NO313355B1 - Elektrisk komponent og stigefilter - Google Patents
Elektrisk komponent og stigefilter Download PDFInfo
- Publication number
- NO313355B1 NO313355B1 NO19984636A NO984636A NO313355B1 NO 313355 B1 NO313355 B1 NO 313355B1 NO 19984636 A NO19984636 A NO 19984636A NO 984636 A NO984636 A NO 984636A NO 313355 B1 NO313355 B1 NO 313355B1
- Authority
- NO
- Norway
- Prior art keywords
- substrate
- main surface
- electrode
- component according
- pattern
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims description 68
- 239000004020 conductor Substances 0.000 claims description 23
- 230000010355 oscillation Effects 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000003292 glue Substances 0.000 claims description 9
- 239000010949 copper Substances 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 230000010287 polarization Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000013016 damping Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1028—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being held between spring terminals
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
- H03H9/58—Multiple crystal filters
- H03H9/60—Electric coupling means therefor
- H03H9/605—Electric coupling means therefor consisting of a ladder configuration
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/178—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator of a laminated structure of multiple piezoelectric layers with inner electrodes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Filters And Equalizers (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Forklifts And Lifting Vehicles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9287673A JPH11112280A (ja) | 1997-10-03 | 1997-10-03 | 電子部品およびラダーフィルタ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NO984636D0 NO984636D0 (no) | 1998-10-02 |
| NO984636L NO984636L (no) | 1999-04-06 |
| NO313355B1 true NO313355B1 (no) | 2002-09-16 |
Family
ID=17720244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO19984636A NO313355B1 (no) | 1997-10-03 | 1998-10-02 | Elektrisk komponent og stigefilter |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0907243A3 (ko) |
| JP (1) | JPH11112280A (ko) |
| KR (1) | KR100301717B1 (ko) |
| CN (1) | CN1213892A (ko) |
| NO (1) | NO313355B1 (ko) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111464148B (zh) * | 2020-04-20 | 2021-08-10 | 诺思(天津)微系统有限责任公司 | 滤波器元件和多工器以及通信设备 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58138115A (ja) * | 1982-02-12 | 1983-08-16 | Murata Mfg Co Ltd | チップ状圧電振動部品の製造方法 |
| US5235135A (en) * | 1992-02-14 | 1993-08-10 | Motorola, Inc. | Sealed electronic package providing in-situ metallization |
| US5459368A (en) * | 1993-08-06 | 1995-10-17 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device mounted module |
| JP3331893B2 (ja) * | 1996-02-22 | 2002-10-07 | 株式会社村田製作所 | 圧電共振子およびそれを用いたフィルタおよびａｍ受信回路 |
| DE69710670T2 (de) * | 1996-05-15 | 2002-08-14 | Tokin Corp., Sendai | Piezoelektrischer transformator |
| JPH10126202A (ja) * | 1996-10-23 | 1998-05-15 | Murata Mfg Co Ltd | 圧電共振子およびそれを用いた電子部品 |
-
1997
- 1997-10-03 JP JP9287673A patent/JPH11112280A/ja active Pending
-
1998
- 1998-09-04 EP EP98116804A patent/EP0907243A3/en not_active Withdrawn
- 1998-09-25 CN CN98120758A patent/CN1213892A/zh active Pending
- 1998-10-02 NO NO19984636A patent/NO313355B1/no unknown
- 1998-10-07 KR KR1019980041873A patent/KR100301717B1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0907243A2 (en) | 1999-04-07 |
| EP0907243A3 (en) | 2000-08-23 |
| KR19990036911A (ko) | 1999-05-25 |
| JPH11112280A (ja) | 1999-04-23 |
| NO984636L (no) | 1999-04-06 |
| KR100301717B1 (ko) | 2001-09-06 |
| CN1213892A (zh) | 1999-04-14 |
| NO984636D0 (no) | 1998-10-02 |
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