NO20025846D0 - Mikrobölgekrets - Google Patents
MikrobölgekretsInfo
- Publication number
- NO20025846D0 NO20025846D0 NO20025846A NO20025846A NO20025846D0 NO 20025846 D0 NO20025846 D0 NO 20025846D0 NO 20025846 A NO20025846 A NO 20025846A NO 20025846 A NO20025846 A NO 20025846A NO 20025846 D0 NO20025846 D0 NO 20025846D0
- Authority
- NO
- Norway
- Prior art keywords
- mikrobölgekrets
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P7/00—Resonators of the waveguide type
- H01P7/08—Strip line resonators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/04—Fixed joints
- H01P1/047—Strip line joints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
- H01P1/20327—Electromagnetic interstage coupling
- H01P1/20354—Non-comb or non-interdigital filters
- H01P1/20363—Linear resonators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1006—Non-printed filter
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/049—Wire bonding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Structure Of Printed Boards (AREA)
- Waveguides (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GBGB0108655.2A GB0108655D0 (en) | 2001-04-06 | 2001-04-06 | Microwave circuit |
PCT/IB2002/001201 WO2002082577A1 (en) | 2001-04-06 | 2002-04-04 | Microwave circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
NO20025846D0 true NO20025846D0 (no) | 2002-12-05 |
NO20025846L NO20025846L (no) | 2002-12-05 |
Family
ID=9912376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20025846A NO20025846L (no) | 2001-04-06 | 2002-12-05 | Mikrobölgekrets |
Country Status (8)
Country | Link |
---|---|
US (2) | US6833775B2 (no) |
EP (1) | EP1380066A1 (no) |
JP (1) | JP2004519961A (no) |
KR (1) | KR20030007854A (no) |
CN (1) | CN1251349C (no) |
GB (1) | GB0108655D0 (no) |
NO (1) | NO20025846L (no) |
WO (1) | WO2002082577A1 (no) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7262677B2 (en) * | 2004-10-25 | 2007-08-28 | Micro-Mobio, Inc. | Frequency filtering circuit for wireless communication devices |
KR100712419B1 (ko) * | 2006-06-08 | 2007-04-27 | 전자부품연구원 | 대역통과필터 |
JP4935828B2 (ja) * | 2007-02-01 | 2012-05-23 | 株式会社村田製作所 | チップ素子およびその製造方法 |
US8179304B2 (en) * | 2007-06-14 | 2012-05-15 | Kyocera Corporation | Direct-current blocking circuit, hybrid circuit device, transmitter, receiver, transmitter-receiver, and radar device |
KR100956243B1 (ko) * | 2007-12-27 | 2010-05-06 | 삼성전기주식회사 | 신호 제거 기능이 개선된 무선 신호 수신 장치 |
DE102011005145A1 (de) | 2011-03-04 | 2012-09-06 | Rohde & Schwarz Gmbh & Co. Kg | Leiterplattenanordnung für Millimeterwellen-Scanner |
DE102011089639A1 (de) * | 2011-12-22 | 2013-06-27 | Siemens Aktiengesellschaft | Schaltungsträger mit einer separaten HF-Schaltung und Verfahren zum Bestücken eines solchen Schaltungsträgers |
CN103354702B (zh) * | 2013-07-26 | 2016-05-25 | 东莞生益电子有限公司 | 微波电路板制作方法及该方法制得的电路板 |
KR102017159B1 (ko) * | 2018-03-12 | 2019-09-02 | 삼성전자주식회사 | 안테나 모듈 |
KR102431462B1 (ko) * | 2018-06-14 | 2022-08-11 | 삼성전자주식회사 | 도전성 패턴을 포함하는 안테나 및 그것을 포함하는 전자 장치 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3638148A (en) * | 1970-06-25 | 1972-01-25 | Collins Radio Co | Lid interaction protected shield enclosed dielectric mounted microstrip |
AU470870B2 (en) * | 1973-10-29 | 1976-04-01 | Matsushita Electric Industrial Co., Ltd. | Filters employing elements with distributed constants |
JPS5910004A (ja) * | 1982-07-09 | 1984-01-19 | Hitachi Ltd | 導波管マイクロストリツプ線路変換器 |
JPH03173201A (ja) * | 1989-12-01 | 1991-07-26 | Oki Electric Ind Co Ltd | ハイブリッドフィルタ |
US5202752A (en) * | 1990-05-16 | 1993-04-13 | Nec Corporation | Monolithic integrated circuit device |
FR2673041A1 (fr) * | 1991-02-19 | 1992-08-21 | Gemplus Card Int | Procede de fabrication de micromodules de circuit integre et micromodule correspondant. |
JPH05259720A (ja) * | 1992-03-12 | 1993-10-08 | Ngk Insulators Ltd | マイクロ波用共振器内蔵配線基板 |
GB2297652B (en) | 1995-02-03 | 1999-03-31 | Plessey Semiconductors Ltd | Microchip module assemblies |
US5717249A (en) * | 1995-04-05 | 1998-02-10 | Matsushita Electronics Corporation | RF power amplifying circuit device |
JPH1197902A (ja) * | 1997-09-18 | 1999-04-09 | Sumitomo Metal Smi Electron Devices Inc | 表面実装フィルタ |
US6057600A (en) * | 1997-11-27 | 2000-05-02 | Kyocera Corporation | Structure for mounting a high-frequency package |
JPH11340709A (ja) * | 1998-05-21 | 1999-12-10 | Murata Mfg Co Ltd | 回路基板およびそれを用いた電子装置 |
JP3129288B2 (ja) * | 1998-05-28 | 2001-01-29 | 日本電気株式会社 | マイクロ波集積回路マルチチップモジュール、マイクロ波集積回路マルチチップモジュールの実装構造 |
EP1293009A4 (en) * | 2000-06-09 | 2004-06-09 | Synergy Microwave Corproation | MULTI-LAYERED MICROWAVE CIRCUITS AND METHODS OF MAKING SAME |
-
2001
- 2001-04-06 GB GBGB0108655.2A patent/GB0108655D0/en not_active Ceased
-
2002
- 2002-04-02 US US10/114,498 patent/US6833775B2/en not_active Expired - Fee Related
- 2002-04-04 EP EP02722563A patent/EP1380066A1/en not_active Withdrawn
- 2002-04-04 KR KR1020027016496A patent/KR20030007854A/ko not_active Application Discontinuation
- 2002-04-04 WO PCT/IB2002/001201 patent/WO2002082577A1/en not_active Application Discontinuation
- 2002-04-04 CN CNB028010795A patent/CN1251349C/zh not_active Expired - Fee Related
- 2002-04-04 JP JP2002580430A patent/JP2004519961A/ja active Pending
- 2002-12-05 NO NO20025846A patent/NO20025846L/no not_active Application Discontinuation
-
2004
- 2004-11-12 US US10/988,152 patent/US7064632B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20020180567A1 (en) | 2002-12-05 |
GB0108655D0 (en) | 2001-05-30 |
KR20030007854A (ko) | 2003-01-23 |
CN1251349C (zh) | 2006-04-12 |
CN1460308A (zh) | 2003-12-03 |
EP1380066A1 (en) | 2004-01-14 |
JP2004519961A (ja) | 2004-07-02 |
US7064632B2 (en) | 2006-06-20 |
US20050212624A1 (en) | 2005-09-29 |
NO20025846L (no) | 2002-12-05 |
US6833775B2 (en) | 2004-12-21 |
WO2002082577A1 (en) | 2002-10-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |