NO20000081L - FremgangsmÕte for oppvarming av et trykt kretskort, samt trykt kretskort som omfatter et varmeelement - Google Patents

FremgangsmÕte for oppvarming av et trykt kretskort, samt trykt kretskort som omfatter et varmeelement

Info

Publication number
NO20000081L
NO20000081L NO20000081A NO20000081A NO20000081L NO 20000081 L NO20000081 L NO 20000081L NO 20000081 A NO20000081 A NO 20000081A NO 20000081 A NO20000081 A NO 20000081A NO 20000081 L NO20000081 L NO 20000081L
Authority
NO
Norway
Prior art keywords
circuit board
printed circuit
heating
heat
conductor
Prior art date
Application number
NO20000081A
Other languages
English (en)
Other versions
NO20000081D0 (no
Inventor
Arto Isokoski
Jari Marjakangas
Original Assignee
Nokia Networks Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Networks Oy filed Critical Nokia Networks Oy
Publication of NO20000081L publication Critical patent/NO20000081L/no
Publication of NO20000081D0 publication Critical patent/NO20000081D0/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/062—Means for thermal insulation, e.g. for protection of parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09645—Patterning on via walls; Plural lands around one hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969—Apertured conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating processes for reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Foreliggende oppfinnelse angår en fremgangsmåte for oppvarming, og et trykt kretskort som omfatter et varmeelement (90) som genererer varme som er nødvendig for å oppvarme komponenter på et trykt kretskort. Det trykte kretskortet omfatter en varmeleder (40) mellom varmeelementet (90) og komponenten som skal oppvarmes, og varmelederen mottar varme generert av varmeelementet (90) og leder varmen langs det trykte krets-kortets overflate, under nedre overflate på komponenten som skal oppvarmes. Dessuten omfatter det trykte kretskortet lederdeler (15, 70) som er smalere enn varmelederen (40), eller som har et mindre tverrsnittsareal enn varmelederen har, og som begrenser varmeoverføring bort fra varmelederen (40) til en annen komponent enn den som skal oppvarmes, når varmelederen (40) fungerer som jordplan eller signalbane.
NO20000081A 1998-05-08 2000-01-07 Fremgangsmåte for oppvarming av et trykt kretskort, samt trykt kretskort som omfatter et varmeelement NO20000081D0 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI981032A FI981032A7 (fi) 1998-05-08 1998-05-08 Lämmitysmenetelmä ja piirilevy
PCT/FI1999/000373 WO1999059387A1 (en) 1998-05-08 1999-05-04 A heating method for a printed circuit board and a printed circuit board comprising a heating element

Publications (2)

Publication Number Publication Date
NO20000081L true NO20000081L (no) 2000-01-07
NO20000081D0 NO20000081D0 (no) 2000-01-07

Family

ID=8551687

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20000081A NO20000081D0 (no) 1998-05-08 2000-01-07 Fremgangsmåte for oppvarming av et trykt kretskort, samt trykt kretskort som omfatter et varmeelement

Country Status (8)

Country Link
US (1) US6184494B1 (no)
EP (1) EP0995346A1 (no)
JP (1) JP2002515654A (no)
CN (1) CN1269120A (no)
AU (1) AU3934599A (no)
FI (1) FI981032A7 (no)
NO (1) NO20000081D0 (no)
WO (1) WO1999059387A1 (no)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6082358A (en) * 1998-05-05 2000-07-04 1263152 Ontario Inc. Indicating device for aerosol container
JP2001185881A (ja) * 1999-12-22 2001-07-06 Nec Saitama Ltd 内部温度制御装置および内部温度制御方法
US6423939B1 (en) * 2000-10-02 2002-07-23 Agilent Technologies, Inc. Micro soldering method and apparatus
WO2002054489A2 (en) * 2000-12-29 2002-07-11 Advanced Micro Devices, Inc. Temperature measurement system and method
US6423940B1 (en) * 2001-03-02 2002-07-23 Agilent Technologies, Inc. Temperature stabilization scheme for a circuit board
CA2459902A1 (en) * 2001-09-10 2003-03-20 Microbridge Technologies Inc. Method for trimming resistors
EP1876608A3 (en) * 2001-09-10 2008-04-16 Microbridge Technologies Inc. Method for effective trimming of resistors using pulsed heating
US6911624B2 (en) * 2002-08-23 2005-06-28 Micron Technology, Inc. Component installation, removal, and replacement apparatus and method
CN100382666C (zh) * 2003-12-24 2008-04-16 华为技术有限公司 一种加热系统
DE202005001163U1 (de) * 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Leiterplatte oder Platine mit Heizdraht
CN101227808B (zh) * 2007-01-15 2011-05-18 研华股份有限公司 电路板的加热模块
FR2912029B1 (fr) * 2007-01-31 2010-10-22 Hispano Suiza Sa Carte electronique incorporant une resistance chauffante.
US9012811B2 (en) * 2012-01-13 2015-04-21 Viasystems Technologies Corp. L.L.C. Printed circuit board with embedded heater
US20130270255A1 (en) * 2012-04-17 2013-10-17 Gerald Ho Kim Silicon-Based Cooling Package With Preheating Capability For Compact Heat-Generating Devices
US8981259B2 (en) 2012-07-24 2015-03-17 Mildef Crete Inc. Heating apparatus for heating electronic components on a printed circuit board in low temperature environment
EP2693851A1 (en) * 2012-07-30 2014-02-05 Mildef Crete Inc. Heating apparatus for heating electronic components on a printed circuit board in low temperature environment
FR3037672B1 (fr) * 2015-06-16 2017-06-16 Parrot Drone comportant des moyens perfectionnes de compensation du biais de la centrale inertielle en fonction de la temperature
US10306776B1 (en) 2017-11-29 2019-05-28 Lam Research Corporation Substrate processing system printed-circuit control board assembly with one or more heater layers

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3440407A (en) * 1966-12-29 1969-04-22 Rca Corp Temperature controlled circuit boards
GB2038102B (en) * 1978-12-20 1982-12-15 Ferranti Ltd Circuit board temperature controller
JPS5635383A (en) * 1979-08-29 1981-04-08 Kyoto Ceramic Semiconductor integrated circuit support with heating mechanism
US4582975A (en) * 1983-04-04 1986-04-15 Honeywell Inc. Circuit chip
JPH01143164A (ja) * 1987-11-27 1989-06-05 Ibiden Co Ltd 表面実装用プリント配線板
JPH04206480A (ja) * 1990-11-30 1992-07-28 Hitachi Chem Co Ltd 表面回路付印刷配線板における表面実装用端子
US5466484A (en) * 1993-09-29 1995-11-14 Motorola, Inc. Resistor structure and method of setting a resistance value
GB9508631D0 (en) * 1995-04-28 1995-06-14 Smiths Industries Ltd Electrical circuits
FI965301L (fi) * 1996-12-31 1998-07-01 Nokia Telecommunications Oy Menetelmä ja järjestely komponentin lämmittämiseksi

Also Published As

Publication number Publication date
FI981032A0 (fi) 1998-05-08
US6184494B1 (en) 2001-02-06
CN1269120A (zh) 2000-10-04
JP2002515654A (ja) 2002-05-28
FI981032L (fi) 1999-11-09
FI981032A7 (fi) 1999-11-09
NO20000081D0 (no) 2000-01-07
AU3934599A (en) 1999-11-29
EP0995346A1 (en) 2000-04-26
WO1999059387A1 (en) 1999-11-18

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