NO20000081L - FremgangsmÕte for oppvarming av et trykt kretskort, samt trykt kretskort som omfatter et varmeelement - Google Patents
FremgangsmÕte for oppvarming av et trykt kretskort, samt trykt kretskort som omfatter et varmeelementInfo
- Publication number
- NO20000081L NO20000081L NO20000081A NO20000081A NO20000081L NO 20000081 L NO20000081 L NO 20000081L NO 20000081 A NO20000081 A NO 20000081A NO 20000081 A NO20000081 A NO 20000081A NO 20000081 L NO20000081 L NO 20000081L
- Authority
- NO
- Norway
- Prior art keywords
- circuit board
- printed circuit
- heating
- heat
- conductor
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title abstract 9
- 238000000034 method Methods 0.000 title abstract 2
- 239000004020 conductor Substances 0.000 abstract 7
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0212—Printed circuits or mounted components having integral heating means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/062—Means for thermal insulation, e.g. for protection of parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09772—Conductors directly under a component but not electrically connected to the component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Foreliggende oppfinnelse angår en fremgangsmåte for oppvarming, og et trykt kretskort som omfatter et varmeelement (90) som genererer varme som er nødvendig for å oppvarme komponenter på et trykt kretskort. Det trykte kretskortet omfatter en varmeleder (40) mellom varmeelementet (90) og komponenten som skal oppvarmes, og varmelederen mottar varme generert av varmeelementet (90) og leder varmen langs det trykte krets-kortets overflate, under nedre overflate på komponenten som skal oppvarmes. Dessuten omfatter det trykte kretskortet lederdeler (15, 70) som er smalere enn varmelederen (40), eller som har et mindre tverrsnittsareal enn varmelederen har, og som begrenser varmeoverføring bort fra varmelederen (40) til en annen komponent enn den som skal oppvarmes, når varmelederen (40) fungerer som jordplan eller signalbane.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FI981032A FI981032A (fi) | 1998-05-08 | 1998-05-08 | Lämmitysmenetelmä ja piirilevy |
PCT/FI1999/000373 WO1999059387A1 (en) | 1998-05-08 | 1999-05-04 | A heating method for a printed circuit board and a printed circuit board comprising a heating element |
Publications (2)
Publication Number | Publication Date |
---|---|
NO20000081D0 NO20000081D0 (no) | 2000-01-07 |
NO20000081L true NO20000081L (no) | 2000-01-07 |
Family
ID=8551687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO20000081A NO20000081L (no) | 1998-05-08 | 2000-01-07 | FremgangsmÕte for oppvarming av et trykt kretskort, samt trykt kretskort som omfatter et varmeelement |
Country Status (8)
Country | Link |
---|---|
US (1) | US6184494B1 (no) |
EP (1) | EP0995346A1 (no) |
JP (1) | JP2002515654A (no) |
CN (1) | CN1269120A (no) |
AU (1) | AU3934599A (no) |
FI (1) | FI981032A (no) |
NO (1) | NO20000081L (no) |
WO (1) | WO1999059387A1 (no) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6082358A (en) * | 1998-05-05 | 2000-07-04 | 1263152 Ontario Inc. | Indicating device for aerosol container |
JP2001185881A (ja) * | 1999-12-22 | 2001-07-06 | Nec Saitama Ltd | 内部温度制御装置および内部温度制御方法 |
US6423939B1 (en) * | 2000-10-02 | 2002-07-23 | Agilent Technologies, Inc. | Micro soldering method and apparatus |
WO2002054489A2 (en) * | 2000-12-29 | 2002-07-11 | Advanced Micro Devices, Inc. | Temperature measurement system and method |
US6423940B1 (en) * | 2001-03-02 | 2002-07-23 | Agilent Technologies, Inc. | Temperature stabilization scheme for a circuit board |
IL160779A0 (en) * | 2001-09-10 | 2004-08-31 | Microbridge Technologies Inc | Method for trimming resistors |
EP1876608A3 (en) * | 2001-09-10 | 2008-04-16 | Microbridge Technologies Inc. | Method for effective trimming of resistors using pulsed heating |
US6911624B2 (en) * | 2002-08-23 | 2005-06-28 | Micron Technology, Inc. | Component installation, removal, and replacement apparatus and method |
CN100382666C (zh) * | 2003-12-24 | 2008-04-16 | 华为技术有限公司 | 一种加热系统 |
DE202005001163U1 (de) * | 2005-01-24 | 2005-03-31 | Juma Leiterplattentechologie M | Leiterplatte oder Platine mit Heizdraht |
CN101227808B (zh) * | 2007-01-15 | 2011-05-18 | 研华股份有限公司 | 电路板的加热模块 |
FR2912029B1 (fr) * | 2007-01-31 | 2010-10-22 | Hispano Suiza Sa | Carte electronique incorporant une resistance chauffante. |
US9012811B2 (en) * | 2012-01-13 | 2015-04-21 | Viasystems Technologies Corp. L.L.C. | Printed circuit board with embedded heater |
US20130270255A1 (en) * | 2012-04-17 | 2013-10-17 | Gerald Ho Kim | Silicon-Based Cooling Package With Preheating Capability For Compact Heat-Generating Devices |
US8981259B2 (en) | 2012-07-24 | 2015-03-17 | Mildef Crete Inc. | Heating apparatus for heating electronic components on a printed circuit board in low temperature environment |
EP2693851A1 (en) * | 2012-07-30 | 2014-02-05 | Mildef Crete Inc. | Heating apparatus for heating electronic components on a printed circuit board in low temperature environment |
FR3037672B1 (fr) * | 2015-06-16 | 2017-06-16 | Parrot | Drone comportant des moyens perfectionnes de compensation du biais de la centrale inertielle en fonction de la temperature |
US10306776B1 (en) | 2017-11-29 | 2019-05-28 | Lam Research Corporation | Substrate processing system printed-circuit control board assembly with one or more heater layers |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3440407A (en) * | 1966-12-29 | 1969-04-22 | Rca Corp | Temperature controlled circuit boards |
GB2038102B (en) * | 1978-12-20 | 1982-12-15 | Ferranti Ltd | Circuit board temperature controller |
JPS5635383A (en) * | 1979-08-29 | 1981-04-08 | Kyoto Ceramic | Semiconductor integrated circuit support with heating mechanism |
US4582975A (en) * | 1983-04-04 | 1986-04-15 | Honeywell Inc. | Circuit chip |
JPH01143164A (ja) * | 1987-11-27 | 1989-06-05 | Ibiden Co Ltd | 表面実装用プリント配線板 |
JPH04206480A (ja) * | 1990-11-30 | 1992-07-28 | Hitachi Chem Co Ltd | 表面回路付印刷配線板における表面実装用端子 |
US5466484A (en) * | 1993-09-29 | 1995-11-14 | Motorola, Inc. | Resistor structure and method of setting a resistance value |
GB9508631D0 (en) * | 1995-04-28 | 1995-06-14 | Smiths Industries Ltd | Electrical circuits |
FI965301A (fi) * | 1996-12-31 | 1998-07-01 | Nokia Telecommunications Oy | Menetelmä ja järjestely komponentin lämmittämiseksi |
-
1998
- 1998-05-08 FI FI981032A patent/FI981032A/fi unknown
-
1999
- 1999-05-04 EP EP99922215A patent/EP0995346A1/en not_active Withdrawn
- 1999-05-04 JP JP2000549076A patent/JP2002515654A/ja active Pending
- 1999-05-04 WO PCT/FI1999/000373 patent/WO1999059387A1/en not_active Application Discontinuation
- 1999-05-04 AU AU39345/99A patent/AU3934599A/en not_active Abandoned
- 1999-05-04 CN CN99800709.9A patent/CN1269120A/zh active Pending
-
2000
- 2000-01-06 US US09/478,584 patent/US6184494B1/en not_active Expired - Fee Related
- 2000-01-07 NO NO20000081A patent/NO20000081L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
AU3934599A (en) | 1999-11-29 |
NO20000081D0 (no) | 2000-01-07 |
WO1999059387A1 (en) | 1999-11-18 |
JP2002515654A (ja) | 2002-05-28 |
US6184494B1 (en) | 2001-02-06 |
EP0995346A1 (en) | 2000-04-26 |
FI981032A0 (fi) | 1998-05-08 |
CN1269120A (zh) | 2000-10-04 |
FI981032A (fi) | 1999-11-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FC2A | Withdrawal, rejection or dismissal of laid open patent application |