GB9100815D0 - Coplanar waveguide ribbon - Google Patents

Coplanar waveguide ribbon

Info

Publication number
GB9100815D0
GB9100815D0 GB919100815A GB9100815A GB9100815D0 GB 9100815 D0 GB9100815 D0 GB 9100815D0 GB 919100815 A GB919100815 A GB 919100815A GB 9100815 A GB9100815 A GB 9100815A GB 9100815 D0 GB9100815 D0 GB 9100815D0
Authority
GB
United Kingdom
Prior art keywords
coplanar waveguide
waveguide ribbon
ribbon
coplanar
waveguide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
GB919100815A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
British Telecommunications PLC
Original Assignee
British Telecommunications PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Telecommunications PLC filed Critical British Telecommunications PLC
Priority to GB919100815A priority Critical patent/GB9100815D0/en
Publication of GB9100815D0 publication Critical patent/GB9100815D0/en
Priority to PCT/GB1992/000073 priority patent/WO1992013369A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/062—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
    • H01S5/06226—Modulation at ultra-high frequencies
GB919100815A 1991-01-15 1991-01-15 Coplanar waveguide ribbon Pending GB9100815D0 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB919100815A GB9100815D0 (en) 1991-01-15 1991-01-15 Coplanar waveguide ribbon
PCT/GB1992/000073 WO1992013369A1 (en) 1991-01-15 1992-01-14 Coplanar waveguide bridge

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB919100815A GB9100815D0 (en) 1991-01-15 1991-01-15 Coplanar waveguide ribbon

Publications (1)

Publication Number Publication Date
GB9100815D0 true GB9100815D0 (en) 1991-02-27

Family

ID=10688447

Family Applications (1)

Application Number Title Priority Date Filing Date
GB919100815A Pending GB9100815D0 (en) 1991-01-15 1991-01-15 Coplanar waveguide ribbon

Country Status (2)

Country Link
GB (1) GB9100815D0 (en)
WO (1) WO1992013369A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5402088A (en) * 1992-12-03 1995-03-28 Ail Systems, Inc. Apparatus for the interconnection of radio frequency (RF) monolithic microwave integrated circuits
FR2731308B1 (en) * 1995-03-01 1997-05-30 France Telecom MODULAR ASSEMBLY INCLUDING TWO ELECTRONICALLY CONNECTED ELECTRONIC CIRCUITS FOR THE TRANSMISSION OF A MICROWAVE SIGNAL
DE19641880A1 (en) * 1996-10-10 1998-04-16 Rosenberger Hochfrequenztech Probe unit for contacting planar microwave circuits
EP0961372B1 (en) * 1998-05-26 2002-07-10 Infineon Technologies AG High-frequency laser module and method for making the same
DE19823691A1 (en) 1998-05-27 1999-12-02 Siemens Ag Housing arrangement for laser module
GB0123475D0 (en) * 2001-09-28 2001-11-21 Agilent Technologies Inc Flexible electrical interconnector for optical fibre transceivers
CN109728391B (en) * 2018-12-29 2024-05-07 中国科学院半导体研究所 Defect ground structure coplanar waveguide-based laser

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4600907A (en) * 1985-03-07 1986-07-15 Tektronix, Inc. Coplanar microstrap waveguide interconnector and method of interconnection

Also Published As

Publication number Publication date
WO1992013369A1 (en) 1992-08-06

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