NO169720C - Fremgangsmaate for fremstilling av herdbare harpikser og anvendelse av disse - Google Patents
Fremgangsmaate for fremstilling av herdbare harpikser og anvendelse av disseInfo
- Publication number
- NO169720C NO169720C NO880592A NO880592A NO169720C NO 169720 C NO169720 C NO 169720C NO 880592 A NO880592 A NO 880592A NO 880592 A NO880592 A NO 880592A NO 169720 C NO169720 C NO 169720C
- Authority
- NO
- Norway
- Prior art keywords
- resines
- hardenable
- procedure
- manufacturing
- hardenable resines
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
- C08G59/1461—Unsaturated monoacids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/066—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with chain extension or advancing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Epoxy Resins (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873704149 DE3704149A1 (de) | 1987-02-11 | 1987-02-11 | Durch bestrahlung haertbare harze, verfahren zu ihrer herstellung und verwendung |
Publications (4)
Publication Number | Publication Date |
---|---|
NO880592D0 NO880592D0 (no) | 1988-02-10 |
NO880592L NO880592L (no) | 1988-08-12 |
NO169720B NO169720B (no) | 1992-04-21 |
NO169720C true NO169720C (no) | 1992-07-29 |
Family
ID=6320703
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO880592A NO169720C (no) | 1987-02-11 | 1988-02-10 | Fremgangsmaate for fremstilling av herdbare harpikser og anvendelse av disse |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE3704149A1 (no) |
DK (1) | DK56288A (no) |
NO (1) | NO169720C (no) |
SE (2) | SE469474B (no) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0365844A3 (de) * | 1988-10-28 | 1991-02-06 | Siemens Aktiengesellschaft | Gut aushärtbarer Photolack |
DE4038895C2 (de) * | 1990-12-06 | 1998-07-02 | Harald Dr Mueller | Licht- und strahlungsempfindliche Gemische |
JP3331222B2 (ja) * | 1992-02-27 | 2002-10-07 | ジャパンエポキシレジン株式会社 | エポキシ樹脂及びエポキシ樹脂組成物 |
KR100342950B1 (ko) * | 1997-11-11 | 2002-10-19 | 가부시키가이샤 닛폰 쇼쿠바이 | 경화성수지및수지조성물 |
CN100358953C (zh) * | 2005-05-23 | 2008-01-02 | 容大油墨(惠州)有限公司 | 一种液态感光防焊油墨及其电路板 |
JP6557155B2 (ja) | 2015-02-02 | 2019-08-07 | 株式会社日本触媒 | 硬化性樹脂およびその製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3230560A1 (de) * | 1981-08-20 | 1983-05-05 | Hussain Kashif Dr. 8003 Zürich El-Ghatta | Polymere und verfahren zu deren herstellung |
DE3565546D1 (en) * | 1984-06-29 | 1988-11-17 | Siemens Ag | Thermostable and irradiation-curable polymer system based on bisphenol and epichlorohydrine, and method for its preparation |
-
1987
- 1987-02-11 DE DE19873704149 patent/DE3704149A1/de active Granted
-
1988
- 1988-01-07 SE SE8800023A patent/SE469474B/sv not_active IP Right Cessation
- 1988-02-04 DK DK56288A patent/DK56288A/da not_active Application Discontinuation
- 1988-02-10 NO NO880592A patent/NO169720C/no unknown
-
1991
- 1991-10-14 SE SE9102977A patent/SE9102977L/xx not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
NO880592D0 (no) | 1988-02-10 |
DK56288D0 (da) | 1988-02-04 |
DK56288A (da) | 1988-08-12 |
DE3704149A1 (de) | 1988-08-25 |
NO880592L (no) | 1988-08-12 |
SE9102977L (sv) | 1993-04-15 |
SE9102977D0 (sv) | 1991-10-14 |
NO169720B (no) | 1992-04-21 |
DE3704149C2 (no) | 1990-09-27 |
SE469474B (sv) | 1993-07-12 |
SE8800023D0 (sv) | 1988-01-07 |
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