NO860985L - Elektrisk kretsanordning og fremgangsmaate for dens fremstilling. - Google Patents
Elektrisk kretsanordning og fremgangsmaate for dens fremstilling.Info
- Publication number
- NO860985L NO860985L NO860985A NO860985A NO860985L NO 860985 L NO860985 L NO 860985L NO 860985 A NO860985 A NO 860985A NO 860985 A NO860985 A NO 860985A NO 860985 L NO860985 L NO 860985L
- Authority
- NO
- Norway
- Prior art keywords
- printing ink
- substrate
- activator
- plating
- stated
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 13
- 238000004519 manufacturing process Methods 0.000 title claims 2
- 239000000758 substrate Substances 0.000 claims description 32
- 239000012190 activator Substances 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 229920000642 polymer Polymers 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 239000004033 plastic Substances 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 229920001940 conductive polymer Polymers 0.000 claims description 5
- 230000003197 catalytic effect Effects 0.000 claims description 4
- 150000002941 palladium compounds Chemical group 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000009998 heat setting Methods 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000000976 ink Substances 0.000 description 46
- 239000002245 particle Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000013035 low temperature curing Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 241000705924 Rimelia Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011195 cermet Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 239000013527 degreasing agent Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011214 refractory ceramic Substances 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Burglar Alarm Systems (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08506897A GB2172438A (en) | 1985-03-16 | 1985-03-16 | Printed circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NO860985L true NO860985L (no) | 1986-09-17 |
Family
ID=10576142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO860985A NO860985L (no) | 1985-03-16 | 1986-03-14 | Elektrisk kretsanordning og fremgangsmaate for dens fremstilling. |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0195612A3 (fi) |
| DK (1) | DK120886A (fi) |
| FI (1) | FI861062A (fi) |
| GB (1) | GB2172438A (fi) |
| NO (1) | NO860985L (fi) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0903805B1 (en) * | 1997-09-19 | 2003-08-06 | Peter Vernon | Planar antenna device |
| US20070281099A1 (en) * | 2006-05-31 | 2007-12-06 | Cabot Corporation | Solderable pads utilizing nickel and silver nanoparticle ink jet inks |
| CN103572263B (zh) * | 2012-07-28 | 2016-05-11 | 比亚迪股份有限公司 | 塑料表面金属化的方法和表面具有金属图案的塑料产品 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5517507B2 (fi) * | 1972-06-29 | 1980-05-12 | ||
| GB1574438A (en) * | 1977-04-18 | 1980-09-10 | Plessey Co Ltd | Printed circuits |
| WO1980000294A1 (en) * | 1978-07-13 | 1980-02-21 | Tokyo Shibaura Electric Co | Method of fabricating printed circuits |
| GB2038101B (en) * | 1978-12-19 | 1983-02-09 | Standard Telephones Cables Ltd | Printed circuits |
| US4368281A (en) * | 1980-09-15 | 1983-01-11 | Amp Incorporated | Printed circuits |
| US4404237A (en) * | 1980-12-29 | 1983-09-13 | General Electric Company | Fabrication of electrical conductor by replacement of metallic powder in polymer with more noble metal |
| US4362903A (en) * | 1980-12-29 | 1982-12-07 | General Electric Company | Electrical conductor interconnect providing solderable connections to hard-to-contact substrates, such as liquid crystal cells |
| US4555414A (en) * | 1983-04-15 | 1985-11-26 | Polyonics Corporation | Process for producing composite product having patterned metal layer |
-
1985
- 1985-03-16 GB GB08506897A patent/GB2172438A/en not_active Withdrawn
-
1986
- 1986-03-14 NO NO860985A patent/NO860985L/no unknown
- 1986-03-14 DK DK120886A patent/DK120886A/da unknown
- 1986-03-14 FI FI861062A patent/FI861062A/fi not_active Application Discontinuation
- 1986-03-14 EP EP86301852A patent/EP0195612A3/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP0195612A3 (en) | 1987-09-16 |
| DK120886D0 (da) | 1986-03-14 |
| GB2172438A (en) | 1986-09-17 |
| GB8506897D0 (en) | 1985-04-17 |
| FI861062A0 (fi) | 1986-03-14 |
| FI861062A (fi) | 1986-09-17 |
| DK120886A (da) | 1986-09-17 |
| EP0195612A2 (en) | 1986-09-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5545927A (en) | Capped copper electrical interconnects | |
| US4362903A (en) | Electrical conductor interconnect providing solderable connections to hard-to-contact substrates, such as liquid crystal cells | |
| US5549808A (en) | Method for forming capped copper electrical interconnects | |
| US4606788A (en) | Methods of and apparatus for forming conductive patterns on a substrate | |
| US4404237A (en) | Fabrication of electrical conductor by replacement of metallic powder in polymer with more noble metal | |
| US6664485B2 (en) | Full additive process with filled plated through holes | |
| US3742597A (en) | Method for making a coated printed circuit board | |
| CN1112729C (zh) | 电子器件中的电连接结构和导体表面材料的形成方法 | |
| US4522888A (en) | Electrical conductors arranged in multiple layers | |
| US7332212B2 (en) | Circuitized substrate with conductive polymer and seed material adhesion layer | |
| US4470883A (en) | Additive printed circuit process | |
| US4829553A (en) | Chip type component | |
| US4416914A (en) | Electrical conductors arranged in multiple layers and preparation thereof | |
| US6132588A (en) | Method for plating independent conductor circuit | |
| JPH0141271B2 (fi) | ||
| US5545429A (en) | Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess | |
| US20040092136A1 (en) | Method and apparatus for electrolytic plating of surface metals | |
| US4622106A (en) | Methods for producing printed circuits | |
| NO860985L (no) | Elektrisk kretsanordning og fremgangsmaate for dens fremstilling. | |
| EP0083458A1 (en) | Method of partially metallising electrically conductive non-metallic patterns | |
| US4824693A (en) | Method for depositing a solderable metal layer by an electroless method | |
| KR970064329A (ko) | 회로 기판 및 그 형성 방법 | |
| US5075258A (en) | Method for plating tab leads in an assembled semiconductor package | |
| US6398935B1 (en) | Method for manufacturing pcb's | |
| US6086946A (en) | Method for electroless gold deposition in the presence of a palladium seeder and article produced thereby |