NO20006000L - Husanordning for lasermodul - Google Patents

Husanordning for lasermodul

Info

Publication number
NO20006000L
NO20006000L NO20006000A NO20006000A NO20006000L NO 20006000 L NO20006000 L NO 20006000L NO 20006000 A NO20006000 A NO 20006000A NO 20006000 A NO20006000 A NO 20006000A NO 20006000 L NO20006000 L NO 20006000L
Authority
NO
Norway
Prior art keywords
module housing
laser module
laser
housing
module
Prior art date
Application number
NO20006000A
Other languages
English (en)
Other versions
NO20006000D0 (no
Inventor
Hans-Ludwig Althaus
Franz Auracher
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of NO20006000D0 publication Critical patent/NO20006000D0/no
Publication of NO20006000L publication Critical patent/NO20006000L/no

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4207Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
    • G02B6/4208Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback using non-reciprocal elements or birefringent plates, i.e. quasi-isolators
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4251Sealed packages
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4256Details of housings
    • G02B6/4257Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • G02B6/4259Details of housings having a supporting carrier or a mounting substrate or a mounting plate of the transparent type
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/4279Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236Fixing or mounting methods of the aligned elements
    • G02B6/424Mounting of the optical light guide
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • G02B6/4271Cooling with thermo electric cooling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/02208Mountings; Housings characterised by the shape of the housings
    • H01S5/02216Butterfly-type, i.e. with electrode pins extending horizontally from the housings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0225Out-coupling of light
    • H01S5/02251Out-coupling of light using optical fibres
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0225Out-coupling of light
    • H01S5/02255Out-coupling of light using beam deflecting elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/023Mount members, e.g. sub-mount members
    • H01S5/02325Mechanically integrated components on mount members or optical micro-benches
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/04Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042Electrical excitation ; Circuits therefor
    • H01S5/0428Electrical excitation ; Circuits therefor for applying pulses to the laser
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/06Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068Stabilisation of laser output parameters
    • H01S5/0683Stabilisation of laser output parameters by monitoring the optical output parameters

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Lasers (AREA)
NO20006000A 1998-05-27 2000-11-27 Husanordning for lasermodul NO20006000L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19823691A DE19823691A1 (de) 1998-05-27 1998-05-27 Gehäuseanordnung für Lasermodul
PCT/DE1999/001562 WO1999062150A2 (de) 1998-05-27 1999-05-27 Gehäuseanordnung für lasermodul

Publications (2)

Publication Number Publication Date
NO20006000D0 NO20006000D0 (no) 2000-11-27
NO20006000L true NO20006000L (no) 2000-11-27

Family

ID=7869085

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20006000A NO20006000L (no) 1998-05-27 2000-11-27 Husanordning for lasermodul

Country Status (6)

Country Link
US (1) US6422766B1 (no)
EP (1) EP1088378B1 (no)
CA (1) CA2333597A1 (no)
DE (2) DE19823691A1 (no)
NO (1) NO20006000L (no)
WO (1) WO1999062150A2 (no)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6845118B1 (en) * 1999-01-25 2005-01-18 Optical Communication Products, Inc. Encapsulated optoelectronic devices with controlled properties
DE10004411A1 (de) * 2000-02-02 2001-08-16 Infineon Technologies Ag Elektrooptisches Sende-/Empfangsmodul und Verfahren zu seiner Herstellung
JP2001264593A (ja) * 2000-03-22 2001-09-26 Sumitomo Electric Ind Ltd 光装置
US6697399B2 (en) * 2000-05-26 2004-02-24 The Furukawa Electric Co., Ltd. Semiconductor laser module with peltier module for regulating a temperature of a semiconductor laser chip
DE20020373U1 (de) * 2000-12-01 2002-04-04 Robert Bosch Gmbh, 70469 Stuttgart Kabelbaumstecker, insbesondere als planare Zweizellen-Grenzstromsonde mit angespritztem Deckelelement
US6781727B2 (en) * 2000-12-18 2004-08-24 Infineon Technologies Ag Configuration for operating an optical transmission or reception module at high data rates of up to 10 Gbit/s
JP2002221644A (ja) * 2001-01-26 2002-08-09 Auto Network Gijutsu Kenkyusho:Kk 光コネクタ及び光コネクタの実装取付部の構造
WO2002103867A1 (de) * 2001-06-15 2002-12-27 Infineon Technologies Ag Opto-elektronisches lasermodul
US7343535B2 (en) * 2002-02-06 2008-03-11 Avago Technologies General Ip Dte Ltd Embedded testing capability for integrated serializer/deserializers
WO2003076998A1 (de) * 2002-03-08 2003-09-18 Infineon Technologies Ag Optoelektronisches modul und steckeranordnung
DE10211677B4 (de) * 2002-03-15 2007-08-09 Mergeoptics Gmbh Anordnung zum Senden oder Empfangen von optischen Signalen
US6845121B2 (en) * 2002-06-15 2005-01-18 Intel Corporation Optical isolator apparatus and methods
DE10237403B4 (de) * 2002-08-12 2004-07-29 Infineon Technologies Ag Opto-elektronisches Sende- und/oder Empfangsmodul und optischer Stecker
DE10247315B4 (de) * 2002-10-10 2005-12-15 Schott Ag TO-Gehäuse für Hochfrequenzanwendungen - Verdrahtungsträger aus Keramik
US6969204B2 (en) * 2002-11-26 2005-11-29 Hymite A/S Optical package with an integrated lens and optical assemblies incorporating the package
US6921214B2 (en) * 2002-12-12 2005-07-26 Agilent Technologies, Inc. Optical apparatus and method for coupling output light from a light source to an optical waveguide
US6856717B2 (en) * 2003-03-24 2005-02-15 Hymite A/S Package with a light emitting device
US7255494B2 (en) * 2003-05-23 2007-08-14 Intel Corporation Low-profile package for housing an optoelectronic assembly
US6860652B2 (en) * 2003-05-23 2005-03-01 Intel Corporation Package for housing an optoelectronic assembly
JP4090401B2 (ja) * 2003-07-30 2008-05-28 日本オプネクスト株式会社 光送信モジュール
GB2405532B (en) * 2003-08-28 2007-03-21 Agilent Technologies Inc Open-back high speed package
EP1515364B1 (en) 2003-09-15 2016-04-13 Nuvotronics, LLC Device package and methods for the fabrication and testing thereof
US6982437B2 (en) * 2003-09-19 2006-01-03 Agilent Technologies, Inc. Surface emitting laser package having integrated optical element and alignment post
US6953990B2 (en) * 2003-09-19 2005-10-11 Agilent Technologies, Inc. Wafer-level packaging of optoelectronic devices
US20050063431A1 (en) * 2003-09-19 2005-03-24 Gallup Kendra J. Integrated optics and electronics
US20050063648A1 (en) * 2003-09-19 2005-03-24 Wilson Robert Edward Alignment post for optical subassemblies made with cylindrical rods, tubes, spheres, or similar features
US7520679B2 (en) * 2003-09-19 2009-04-21 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optical device package with turning mirror and alignment post
US20050213995A1 (en) * 2004-03-26 2005-09-29 Myunghee Lee Low power and low jitter optical receiver for fiber optic communication link
KR101266711B1 (ko) * 2005-08-09 2013-05-28 엘지디스플레이 주식회사 백 라이트 유닛 및 이를 이용한 액정모듈
CN100428591C (zh) * 2006-02-08 2008-10-22 中国科学院微电子研究所 高速率半导体光发射组件的封装结构及方法
DE102006045271B4 (de) * 2006-09-22 2012-12-06 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Verfahren zur Herstellung eines optischen Sende- und/oder Empfangsmoduls
DE102007062047A1 (de) 2007-12-21 2009-07-16 Osram Opto Semiconductors Gmbh Kompaktgehäuse
DE102009025166A1 (de) * 2009-06-12 2010-12-16 Schäfter + Kirchhoff GmbH Laserdiodenstrahlquelle
DE102011081417A1 (de) * 2011-08-23 2012-09-20 Siemens Ag Optoelektronisches Bauelement
JP5226856B1 (ja) * 2011-12-26 2013-07-03 株式会社フジクラ レーザモジュール及びその製造方法
US9667033B2 (en) 2012-02-10 2017-05-30 Nkt Photonics A/S Laser device
FI124197B (fi) * 2012-03-16 2014-04-30 Janesko Oy Mitta-anturi
DE102013104964A1 (de) 2013-05-14 2014-11-20 Micro-Hybrid Electronic Gmbh Hermetisch gasdichtes optoelektronisches oder elektrooptisches Bauteil sowie Verfahren zu seiner Herstellung
DE102013217796A1 (de) 2013-09-05 2015-03-05 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, optoelektronische Vorrichtung und Verfahren zum Herstellen einer optoelektronischen Vorrichtung
EP2860830B1 (en) * 2013-10-14 2021-03-17 Camlin Technologies (Switzerland) Limited Hermetically sealed container for laser device
US10319654B1 (en) * 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
US10598860B2 (en) * 2018-03-14 2020-03-24 Globalfoundries Inc. Photonic die fan out package with edge fiber coupling interface and related methods
US10679480B2 (en) 2018-03-22 2020-06-09 Paul L. Eckert Event indicator system
CN111211478A (zh) * 2018-11-22 2020-05-29 光宝电子(广州)有限公司 边射型激光的封装结构
CN111352192B (zh) * 2018-12-20 2021-08-10 青岛海信宽带多媒体技术有限公司 一种光模块
DE102019216924A1 (de) 2019-11-04 2021-05-06 Robert Bosch Gmbh Laseremitteranordnung sowie LiDAR-System
JP7518404B2 (ja) * 2022-07-29 2024-07-18 日亜化学工業株式会社 発光装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62124780A (ja) * 1985-11-26 1987-06-06 Hitachi Ltd 光半導体モジユ−ル
DE3729009A1 (de) * 1987-08-31 1989-03-09 Siemens Ag Lichtleitelement, insbesondere fuer lasersender in modulbauweise
US5011256A (en) * 1988-10-28 1991-04-30 E. I. Du Pont De Nemours And Company Package for an opto-electronic component
US4937660A (en) * 1988-12-21 1990-06-26 At&T Bell Laboratories Silicon-based mounting structure for semiconductor optical devices
JPH04782A (ja) * 1990-04-18 1992-01-06 Nec Corp 半導体レーザ用パッケージ
EP0463214B1 (de) * 1990-06-27 1995-09-13 Siemens Aktiengesellschaft Sende- und Empfangsmodul für eine bidirektionale optische Nachrichten- und Signalübertragung
GB9100815D0 (en) * 1991-01-15 1991-02-27 British Telecomm Coplanar waveguide ribbon
DE4106720A1 (de) * 1991-03-02 1991-09-05 Ant Nachrichtentech Anordnung zum einfuehren von optischen und elektrischen leitern in ein hermetisch dichtes gehaeuse
DE4112471A1 (de) * 1991-03-02 1992-10-22 Ant Nachrichtentech Anordnung zum einfuehren von optischen und elektrischen leitern in ein hermetisch dichtes gehaeuse
DE4110378A1 (de) * 1991-03-28 1992-10-01 Standard Elektrik Lorenz Ag Einrichtung mit einem traegerteil, einem halbleiterlaser und kontaktierungen
US5412748A (en) * 1992-12-04 1995-05-02 Kabushiki Kaisha Toshiba Optical semiconductor module
GB9303783D0 (en) * 1993-02-25 1993-04-14 Northern Telecom Ltd Injection laser and photosensor assembly
JP3110586B2 (ja) * 1993-06-04 2000-11-20 松下電子工業株式会社 半導体レーザ装置
DE4343494A1 (de) * 1993-12-20 1995-06-22 Sel Alcatel Ag HF-Zuführung für einen Laser in einem Lasermodul mit Peltierkühler
DE59308228D1 (de) * 1993-12-22 1998-04-09 Siemens Ag Sende- und Empfangsmodul für eine bidirektionale optische Nachrichten- und Signalübertragung
US6784511B1 (en) * 1994-01-20 2004-08-31 Fuji Electric Co., Ltd. Resin-sealed laser diode device
DE4431285C1 (de) * 1994-09-02 1995-12-07 Ant Nachrichtentech Lasermodul
JP2616469B2 (ja) * 1994-11-30 1997-06-04 日本電気株式会社 半導体レーザモジュール
DE19704502C1 (de) * 1997-02-06 1998-02-26 Siemens Ag Lasermodul mit Ankoppeloptik und Verfahren zur Feinjustierung der Ankoppeloptik

Also Published As

Publication number Publication date
DE59910353D1 (de) 2004-09-30
CA2333597A1 (en) 1999-12-02
US6422766B1 (en) 2002-07-23
WO1999062150A3 (de) 2000-01-13
EP1088378A2 (de) 2001-04-04
NO20006000D0 (no) 2000-11-27
DE19823691A1 (de) 1999-12-02
EP1088378B1 (de) 2004-08-25
WO1999062150A2 (de) 1999-12-02

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