NO20002601L - Method and equipment for non-destructive determination of residual stresses by optical holographic interferometer technique - Google Patents

Method and equipment for non-destructive determination of residual stresses by optical holographic interferometer technique

Info

Publication number
NO20002601L
NO20002601L NO20002601A NO20002601A NO20002601L NO 20002601 L NO20002601 L NO 20002601L NO 20002601 A NO20002601 A NO 20002601A NO 20002601 A NO20002601 A NO 20002601A NO 20002601 L NO20002601 L NO 20002601L
Authority
NO
Norway
Prior art keywords
equipment
optical holographic
residual stresses
destructive determination
examination
Prior art date
Application number
NO20002601A
Other languages
Norwegian (no)
Other versions
NO20002601D0 (en
Inventor
John Petter Fjeldstad
Irina Evgenievna Fjeldstad
Leonid Michailovich Lobanov
Vjacheslav Avtonomovi Pivtorak
Nikolay Georgievich Kuvshinsky
Sergey Gavrilovi Andrushchenko
Vladimir Petrovich Kushniruk
Valeriy Aleksandrovich Pavlov
Vladimir Petrovich Loginov
Peter Dmitrievich Krotenko
Original Assignee
Holo Tech As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NO995312A external-priority patent/NO995312D0/en
Application filed by Holo Tech As filed Critical Holo Tech As
Priority to NO20002601A priority Critical patent/NO20002601L/en
Publication of NO20002601D0 publication Critical patent/NO20002601D0/en
Priority to RU2002113768/28A priority patent/RU2002113768A/en
Priority to PCT/NO2000/000347 priority patent/WO2001031289A1/en
Priority to JP2001538126A priority patent/JP4623907B2/en
Priority to AU13120/01A priority patent/AU1312001A/en
Priority to CN 00817976 priority patent/CN1270160C/en
Priority to EP00975012A priority patent/EP1226403A1/en
Publication of NO20002601L publication Critical patent/NO20002601L/en
Priority to NO20021836A priority patent/NO20021836L/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0047—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes measuring forces due to residual stresses
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/021—Interferometers using holographic techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Holo Graphy (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

Oppfinnelsen angår en fremgangsmåte og anordning for ikke-destruktiv testing av detaljer, maskinenheter og mekanismer, forskjellige materialer, and særlig en fremgangsmåte og anordning for ikke-destruktiv bestemmelse av egenspenninger som er basert på den optiske holografiske interferometriteknikken. Først registreres et hologram av undersøkelsesområdet av objektet i sin starttilstand. Deretter gjennomføres frigjøringen av egenspenningene i et undersøkelses-punkt i undersøkelsesområdet ved eksponering av overflaten av objektet til en høy-strøm elektrisk puls med rektangulær form. Til slutt lages et interferogram av det nøyaktig samme området av objektet, og egenspenningene ved undersøkelsesområdet bestemmes fra formen og størrelsen av kantene i interferogrammet.The invention relates to a method and apparatus for non-destructive testing of details, machine units and mechanisms, various materials, and more particularly to a method and apparatus for non-destructive determination of intrinsic voltages based on the optical holographic interferometry technique. First, a hologram of the examination area of the object in its initial state is registered. Thereafter, the release of the natural voltages at an examination point in the examination area is effected by exposing the surface of the object to a high-current electrical pulse of rectangular shape. Finally, an interferogram is made of the exact same area of the object, and the intrinsic stresses at the examination area are determined from the shape and size of the edges of the interferogram.

NO20002601A 1999-10-29 2000-05-19 Method and equipment for non-destructive determination of residual stresses by optical holographic interferometer technique NO20002601L (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
NO20002601A NO20002601L (en) 1999-10-29 2000-05-19 Method and equipment for non-destructive determination of residual stresses by optical holographic interferometer technique
RU2002113768/28A RU2002113768A (en) 1999-10-29 2000-10-19 Method and device for non-destructive real-time determination of residual stresses using optical holographic interferometry technology
PCT/NO2000/000347 WO2001031289A1 (en) 1999-10-29 2000-10-19 Method and device for real time non-destructive determination of residual stresses in objects by optical holographic interferometry technique
JP2001538126A JP4623907B2 (en) 1999-10-29 2000-10-19 Method and apparatus for real-time nondestructive measurement of residual stress in an object by optical hologram interferometry
AU13120/01A AU1312001A (en) 1999-10-29 2000-10-19 Method and device for real time non-destructive determination of residual stresses in objects by optical holographic interferometry technique
CN 00817976 CN1270160C (en) 1999-10-29 2000-10-19 Method and device for real non-destructive determination of residual stresses in objects by optical holographic interferometry technique
EP00975012A EP1226403A1 (en) 1999-10-29 2000-10-19 Method and device for real time non-destructive determination of residual stresses in objects by optical holographic interferometry technique
NO20021836A NO20021836L (en) 1999-10-29 2002-04-18 Holographic interferometric measurements

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NO995312A NO995312D0 (en) 1999-10-29 1999-10-29 Method and apparatus for non-destructive determination of residual stresses in objects by holographic interferometric technique
NO20002601A NO20002601L (en) 1999-10-29 2000-05-19 Method and equipment for non-destructive determination of residual stresses by optical holographic interferometer technique

Publications (2)

Publication Number Publication Date
NO20002601D0 NO20002601D0 (en) 2000-05-19
NO20002601L true NO20002601L (en) 2001-04-30

Family

ID=26649010

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20002601A NO20002601L (en) 1999-10-29 2000-05-19 Method and equipment for non-destructive determination of residual stresses by optical holographic interferometer technique

Country Status (7)

Country Link
EP (1) EP1226403A1 (en)
JP (1) JP4623907B2 (en)
CN (1) CN1270160C (en)
AU (1) AU1312001A (en)
NO (1) NO20002601L (en)
RU (1) RU2002113768A (en)
WO (1) WO2001031289A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6765677B1 (en) 2000-10-25 2004-07-20 Holotech A.S. Method and device for non-destructive real-time measurements of residual stresses in planar and non-planar objects

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE0300666D0 (en) * 2003-03-10 2003-03-10 Faahraeus Holographic Technolo Stress measurement
JP4328349B2 (en) 2006-11-29 2009-09-09 株式会社日立製作所 Residual stress measurement method and apparatus
JP2009014606A (en) * 2007-07-06 2009-01-22 Hitachi Ltd Residual stress measurement device and residual stress measuring technique
JP4488060B2 (en) * 2007-11-14 2010-06-23 富士ゼロックス株式会社 Non-moldable part detection device, non-moldable part detection system, non-moldable part detection program, and non-moldable part detection method
JP5356894B2 (en) * 2009-04-06 2013-12-04 ポリプラスチックス株式会社 Residual stress calculation method and residual stress distribution derivation method
GB201117343D0 (en) * 2011-10-07 2011-11-23 Airbus Uk Ltd Method and apparatus for measuring residual stresses in a component
CN102865948A (en) * 2012-09-27 2013-01-09 辽宁忠旺集团有限公司 Method for determining residual butt welding stress of aluminum alloy sheets
RU2523073C1 (en) * 2013-03-21 2014-07-20 Российская Федерация, от имени которой выступает Министерство промышленности и торговли Российской Федерации (Минпромторг России) Device for definition of mechanical strains at metal structure surface by feed of required amount of heat
TWI688755B (en) * 2014-05-29 2020-03-21 布朗大學 Optical system and methods for the determination of stress in a substrate, and computer storage medium having computer-executable instructions
CN104697467B (en) * 2015-02-12 2017-05-24 中北大学 Weld appearance shape based on line laser scanning and surface defect detection method
CN108181032B (en) * 2017-12-21 2020-11-03 重庆市铜梁区华亿来铝材加工厂 Residual stress detection method

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Publication number Priority date Publication date Assignee Title
US4249423A (en) * 1979-05-11 1981-02-10 General Electric Company Semi-nondestructive residual stress measurement
JPS61501046A (en) * 1984-01-05 1986-05-22 インダストリアル　ホログラフイツクス　インコ−ポレ−テツド Equipment for double exposure interferometric non-destructive testing
SU1758419A1 (en) 1990-05-30 1992-08-30 Институт Физико-Технических Проблем Севера Со Ан Ссср Method of determining residual stresses
JPH04186106A (en) * 1990-11-21 1992-07-02 Kowa Co Optical measuring method and device
JPH04223208A (en) * 1990-12-25 1992-08-13 Nippon Telegr & Teleph Corp <Ntt> Real-time deformation/shape analysis method and device
US5432595A (en) * 1993-07-13 1995-07-11 Pechersky; Martin J. Method for measuring residual stresses in materials by plastically deforming the material and interference pattern comparison
WO1995010023A1 (en) * 1993-10-05 1995-04-13 Kabushikigaisya Hutech Non-destructive inspection method for mechanical behaviour of article
US6040900A (en) * 1996-07-01 2000-03-21 Cybernet Systems Corporation Compact fiber-optic electronic laser speckle pattern shearography
US5920017A (en) * 1997-10-30 1999-07-06 Westinghouse Savannah River Company Thermal input control and enhancement for laser based residual stress measurements using liquid temperature indicating coatings

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6765677B1 (en) 2000-10-25 2004-07-20 Holotech A.S. Method and device for non-destructive real-time measurements of residual stresses in planar and non-planar objects

Also Published As

Publication number Publication date
RU2002113768A (en) 2004-01-27
NO20002601D0 (en) 2000-05-19
CN1415066A (en) 2003-04-30
EP1226403A1 (en) 2002-07-31
CN1270160C (en) 2006-08-16
AU1312001A (en) 2001-05-08
WO2001031289A1 (en) 2001-05-03
JP2003514247A (en) 2003-04-15
JP4623907B2 (en) 2011-02-02

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