PH12017502122A1 - Tape for semiconductor processing - Google Patents

Tape for semiconductor processing

Info

Publication number
PH12017502122A1
PH12017502122A1 PH12017502122A PH12017502122A PH12017502122A1 PH 12017502122 A1 PH12017502122 A1 PH 12017502122A1 PH 12017502122 A PH12017502122 A PH 12017502122A PH 12017502122 A PH12017502122 A PH 12017502122A PH 12017502122 A1 PH12017502122 A1 PH 12017502122A1
Authority
PH
Philippines
Prior art keywords
tape
metal layer
semiconductor processing
adhesive layer
semiconductor
Prior art date
Application number
PH12017502122A
Other languages
English (en)
Other versions
PH12017502122B1 (en
Inventor
Masami Aoyama
Toru Sano
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of PH12017502122A1 publication Critical patent/PH12017502122A1/en
Publication of PH12017502122B1 publication Critical patent/PH12017502122B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
PH12017502122A 2015-12-25 2017-11-21 Tape for semiconductor processing PH12017502122B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015255312 2015-12-25
PCT/JP2016/079626 WO2017110202A1 (ja) 2015-12-25 2016-10-05 半導体加工用テープ

Publications (2)

Publication Number Publication Date
PH12017502122A1 true PH12017502122A1 (en) 2018-05-28
PH12017502122B1 PH12017502122B1 (en) 2018-05-28

Family

ID=59089986

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12017502122A PH12017502122B1 (en) 2015-12-25 2017-11-21 Tape for semiconductor processing

Country Status (8)

Country Link
JP (1) JP6757743B2 (ko)
KR (1) KR102580602B1 (ko)
CN (1) CN107614641B (ko)
MY (1) MY184346A (ko)
PH (1) PH12017502122B1 (ko)
SG (1) SG11201708850VA (ko)
TW (1) TWI636886B (ko)
WO (1) WO2017110202A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102561868B1 (ko) * 2017-07-25 2023-07-31 세키스이가가쿠 고교가부시키가이샤 반도체 보호용 점착 테이프 및 반도체를 처리하는 방법
CN109454955B (zh) * 2018-12-19 2021-07-06 广东生益科技股份有限公司 一种封装载带基材及其制备方法
CN115410927A (zh) * 2022-09-29 2022-11-29 北京超材信息科技有限公司 半导体器件的切割方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1167699A (ja) * 1997-08-13 1999-03-09 Texas Instr Japan Ltd 半導体装置の製造方法
JP3071764B2 (ja) * 1998-08-31 2000-07-31 京セラ株式会社 金属箔付きフィルム及びそれを用いた配線基板の製造方法
JP2003298230A (ja) * 2002-03-28 2003-10-17 Tokai Rubber Ind Ltd フレキシブルプリント配線板用基材
JP2004189981A (ja) * 2002-12-13 2004-07-08 Kanegafuchi Chem Ind Co Ltd 熱可塑性ポリイミド樹脂材料および積層体およびプリント配線板の製造方法
JP2006103108A (ja) * 2004-10-04 2006-04-20 Sekisui Chem Co Ltd 金属箔付フィルム
JP4865312B2 (ja) 2005-12-05 2012-02-01 古河電気工業株式会社 チップ用保護膜形成用シート
JP2007235022A (ja) 2006-03-03 2007-09-13 Mitsui Chemicals Inc 接着フィルム
JP4849993B2 (ja) * 2006-08-14 2012-01-11 日東電工株式会社 粘着シート、その製造方法および積層セラミックシートの切断方法
JP5298913B2 (ja) * 2009-02-12 2013-09-25 信越化学工業株式会社 接着剤組成物およびそれを用いた半導体ウエハ用保護シート
JP5486831B2 (ja) * 2009-03-19 2014-05-07 積水化学工業株式会社 ダイシングテープ及び半導体チップの製造方法
JP5681374B2 (ja) * 2010-04-19 2015-03-04 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
JP5356326B2 (ja) * 2010-07-20 2013-12-04 日東電工株式会社 半導体装置の製造方法
JP5419226B2 (ja) * 2010-07-29 2014-02-19 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途
JP6144868B2 (ja) * 2010-11-18 2017-06-07 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、及び、フリップチップ型半導体裏面用フィルムの製造方法
JP6007576B2 (ja) * 2012-05-09 2016-10-12 日立化成株式会社 半導体装置の製造方法
JP6213055B2 (ja) * 2013-08-26 2017-10-18 日立化成株式会社 ウェハ加工用テープ
JP2015129247A (ja) * 2014-01-09 2015-07-16 住友ベークライト株式会社 樹脂組成物、接着フィルム、接着シート、ダイシングテープ一体型接着シート、バックグラインドテープ一体型接着シート、ダイシングテープ兼バックグラインドテープ一体型接着シート、および、電子装置
JP6229528B2 (ja) * 2014-02-17 2017-11-15 日立化成株式会社 半導体装置の製造方法、半導体装置及び接着剤組成物
TWI653312B (zh) * 2014-03-11 2019-03-11 日商味之素股份有限公司 接著薄膜
JP6299315B2 (ja) * 2014-03-20 2018-03-28 日立化成株式会社 ウエハ加工用テープ
JP6078578B2 (ja) * 2015-04-22 2017-02-08 日東電工株式会社 フリップチップ型半導体裏面用フィルム及びその用途

Also Published As

Publication number Publication date
KR102580602B1 (ko) 2023-09-20
CN107614641B (zh) 2021-07-09
JP6757743B2 (ja) 2020-09-23
TWI636886B (zh) 2018-10-01
JPWO2017110202A1 (ja) 2018-10-11
PH12017502122B1 (en) 2018-05-28
KR20180097445A (ko) 2018-08-31
CN107614641A (zh) 2018-01-19
WO2017110202A1 (ja) 2017-06-29
MY184346A (en) 2021-04-01
TW201728443A (zh) 2017-08-16
SG11201708850VA (en) 2018-07-30

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