has a cross- sectional area that decreases toward a tip thereof a bottleneck portion (13) disposed on a tip side of the second body (12); and an insertion hole (14) that extends in the axial direction, that extends through the first body (11), the second body (12), and the bottleneck portion (13), and that allows a wire to be inserted therethrough. The bottleneck portion (13) includes a first portion (21) and a second portion (22) that is disposed on a tip side of the first portion (21). The second portion (22) has a pressing surface for pressing the wire at a tip thereof. The first portion (21) is recessed inward from a tangent line of the second body (12) . A maximum cross-sectional area of the second portion (22) is greater than a minimum cross-sectional area of the first portion (21) .
MYPI2017001707A 2016-11-28 2017-11-22 Bonding capillary MY176148A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016230059 2016-11-28
JP2017059943A JP6270256B1 (en) 2016-11-28 2017-03-24 Bonding capillary

Publications (1)

Publication Number Publication Date
MY176148A true MY176148A (en) 2020-07-24

Family

ID=61074697

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017001707A MY176148A (en) 2016-11-28 2017-11-22 Bonding capillary

Country Status (6)

Country Link
JP (2) JP6270256B1 (en)
KR (1) KR101974844B1 (en)
CN (1) CN108115267B (en)
MY (1) MY176148A (en)
PH (1) PH12017000339A1 (en)
TW (1) TWI634962B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114309920A (en) * 2021-12-23 2022-04-12 潮州三环（集团）股份有限公司 Ceramic cleaver and preparation method thereof

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4020543A (en) * 1975-06-26 1977-05-03 Sola Basic Industries, Inc. Two-piece capillary tip bonding tool
CN1034463A (en) * 1988-01-18 1989-08-02 雷伊化学公司 The interconnection of electronic component
JPH01201933A (en) * 1988-02-08 1989-08-14 Mitsubishi Electric Corp Wire bonding and device therefor
JP3022151B2 (en) 1993-04-30 2000-03-15 松下電器産業株式会社 Capillary for wire bonding apparatus and method for forming electrical connection bump using the capillary
US5421503A (en) * 1994-08-24 1995-06-06 Kulicke And Soffa Investments, Inc. Fine pitch capillary bonding tool
JPH1092861A (en) * 1996-09-10 1998-04-10 Sony Corp Capillary for wire bonding
US6065667A (en) * 1997-01-15 2000-05-23 National Semiconductor Corporation Method and apparatus for fine pitch wire bonding
JP3532439B2 (en) * 1999-03-02 2004-05-31 アルプス電気株式会社 Magnetic head
US6321969B1 (en) * 2000-04-28 2001-11-27 Kulicke & Soffa Investments Efficient energy transfer capillary
KR20090005903A (en) * 2007-07-10 2009-01-14 에스티에스반도체통신 주식회사 Wire bonding apparatus supplying thermal energy through capillary and method for wire bonding using the same
CN201226353Y (en) * 2008-07-08 2009-04-22 科威（肇庆）半导体有限公司 Ultrasonic bonding cleaver for increasing gold-remaining angle
WO2011040543A1 (en) 2009-09-30 2011-04-07 Toto株式会社 Bonding capillary
KR101482597B1 (en) * 2012-09-26 2015-01-14 토토 가부시키가이샤 Bonding capillary
JP6126144B2 (en) * 2014-06-30 2017-05-10 Toto株式会社 Bonding capillary

Also Published As

Publication number Publication date
PH12017000339A1 (en) 2019-01-28
CN108115267A (en) 2018-06-05
CN108115267B (en) 2021-10-08
JP6270256B1 (en) 2018-01-31
JP2018093206A (en) 2018-06-14
TW201819090A (en) 2018-06-01
KR20180060979A (en) 2018-06-07
TWI634962B (en) 2018-09-11
JP2018093159A (en) 2018-06-14
KR101974844B1 (en) 2019-08-23

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