MY158508A - Bonding capillary - Google Patents
Bonding capillaryInfo
- Publication number
- MY158508A MY158508A MYPI2013003417A MYPI2013003417A MY158508A MY 158508 A MY158508 A MY 158508A MY PI2013003417 A MYPI2013003417 A MY PI2013003417A MY PI2013003417 A MYPI2013003417 A MY PI2013003417A MY 158508 A MY158508 A MY 158508A
- Authority
- MY
- Malaysia
- Prior art keywords
- bonding capillary
- bonding
- asperities
- tip surface
- capillary
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78302—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
TO PROVIDE A BONDING CAPILLARY (110) THAT CAN MAINTAIN A SUFFICIENT BONDING STRENGTH FOR A LONG TIME. PROVIDED IS A BONDING CAPILLARY (110) INCLUDING A BODY (10) HAVING A TIP SURFACE (50) THAT PERFORMS WIRE BONDING. THE TIP SURFACE (50) HAS MICROSCOPIC ASPERITIES. PEAKS OF THE ASPERITIES ARE LESS SHARP THAN VALLEYS OF THE ASPERITIES. IN THE BONDING CAPILLARY (110), WHEN SEEN IN A DIRECTION PERPENDICULAR TO THE TIP SURFACE (50), THE AREA OF THE PEAKS IS GREATER THAN THE AREA OF THE VALLEYS. (FIG. 1)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012212184 | 2012-09-26 | ||
JP2013126818A JP5510691B2 (en) | 2012-09-26 | 2013-06-17 | Bonding capillary |
Publications (1)
Publication Number | Publication Date |
---|---|
MY158508A true MY158508A (en) | 2016-10-14 |
Family
ID=50786341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2013003417A MY158508A (en) | 2012-09-26 | 2013-09-20 | Bonding capillary |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5510691B2 (en) |
MY (1) | MY158508A (en) |
PH (1) | PH12013000287B1 (en) |
TW (1) | TWI466750B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6126144B2 (en) * | 2014-06-30 | 2017-05-10 | Toto株式会社 | Bonding capillary |
USD771168S1 (en) | 2014-10-31 | 2016-11-08 | Coorstek, Inc. | Wire bonding ceramic capillary |
USD797172S1 (en) | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
USD797171S1 (en) | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
USD797826S1 (en) | 2015-02-03 | 2017-09-19 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
USD753739S1 (en) | 2015-04-17 | 2016-04-12 | Coorstek, Inc. | Wire bonding wedge tool |
JP6064308B2 (en) * | 2015-07-03 | 2017-01-25 | Toto株式会社 | Bonding capillary |
WO2017006880A1 (en) * | 2015-07-03 | 2017-01-12 | Toto株式会社 | Bonding capillary |
CN117133616A (en) * | 2016-08-08 | 2023-11-28 | Asml荷兰有限公司 | Electron emitter and method for manufacturing the same |
USD868123S1 (en) | 2016-12-20 | 2019-11-26 | Coorstek, Inc. | Wire bonding wedge tool |
CN114309920A (en) * | 2021-12-23 | 2022-04-12 | 潮州三环(集团)股份有限公司 | Ceramic cleaver and preparation method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7389905B2 (en) * | 1999-02-25 | 2008-06-24 | Reiber Steven F | Flip chip bonding tool tip |
US6910612B2 (en) * | 2001-07-17 | 2005-06-28 | Kulicke & Soffa Investments, Inc. | Capillary with contained inner chamfer |
TWI229021B (en) * | 2002-06-12 | 2005-03-11 | Shi-Tong Yang | Welding head of spot welding machine |
KR101319691B1 (en) * | 2006-07-03 | 2013-10-17 | 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 | Bonding tool with improved finish |
-
2013
- 2013-06-17 JP JP2013126818A patent/JP5510691B2/en active Active
- 2013-07-30 TW TW102127249A patent/TWI466750B/en active
- 2013-09-20 MY MYPI2013003417A patent/MY158508A/en unknown
- 2013-09-25 PH PH12013000287A patent/PH12013000287B1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2014082450A (en) | 2014-05-08 |
TWI466750B (en) | 2015-01-01 |
TW201412448A (en) | 2014-04-01 |
JP5510691B2 (en) | 2014-06-04 |
PH12013000287A1 (en) | 2015-04-06 |
PH12013000287B1 (en) | 2015-04-06 |
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