NO20002322D0 - Plastmateriale og ledende plastgjenstander - Google Patents
Plastmateriale og ledende plastgjenstanderInfo
- Publication number
- NO20002322D0 NO20002322D0 NO20002322A NO20002322A NO20002322D0 NO 20002322 D0 NO20002322 D0 NO 20002322D0 NO 20002322 A NO20002322 A NO 20002322A NO 20002322 A NO20002322 A NO 20002322A NO 20002322 D0 NO20002322 D0 NO 20002322D0
- Authority
- NO
- Norway
- Prior art keywords
- plastic
- conductive
- articles
- plastic material
- resin matrix
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
- Conductive Materials (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19749955 | 1997-11-03 | ||
PCT/DE1998/003280 WO1999023153A2 (de) | 1997-11-03 | 1998-11-03 | Kunststoffmaterial und leitfähiger kunststoffgegenstand |
Publications (2)
Publication Number | Publication Date |
---|---|
NO20002322D0 true NO20002322D0 (no) | 2000-05-02 |
NO312903B1 NO312903B1 (no) | 2002-07-15 |
Family
ID=7848378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20002322A NO312903B1 (no) | 1997-11-03 | 2000-05-02 | Plastmateriale og ledende plastgjenstand |
Country Status (14)
Country | Link |
---|---|
EP (1) | EP1034214B1 (no) |
JP (1) | JP2001522896A (no) |
KR (1) | KR20010031764A (no) |
CN (1) | CN100358941C (no) |
AT (1) | ATE269374T1 (no) |
AU (1) | AU739520B2 (no) |
CA (1) | CA2309075A1 (no) |
DE (2) | DE19881648D2 (no) |
HU (1) | HUP0004086A3 (no) |
IL (1) | IL135903A0 (no) |
NO (1) | NO312903B1 (no) |
RU (1) | RU2207353C2 (no) |
TR (1) | TR200001108T2 (no) |
WO (1) | WO1999023153A2 (no) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4054969B2 (ja) * | 2002-05-20 | 2008-03-05 | 信越化学工業株式会社 | 導電性組成物 |
US7553908B1 (en) | 2003-01-30 | 2009-06-30 | Prc Desoto International, Inc. | Preformed compositions in shaped form comprising polymer blends |
CN100515716C (zh) * | 2003-06-18 | 2009-07-22 | 鸿富锦精密工业(深圳)有限公司 | 便携式电子装置外壳及其制造方法 |
DE10332009B4 (de) | 2003-07-14 | 2008-01-31 | Infineon Technologies Ag | Halbleiterbauelement mit elektromagnetischer Abschirmvorrichtung |
CN1307856C (zh) * | 2003-08-06 | 2007-03-28 | 鸿富锦精密工业(深圳)有限公司 | 便携式电子装置外壳及其制造方法 |
US20050245695A1 (en) | 2004-04-30 | 2005-11-03 | Cosman Michael A | Polymer blend and compositions and methods for using the same |
JP4803350B2 (ja) * | 2005-06-03 | 2011-10-26 | 信越化学工業株式会社 | 圧着性異方導電性樹脂組成物及び微細電極の接続方法 |
JP4535289B2 (ja) * | 2006-10-26 | 2010-09-01 | 信越化学工業株式会社 | 導電性組成物 |
CN101685764B (zh) * | 2008-09-23 | 2011-11-30 | 海华科技股份有限公司 | 系统级封装模块结构的制造方法 |
DE102015103118A1 (de) * | 2014-10-06 | 2016-04-07 | Siltectra Gmbh | Splitting-Verfahren und Verwendung eines Materials in einem Splitting-Verfahren |
EP3464435B1 (de) | 2016-05-25 | 2020-11-18 | Basf Se | Hohlpartikel aus thermoplastischen elastomeren und poröse formkörper |
CN109651799A (zh) * | 2018-12-19 | 2019-04-19 | 航天科工武汉磁电有限责任公司 | 吸波贴片、其制备方法及其应用 |
CN117637237B (zh) * | 2024-01-24 | 2024-04-26 | 北京泰派斯特电子技术有限公司 | 一种双色金属骨架复合导电橡胶 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4621024A (en) * | 1984-12-31 | 1986-11-04 | Paper Applications International, Inc. | Metal-coated hollow microspheres |
US5275880A (en) * | 1989-05-17 | 1994-01-04 | Minnesota Mining And Manufacturing Company | Microwave absorber for direct surface application |
US5904978A (en) * | 1995-12-15 | 1999-05-18 | W. L. Gore & Associates, Inc. | Electrically conductive polytetrafluoroethylene article |
EP1030880A1 (de) * | 1997-11-03 | 2000-08-30 | Helmut Kahl | Elektrisch leitfähiger füllstoff und verfahren zu dessen herstellung |
-
1998
- 1998-11-03 HU HU0004086A patent/HUP0004086A3/hu unknown
- 1998-11-03 DE DE19881648T patent/DE19881648D2/de not_active Expired - Fee Related
- 1998-11-03 DE DE59811587T patent/DE59811587D1/de not_active Expired - Lifetime
- 1998-11-03 TR TR2000/01108T patent/TR200001108T2/xx unknown
- 1998-11-03 JP JP2000519022A patent/JP2001522896A/ja active Pending
- 1998-11-03 CA CA002309075A patent/CA2309075A1/en not_active Abandoned
- 1998-11-03 AT AT98965063T patent/ATE269374T1/de not_active IP Right Cessation
- 1998-11-03 AU AU20453/99A patent/AU739520B2/en not_active Ceased
- 1998-11-03 CN CNB988127830A patent/CN100358941C/zh not_active Expired - Lifetime
- 1998-11-03 RU RU2000114190/04A patent/RU2207353C2/ru active
- 1998-11-03 IL IL13590398A patent/IL135903A0/xx unknown
- 1998-11-03 EP EP98965063A patent/EP1034214B1/de not_active Expired - Lifetime
- 1998-11-03 WO PCT/DE1998/003280 patent/WO1999023153A2/de active IP Right Grant
- 1998-11-03 KR KR1020007004829A patent/KR20010031764A/ko active IP Right Grant
-
2000
- 2000-05-02 NO NO20002322A patent/NO312903B1/no not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
NO312903B1 (no) | 2002-07-15 |
AU2045399A (en) | 1999-05-24 |
CN1283214A (zh) | 2001-02-07 |
EP1034214B1 (de) | 2004-06-16 |
AU739520B2 (en) | 2001-10-11 |
IL135903A0 (en) | 2001-05-20 |
HUP0004086A3 (en) | 2006-04-28 |
WO1999023153A3 (de) | 1999-07-08 |
TR200001108T2 (tr) | 2000-08-21 |
ATE269374T1 (de) | 2004-07-15 |
EP1034214A2 (de) | 2000-09-13 |
DE19881648D2 (de) | 2001-05-10 |
CN100358941C (zh) | 2008-01-02 |
KR20010031764A (ko) | 2001-04-16 |
CA2309075A1 (en) | 1999-05-14 |
JP2001522896A (ja) | 2001-11-20 |
HUP0004086A1 (en) | 2001-03-28 |
WO1999023153A2 (de) | 1999-05-14 |
RU2207353C2 (ru) | 2003-06-27 |
DE59811587D1 (de) | 2004-07-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM1K | Lapsed by not paying the annual fees |