NO20016008L - Pakkelösning for fingeravtrykksensor - Google Patents

Pakkelösning for fingeravtrykksensor

Info

Publication number
NO20016008L
NO20016008L NO20016008A NO20016008A NO20016008L NO 20016008 L NO20016008 L NO 20016008L NO 20016008 A NO20016008 A NO 20016008A NO 20016008 A NO20016008 A NO 20016008A NO 20016008 L NO20016008 L NO 20016008L
Authority
NO
Norway
Prior art keywords
fingerprint sensor
package solution
package
solution
fingerprint
Prior art date
Application number
NO20016008A
Other languages
English (en)
Other versions
NO20016008D0 (no
NO316776B1 (no
Inventor
Jon Nysaether
Original Assignee
Idex Asa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idex Asa filed Critical Idex Asa
Priority to NO20016008A priority Critical patent/NO316776B1/no
Publication of NO20016008D0 publication Critical patent/NO20016008D0/no
Priority to AU2002364494A priority patent/AU2002364494A1/en
Priority to PCT/NO2002/000467 priority patent/WO2003049012A2/en
Publication of NO20016008L publication Critical patent/NO20016008L/no
Publication of NO316776B1 publication Critical patent/NO316776B1/no

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Image Input (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
NO20016008A 2001-12-07 2001-12-07 Pakkelosning for fingeravtrykksensor NO316776B1 (no)

Priority Applications (3)

Application Number Priority Date Filing Date Title
NO20016008A NO316776B1 (no) 2001-12-07 2001-12-07 Pakkelosning for fingeravtrykksensor
AU2002364494A AU2002364494A1 (en) 2001-12-07 2002-12-06 Packaging solution, particularly for fingerprint sensor
PCT/NO2002/000467 WO2003049012A2 (en) 2001-12-07 2002-12-06 Packaging solution, particularly for fingerprint sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NO20016008A NO316776B1 (no) 2001-12-07 2001-12-07 Pakkelosning for fingeravtrykksensor

Publications (3)

Publication Number Publication Date
NO20016008D0 NO20016008D0 (no) 2001-12-07
NO20016008L true NO20016008L (no) 2003-06-10
NO316776B1 NO316776B1 (no) 2004-05-03

Family

ID=19913126

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20016008A NO316776B1 (no) 2001-12-07 2001-12-07 Pakkelosning for fingeravtrykksensor

Country Status (3)

Country Link
AU (1) AU2002364494A1 (no)
NO (1) NO316776B1 (no)
WO (1) WO2003049012A2 (no)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7697729B2 (en) 2004-01-29 2010-04-13 Authentec, Inc. System for and method of finger initiated actions
US7831070B1 (en) 2005-02-18 2010-11-09 Authentec, Inc. Dynamic finger detection mechanism for a fingerprint sensor
US8231056B2 (en) 2005-04-08 2012-07-31 Authentec, Inc. System for and method of protecting an integrated circuit from over currents
NO20083766L (no) * 2008-09-01 2010-03-02 Idex Asa Overflatesensor
NO20093601A1 (no) 2009-12-29 2011-06-30 Idex Asa Overflatesensor
US8866347B2 (en) 2010-01-15 2014-10-21 Idex Asa Biometric image sensing
US8421890B2 (en) 2010-01-15 2013-04-16 Picofield Technologies, Inc. Electronic imager using an impedance sensor grid array and method of making
CN109407862B (zh) 2012-04-10 2022-03-11 傲迪司威生物识别公司 生物计量感测
NO20131423A1 (no) 2013-02-22 2014-08-25 Idex Asa Integrert fingeravtrykksensor
NO336318B1 (no) 2013-07-12 2015-08-03 Idex Asa Overflatesensor
CN106575351B (zh) 2014-02-21 2019-12-13 傲迪司威生物识别公司 采用重叠的网格线和用于从网格线延伸感测表面的导电探头的传感器
US9342727B2 (en) 2014-03-04 2016-05-17 Apple Inc. Field shaping channels in a substrate above a biometric sensing device
US9779280B2 (en) 2014-12-24 2017-10-03 Idex Asa Fingerprint sensor employing an integrated noise rejection structure
US10395164B2 (en) * 2016-12-15 2019-08-27 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
US11610429B2 (en) 2016-12-15 2023-03-21 Fingerprint Cards Anacatum Ip Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
US11023702B2 (en) 2016-12-15 2021-06-01 Fingerprint Cards Ab Fingerprint sensing module and method for manufacturing the fingerprint sensing module
WO2019058259A1 (en) 2017-09-19 2019-03-28 Idex Asa DUAL-SIDED SENSOR MODULE SUITABLE FOR INTEGRATION IN ELECTRONIC DEVICES
EP3543897A1 (en) * 2018-03-19 2019-09-25 Nxp B.V. Fingerprint sensing device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4024335B2 (ja) * 1996-01-26 2007-12-19 ハリス コーポレイション 集積回路のダイを露出させる開口部を有する集積回路装置とその製造方法
US5920640A (en) * 1997-05-16 1999-07-06 Harris Corporation Fingerprint sensor and token reader and associated methods
NO304766B1 (no) * 1997-06-16 1999-02-08 Sintef Fingeravtrykksensor
US6512381B2 (en) * 1999-12-30 2003-01-28 Stmicroelectronics, Inc. Enhanced fingerprint detection

Also Published As

Publication number Publication date
NO20016008D0 (no) 2001-12-07
AU2002364494A1 (en) 2003-06-17
WO2003049012A3 (en) 2003-10-02
WO2003049012A2 (en) 2003-06-12
AU2002364494A8 (en) 2003-06-17
NO316776B1 (no) 2004-05-03

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Legal Events

Date Code Title Description
CHAD Change of the owner's name or address (par. 44 patent law, par. patentforskriften)

Owner name: IDEX ASA, NO

MM1K Lapsed by not paying the annual fees