NZ504011A - Copper and copper-nickel based substrates for superconductors - Google Patents
Copper and copper-nickel based substrates for superconductorsInfo
- Publication number
- NZ504011A NZ504011A NZ504011A NZ50401198A NZ504011A NZ 504011 A NZ504011 A NZ 504011A NZ 504011 A NZ504011 A NZ 504011A NZ 50401198 A NZ50401198 A NZ 50401198A NZ 504011 A NZ504011 A NZ 504011A
- Authority
- NZ
- New Zealand
- Prior art keywords
- alloy
- oxide
- atomic
- article
- copper
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 170
- 239000010949 copper Substances 0.000 title claims abstract description 92
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 62
- 239000002887 superconductor Substances 0.000 title claims description 26
- 229910000570 Cupronickel Inorganic materials 0.000 title claims description 8
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 title claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 236
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 206
- 239000000956 alloy Substances 0.000 claims abstract description 206
- 238000000034 method Methods 0.000 claims abstract description 149
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 115
- 239000000203 mixture Substances 0.000 claims abstract description 80
- 229910052802 copper Inorganic materials 0.000 claims abstract description 76
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 56
- 239000000463 material Substances 0.000 claims abstract description 50
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 37
- 239000002131 composite material Substances 0.000 claims abstract description 35
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 31
- 229910052735 hafnium Inorganic materials 0.000 claims abstract description 30
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 29
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 28
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 28
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 27
- 229910052769 Ytterbium Inorganic materials 0.000 claims abstract description 26
- 230000008018 melting Effects 0.000 claims abstract description 26
- 238000002844 melting Methods 0.000 claims abstract description 26
- 229910052692 Dysprosium Inorganic materials 0.000 claims abstract description 25
- 229910052691 Erbium Inorganic materials 0.000 claims abstract description 25
- 229910052765 Lutetium Inorganic materials 0.000 claims abstract description 25
- 229910052779 Neodymium Inorganic materials 0.000 claims abstract description 25
- 229910052772 Samarium Inorganic materials 0.000 claims abstract description 25
- 229910052771 Terbium Inorganic materials 0.000 claims abstract description 25
- 229910052775 Thulium Inorganic materials 0.000 claims abstract description 25
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 25
- 229910052689 Holmium Inorganic materials 0.000 claims abstract description 24
- 229910052776 Thorium Inorganic materials 0.000 claims abstract description 24
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 24
- 229910052693 Europium Inorganic materials 0.000 claims abstract description 23
- 229910052688 Gadolinium Inorganic materials 0.000 claims abstract description 23
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 23
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 22
- 230000002829 reductive effect Effects 0.000 claims abstract description 12
- 230000008569 process Effects 0.000 claims description 104
- 229910052751 metal Inorganic materials 0.000 claims description 52
- 239000002184 metal Substances 0.000 claims description 51
- 239000000843 powder Substances 0.000 claims description 38
- 238000005096 rolling process Methods 0.000 claims description 38
- 239000010936 titanium Substances 0.000 claims description 37
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 36
- 239000001301 oxygen Substances 0.000 claims description 36
- 229910052760 oxygen Inorganic materials 0.000 claims description 36
- 239000011888 foil Substances 0.000 claims description 33
- 230000001681 protective effect Effects 0.000 claims description 27
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 20
- 230000036961 partial effect Effects 0.000 claims description 18
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 12
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 11
- 238000001953 recrystallisation Methods 0.000 claims description 11
- 230000003746 surface roughness Effects 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 8
- -1 NbTi Inorganic materials 0.000 claims description 8
- 239000005751 Copper oxide Substances 0.000 claims description 7
- 238000000137 annealing Methods 0.000 claims description 7
- 229910000431 copper oxide Inorganic materials 0.000 claims description 7
- 150000002910 rare earth metals Chemical class 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 229910000943 NiAl Inorganic materials 0.000 claims description 5
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052787 antimony Inorganic materials 0.000 claims description 5
- 229910052758 niobium Inorganic materials 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- 229910001005 Ni3Al Inorganic materials 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- 229910052734 helium Inorganic materials 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- IQAKAOAPBMJSGJ-UHFFFAOYSA-N [Cu].[Y].[Ba] Chemical compound [Cu].[Y].[Ba] IQAKAOAPBMJSGJ-UHFFFAOYSA-N 0.000 claims 4
- 230000003647 oxidation Effects 0.000 abstract description 37
- 238000007254 oxidation reaction Methods 0.000 abstract description 37
- 230000000930 thermomechanical effect Effects 0.000 abstract description 3
- 238000010348 incorporation Methods 0.000 abstract description 2
- 239000011162 core material Substances 0.000 description 64
- 235000011468 Albizia julibrissin Nutrition 0.000 description 39
- 241001070944 Mimosa Species 0.000 description 39
- 230000009467 reduction Effects 0.000 description 25
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 22
- 150000002739 metals Chemical class 0.000 description 22
- 238000000151 deposition Methods 0.000 description 21
- 238000013459 approach Methods 0.000 description 20
- 229910021521 yttrium barium copper oxide Inorganic materials 0.000 description 20
- 230000005291 magnetic effect Effects 0.000 description 17
- 230000008021 deposition Effects 0.000 description 15
- 239000000155 melt Substances 0.000 description 15
- 238000004663 powder metallurgy Methods 0.000 description 14
- 229910003336 CuNi Inorganic materials 0.000 description 13
- 238000005137 deposition process Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 12
- 239000010408 film Substances 0.000 description 12
- 239000011777 magnesium Substances 0.000 description 12
- 229910052786 argon Inorganic materials 0.000 description 11
- 239000011651 chromium Substances 0.000 description 9
- 229910000510 noble metal Inorganic materials 0.000 description 9
- 239000004020 conductor Substances 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 238000000265 homogenisation Methods 0.000 description 7
- 230000006698 induction Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000002411 adverse Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000001590 oxidative effect Effects 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- 229910052777 Praseodymium Inorganic materials 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 4
- 230000005294 ferromagnetic effect Effects 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- 229910002482 Cu–Ni Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229960004643 cupric oxide Drugs 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 3
- 238000007735 ion beam assisted deposition Methods 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910018565 CuAl Inorganic materials 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- BTGZYWWSOPEHMM-UHFFFAOYSA-N [O].[Cu].[Y].[Ba] Chemical compound [O].[Cu].[Y].[Ba] BTGZYWWSOPEHMM-UHFFFAOYSA-N 0.000 description 2
- 238000007792 addition Methods 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 229910001632 barium fluoride Inorganic materials 0.000 description 2
- 229910002056 binary alloy Inorganic materials 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 229910052593 corundum Inorganic materials 0.000 description 2
- 230000001627 detrimental effect Effects 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 description 2
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 2
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 description 2
- 235000015110 jellies Nutrition 0.000 description 2
- 239000008274 jelly Substances 0.000 description 2
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- OHSVLFRHMCKCQY-UHFFFAOYSA-N lutetium atom Chemical compound [Lu] OHSVLFRHMCKCQY-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 2
- 229910052702 rhenium Inorganic materials 0.000 description 2
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 2
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000004901 spalling Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 2
- 229910002058 ternary alloy Inorganic materials 0.000 description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 description 2
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 2
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000070918 Cima Species 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910018054 Ni-Cu Inorganic materials 0.000 description 1
- 229910018481 Ni—Cu Inorganic materials 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- DTQVDTLACAAQTR-UHFFFAOYSA-M Trifluoroacetate Chemical compound [O-]C(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-M 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000004320 controlled atmosphere Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000009689 gas atomisation Methods 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- UJMWVICAENGCRF-UHFFFAOYSA-N oxygen difluoride Chemical compound FOF UJMWVICAENGCRF-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 229910002059 quaternary alloy Inorganic materials 0.000 description 1
- 238000007712 rapid solidification Methods 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000007736 thin film deposition technique Methods 0.000 description 1
- ZSLUVFAKFWKJRC-UHFFFAOYSA-N thorium Chemical compound [Th] ZSLUVFAKFWKJRC-UHFFFAOYSA-N 0.000 description 1
- FRNOGLGSGLTDKL-UHFFFAOYSA-N thulium atom Chemical compound [Tm] FRNOGLGSGLTDKL-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/001—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides
- C22C32/0015—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with only oxides with only single oxides as main non-metallic constituents
- C22C32/0021—Matrix based on noble metals, Cu or alloys thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0576—Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C2204/00—End product comprising different layers, coatings or parts of cermet
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Composite Materials (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US94304797A | 1997-10-01 | 1997-10-01 | |
| PCT/US1998/020404 WO1999017307A1 (fr) | 1997-10-01 | 1998-09-30 | Substrats possedant une resistance accrue a l'oxydation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NZ504011A true NZ504011A (en) | 2001-09-28 |
Family
ID=25479019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NZ504011A NZ504011A (en) | 1997-10-01 | 1998-09-30 | Copper and copper-nickel based substrates for superconductors |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1019920A4 (fr) |
| JP (1) | JP2001518681A (fr) |
| AU (1) | AU740508B2 (fr) |
| CA (1) | CA2305646A1 (fr) |
| NZ (1) | NZ504011A (fr) |
| WO (1) | WO1999017307A1 (fr) |
Families Citing this family (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6458223B1 (en) * | 1997-10-01 | 2002-10-01 | American Superconductor Corporation | Alloy materials |
| US6475311B1 (en) * | 1999-03-31 | 2002-11-05 | American Superconductor Corporation | Alloy materials |
| US6436317B1 (en) | 1999-05-28 | 2002-08-20 | American Superconductor Corporation | Oxide bronze compositions and textured articles manufactured in accordance therewith |
| US6562761B1 (en) | 2000-02-09 | 2003-05-13 | American Superconductor Corporation | Coated conductor thick film precursor |
| US6765151B2 (en) | 1999-07-23 | 2004-07-20 | American Superconductor Corporation | Enhanced high temperature coated superconductors |
| CA2378833A1 (fr) * | 1999-07-23 | 2001-02-01 | American Superconductor Corporation | Supraconducteurs a haute temperature perfectionnes |
| US6828507B1 (en) | 1999-07-23 | 2004-12-07 | American Superconductor Corporation | Enhanced high temperature coated superconductors joined at a cap layer |
| WO2001015245A1 (fr) | 1999-08-24 | 2001-03-01 | Electric Power Research Institute, Inc. | Substrats en alliage de regulation de surface et procedes de fabrication correspondants |
| US6974501B1 (en) | 1999-11-18 | 2005-12-13 | American Superconductor Corporation | Multi-layer articles and methods of making same |
| US6673387B1 (en) | 2000-07-14 | 2004-01-06 | American Superconductor Corporation | Control of oxide layer reaction rates |
| US20020056401A1 (en) | 2000-10-23 | 2002-05-16 | Rupich Martin W. | Precursor solutions and methods of using same |
| CN1193108C (zh) * | 2000-12-07 | 2005-03-16 | 德累斯顿固体材料研究所 | 外延覆层金属带及其制造方法 |
| US6821338B2 (en) | 2000-12-15 | 2004-11-23 | The Regents Of The University Of California | Particle beam biaxial orientation of a substrate for epitaxial crystal growth |
| US6809066B2 (en) | 2001-07-30 | 2004-10-26 | The Regents Of The University Of California | Ion texturing methods and articles |
| US6745059B2 (en) | 2001-11-28 | 2004-06-01 | American Superconductor Corporation | Superconductor cables and magnetic devices |
| DE10200445B4 (de) * | 2002-01-02 | 2005-12-08 | Leibniz-Institut für Festkörper- und Werkstoffforschung e.V. | Metallband für epitaktische Beschichtungen und Verfahren zu dessen Herstellung |
| US7463915B2 (en) | 2004-08-20 | 2008-12-09 | American Superconductor Corporation | Stacked filamentary coated superconductors |
| US7496390B2 (en) | 2004-08-20 | 2009-02-24 | American Superconductor Corporation | Low ac loss filamentary coated superconductors |
| US7582328B2 (en) | 2004-08-20 | 2009-09-01 | American Superconductor Corporation | Dropwise deposition of a patterned oxide superconductor |
| US7622424B2 (en) | 2004-10-01 | 2009-11-24 | American Superconductor Corporation | Thick superconductor films with improved performance |
| US7816303B2 (en) | 2004-10-01 | 2010-10-19 | American Superconductor Corporation | Architecture for high temperature superconductor wire |
| US7790003B2 (en) | 2004-10-12 | 2010-09-07 | Southwest Research Institute | Method for magnetron sputter deposition |
| US7592051B2 (en) | 2005-02-09 | 2009-09-22 | Southwest Research Institute | Nanostructured low-Cr Cu-Cr coatings for high temperature oxidation resistance |
| WO2006110382A2 (fr) | 2005-03-31 | 2006-10-19 | American Superconductor Corporation | Stabilisateur de type treillis pour supraconducteurs recouverts de filaments |
| ES2553261T3 (es) * | 2005-07-29 | 2015-12-07 | American Superconductor Corporation | Cables y bobinas superconductores a altas temperaturas |
| JP4741326B2 (ja) * | 2005-09-07 | 2011-08-03 | 株式会社フジクラ | 酸化物超電導導体およびその製造方法 |
| JP4739015B2 (ja) * | 2005-12-27 | 2011-08-03 | 株式会社フジクラ | 酸化物超電導導体用金属基材の製造方法、酸化物超電導導体の製造方法 |
| US7674751B2 (en) | 2006-01-10 | 2010-03-09 | American Superconductor Corporation | Fabrication of sealed high temperature superconductor wires |
| WO2008118127A1 (fr) | 2006-07-21 | 2008-10-02 | American Superconductor Corporation | Épissure de faible résistance pour des fils supraconducteurs à haute température |
| US7902120B2 (en) | 2006-07-24 | 2011-03-08 | American Superconductor Corporation | High temperature superconductors having planar magnetic flux pinning centers and methods for making the same |
| US7893006B2 (en) | 2007-03-23 | 2011-02-22 | American Superconductor Corporation | Systems and methods for solution-based deposition of metallic cap layers for high temperature superconductor wires |
| US8195260B2 (en) | 2008-07-23 | 2012-06-05 | American Superconductor Corporation | Two-sided splice for high temperature superconductor laminated wires |
| JP5800300B2 (ja) | 2009-09-14 | 2015-10-28 | 日本碍子株式会社 | 銅合金線材 |
| JP5800301B2 (ja) * | 2009-09-14 | 2015-10-28 | 日本碍子株式会社 | 銅合金箔、それを用いたフレキシブルプリント基板 |
| JP6012834B1 (ja) * | 2015-10-15 | 2016-10-25 | 東京特殊電線株式会社 | サスペンションワイヤ |
| RU2624564C2 (ru) * | 2015-11-06 | 2017-07-04 | Федеральное государственное бюджетное учреждение науки Институт физики металлов имени М.Н. Михеева Уральского отделения Российской академии наук (ИФМ УрО РАН) | Способ изготовления биаксиально текстурированной подложки из тройного сплава на медно-никелевой основе |
| KR102452709B1 (ko) * | 2017-05-30 | 2022-10-11 | 현대자동차주식회사 | 자동차 가니쉬용 합금 및 자동차용 가니쉬 |
| EP3584847A1 (fr) * | 2018-06-18 | 2019-12-25 | Bruker HTS GmbH | Procédé de fabrication d'une bande revêtue de hts |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3982973A (en) * | 1975-12-11 | 1976-09-28 | The International Nickel Company, Inc. | Cube textured nickel |
| US4640816A (en) * | 1984-08-31 | 1987-02-03 | California Institute Of Technology | Metastable alloy materials produced by solid state reaction of compacted, mechanically deformed mixtures |
| JPS63250434A (ja) * | 1987-04-08 | 1988-10-18 | Dowa Mining Co Ltd | コネクタ−用銅基合金 |
| US5063200A (en) * | 1987-08-12 | 1991-11-05 | Hitachi, Ltd. | Ceramic superconductor article |
| US5047389A (en) * | 1988-10-31 | 1991-09-10 | General Atomics | Substrate for ceramic superconductor |
| US5164360A (en) * | 1989-04-14 | 1992-11-17 | General Atomics | Nickel-based substrate for ceramic superconductor |
| US5006507A (en) * | 1989-04-14 | 1991-04-09 | General Atomics | Nickel-based substrate for ceramic superconductor |
| US5089057A (en) * | 1989-09-15 | 1992-02-18 | At&T Bell Laboratories | Method for treating copper-based alloys and articles produced therefrom |
| JP3047540B2 (ja) * | 1991-07-23 | 2000-05-29 | 三菱マテリアル株式会社 | 高い残留抵抗比を有する超電導安定化材用高純度Ｃｕ合金 |
| JP2915244B2 (ja) * | 1993-03-25 | 1999-07-05 | 新日本製鐵株式会社 | ガラス成型金型用合金 |
| DE19501223C2 (de) * | 1995-01-17 | 1999-12-30 | Korea Machinery & Metal Inst | Verwendung einer Kupfer-Chrom-Zirkonium-Cer-Lanthan-Legierung für Schweißelektroden |
| US5741377A (en) * | 1995-04-10 | 1998-04-21 | Martin Marietta Energy Systems, Inc. | Structures having enhanced biaxial texture and method of fabricating same |
-
1998
- 1998-09-30 WO PCT/US1998/020404 patent/WO1999017307A1/fr not_active Application Discontinuation
- 1998-09-30 EP EP98957311A patent/EP1019920A4/fr not_active Withdrawn
- 1998-09-30 AU AU13597/99A patent/AU740508B2/en not_active Ceased
- 1998-09-30 CA CA002305646A patent/CA2305646A1/fr not_active Abandoned
- 1998-09-30 NZ NZ504011A patent/NZ504011A/en unknown
- 1998-09-30 JP JP2000514282A patent/JP2001518681A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CA2305646A1 (fr) | 1999-04-08 |
| EP1019920A4 (fr) | 2001-02-28 |
| EP1019920A1 (fr) | 2000-07-19 |
| WO1999017307A1 (fr) | 1999-04-08 |
| JP2001518681A (ja) | 2001-10-16 |
| AU1359799A (en) | 1999-04-23 |
| AU740508B2 (en) | 2001-11-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU740508B2 (en) | Substrates with improved oxidation resistance | |
| US6458223B1 (en) | Alloy materials | |
| US6428635B1 (en) | Substrates for superconductors | |
| AU758847B2 (en) | Alloy materials | |
| US7018954B2 (en) | Processing of magnesium-boride superconductors | |
| JP2002540294A5 (fr) | ||
| US20050163644A1 (en) | Processing of magnesium-boride superconductor wires | |
| EP0640249A1 (fr) | Supraconducteur a base d'oxyde fortement lie et methode de fabrication | |
| US5273959A (en) | Alloy for HTSC composite conductors made of Au-Ag-Pd | |
| US20080274371A1 (en) | Composite substrates for high temperature superconductors having improved properties | |
| WO1992020076A1 (fr) | Supraconducteur et procede de fabrication | |
| WO2002073709A2 (fr) | Procede de fabrication de supraconducteurs de borure de magnesium | |
| Pickus et al. | A15 multifilamentary superconductors by the infiltration process | |
| Pickus | Binary and ternary niobium-base superconductors by the infiltration process | |
| Pickus et al. | Materials & Molecular Research Division | |
| Pickus | BINARY AND TERNARY NIOBIUM-BASE SUPERCONDUCTORS BY THE INFILTRATION | |
| Vilayannur | Fundamental mechanisms of oxidation of alkaline earth bearing metal precursors: Y-Ba-Cu-Ag-Pd and Ag? Ba |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PSEA | Patent sealed |