NO943838D0 - System for måling av filmtykkelse - Google Patents

System for måling av filmtykkelse

Info

Publication number
NO943838D0
NO943838D0 NO943838A NO943838A NO943838D0 NO 943838 D0 NO943838 D0 NO 943838D0 NO 943838 A NO943838 A NO 943838A NO 943838 A NO943838 A NO 943838A NO 943838 D0 NO943838 D0 NO 943838D0
Authority
NO
Norway
Prior art keywords
film thickness
measurement system
thickness measurement
film
thickness
Prior art date
Application number
NO943838A
Other languages
English (en)
Other versions
NO943838L (no
Inventor
Anthony M Ledger
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of NO943838D0 publication Critical patent/NO943838D0/no
Publication of NO943838L publication Critical patent/NO943838L/no

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
NO943838A 1993-10-12 1994-10-11 System for måling av filmtykkelse NO943838L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/134,728 US5452953A (en) 1993-10-12 1993-10-12 Film thickness measurement of structures containing a scattering surface

Publications (2)

Publication Number Publication Date
NO943838D0 true NO943838D0 (no) 1994-10-11
NO943838L NO943838L (no) 1995-04-18

Family

ID=22464713

Family Applications (1)

Application Number Title Priority Date Filing Date
NO943838A NO943838L (no) 1993-10-12 1994-10-11 System for måling av filmtykkelse

Country Status (6)

Country Link
US (1) US5452953A (no)
EP (1) EP0647827B1 (no)
JP (1) JP2730864B2 (no)
DE (1) DE69423839T2 (no)
IL (1) IL111217A (no)
NO (1) NO943838L (no)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5473433A (en) * 1993-12-07 1995-12-05 At&T Corp. Method of high yield manufacture of VLSI type integrated circuit devices by determining critical surface characteristics of mounting films
US5555474A (en) * 1994-12-21 1996-09-10 Integrated Process Equipment Corp. Automatic rejection of diffraction effects in thin film metrology
US5640242A (en) * 1996-01-31 1997-06-17 International Business Machines Corporation Assembly and method for making in process thin film thickness measurments
JPH10329015A (ja) * 1997-03-24 1998-12-15 Canon Inc 研磨装置および研磨方法
US6366861B1 (en) * 1997-04-25 2002-04-02 Applied Materials, Inc. Method of determining a wafer characteristic using a film thickness monitor
US6275297B1 (en) 1998-08-19 2001-08-14 Sc Technology Method of measuring depths of structures on a semiconductor substrate
IL130874A (en) * 1999-07-09 2002-12-01 Nova Measuring Instr Ltd System and method for measuring pattern structures
US8531678B2 (en) 1999-07-09 2013-09-10 Nova Measuring Instruments, Ltd. Method and system for measuring patterned structures
US6650426B1 (en) 1999-07-12 2003-11-18 Sc Technology, Inc. Endpoint determination for recess etching to a precise depth
CN1303397C (zh) * 2000-01-26 2007-03-07 音质技术公司 为集成电路周期性光栅产生仿真衍射信号库的方法及系统
US7365860B2 (en) * 2000-12-21 2008-04-29 Sensory Analytics System capable of determining applied and anodized coating thickness of a coated-anodized product
US7274463B2 (en) * 2003-12-30 2007-09-25 Sensory Analytics Anodizing system with a coating thickness monitor and an anodized product
US6674533B2 (en) * 2000-12-21 2004-01-06 Joseph K. Price Anodizing system with a coating thickness monitor and an anodized product
US7196800B1 (en) * 2001-07-26 2007-03-27 Advanced Micro Devices, Inc. Semiconductor die analysis as a function of optical reflections from the die
US6903340B1 (en) * 2001-10-23 2005-06-07 Juan Cesar Scaiano Thin film analyzer
US7136168B2 (en) * 2002-08-09 2006-11-14 Angstrovision, Inc. Interferometric topological metrology with pre-established reference scale
US6999181B2 (en) * 2002-08-09 2006-02-14 Angstrovision, Inc. Advanced signal processing technique for translating fringe line disturbances into sample height at a particular position above an interferometer's sample stage
US20040027582A1 (en) * 2002-08-09 2004-02-12 Lev Dulman Method and apparatus for determining sample composition with an interferometer
US20040027583A1 (en) * 2002-08-09 2004-02-12 Lev Dulman Pre-established reference scale for interferometric topological metrology
CN100488729C (zh) * 2002-10-17 2009-05-20 株式会社荏原制作所 抛光状态监测装置和抛光装置以及方法
DE10324474B4 (de) 2003-05-30 2006-05-04 Leica Microsystems Semiconductor Gmbh Vorrichtung zur Wafer-Inspektion
US20070222460A1 (en) * 2006-03-07 2007-09-27 Price Joseph K Mobile apparatus capable of surface measurements
TWI320485B (en) * 2007-03-08 2010-02-11 Test Research Inc Open-circuit testing system and method
CN113624457B (zh) * 2021-08-19 2024-04-30 中国科学院合肥物质科学研究院 基于光学衍射的薄膜均匀性检测系统

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3631526A (en) * 1969-11-05 1971-12-28 Brun Sensor Systems Inc Apparatus and methods for eliminating interference effect errors in dual-beam infrared measurements
US3693025A (en) * 1969-11-28 1972-09-19 Brun Sensor Systems Inc Apparatus and method for eliminating interference errors in dual-beam infrared reflection measurements on a diffusely reflecting surface by geometrical elimination of interference-producing specularly-reflected radiation components
US3870884A (en) * 1973-08-24 1975-03-11 Infra Systems Inc Apparatus for negating effect of scattered signals upon accuracy of dual-beam infrared measurements
JPS5535214A (en) * 1978-09-04 1980-03-12 Asahi Chem Ind Co Ltd Method and device for film-thickness measurement making use of infrared-ray interference
JPH0224502A (ja) * 1988-07-12 1990-01-26 Dainippon Screen Mfg Co Ltd 膜厚測定方法
JPH02115704A (ja) * 1988-10-25 1990-04-27 Omron Tateisi Electron Co 粗面の液膜厚測定方法及びその測定装置
JPH06244261A (ja) * 1990-12-31 1994-09-02 Texas Instr Inc <Ti> 半導体装置製造プロセス制御用センサ
JPH05113319A (ja) * 1991-08-30 1993-05-07 Toshiba Corp ウエハ層厚さ測定方法
US5333049A (en) * 1991-12-06 1994-07-26 Hughes Aircraft Company Apparatus and method for interferometrically measuring the thickness of thin films using full aperture irradiation
US5293214A (en) * 1991-12-06 1994-03-08 Hughes Aircraft Company Apparatus and method for performing thin film layer thickness metrology by deforming a thin film layer into a reflective condenser

Also Published As

Publication number Publication date
DE69423839T2 (de) 2000-12-14
EP0647827A2 (en) 1995-04-12
EP0647827B1 (en) 2000-04-05
IL111217A (en) 1996-11-14
EP0647827A3 (en) 1997-01-29
JPH07198339A (ja) 1995-08-01
US5452953A (en) 1995-09-26
DE69423839D1 (de) 2000-05-11
NO943838L (no) 1995-04-18
JP2730864B2 (ja) 1998-03-25
IL111217A0 (en) 1994-12-29

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