NO134248B - - Google Patents

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Publication number
NO134248B
NO134248B NO742535A NO742535A NO134248B NO 134248 B NO134248 B NO 134248B NO 742535 A NO742535 A NO 742535A NO 742535 A NO742535 A NO 742535A NO 134248 B NO134248 B NO 134248B
Authority
NO
Norway
Prior art keywords
soldering
beryllium
strontium
antimony
barium
Prior art date
Application number
NO742535A
Other languages
Norwegian (no)
Other versions
NO134248C (en
NO742535L (en
Inventor
W Schultze
H Schoer
J Gobrecht
Original Assignee
Vaw Ver Aluminium Werke Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE2335940A external-priority patent/DE2335940B2/en
Priority claimed from DE19742412844 external-priority patent/DE2412844B1/en
Application filed by Vaw Ver Aluminium Werke Ag filed Critical Vaw Ver Aluminium Werke Ag
Publication of NO742535L publication Critical patent/NO742535L/no
Publication of NO134248B publication Critical patent/NO134248B/no
Publication of NO134248C publication Critical patent/NO134248C/no

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/28Selection of soldering or welding materials proper with the principal constituent melting at less than 950 degrees C
    • B23K35/286Al as the principal constituent

Description

Gjenstanden for BRD utlegningsskrift nr. I.962.76O er anvendelsen av en loddelegering, bestående av <*>l til 20% silicium og 0,01 til 10%, fortrinnsvis 0,05 til 2% av hvert av elementene wismut, strontium, barium og/eller antimon, resten aluminium og fremstillingsbetingede forurensninger, som loddemiddel til flussmiddelfri lodding av aluminiummaterialer i en ikke oksyderende atmos-fære resp. i et lavt vakuum. The object of BRD explanatory document no. I.962.760 is the use of a solder alloy, consisting of <*>1 to 20% silicon and 0.01 to 10%, preferably 0.05 to 2% of each of the elements bismuth, strontium, barium and/or antimony, the rest aluminum and manufacturing-related contaminants, as solder for flux-free soldering of aluminum materials in a non-oxidizing atmosphere or in a low vacuum.

Gjenstanden for BRD off. skrift nr. 2.1^3.965-6 The item for BRD off. writing No. 2.1^3.965-6

er et lodderniddel til f lussmiddelfri lodding av aluminiummaterialer, bestående av ^ til 20% silicium og 0,01 til 10%, fortrinnsvis 0,05 til 2% wismut, strontium, barium og/eller antimon, resten aluminium og fremstillingsbetingede forurensninger, hvis trekk består i at istedenfor eller sammen med wismut, strontium, barium og/eller antimon er det tilstede et innhold av beryllium i mengder fra 0,00001 - 1,0, fortrinnsvis 0,0002 - 0,1%. is a soldering iron for flux-free soldering of aluminum materials, consisting of ^ to 20% silicon and 0.01 to 10%, preferably 0.05 to 2% bismuth, strontium, barium and/or antimony, the rest aluminum and manufacturing-related impurities, whose features consists in that instead of or together with bismuth, strontium, barium and/or antimony, a content of beryllium is present in amounts from 0.00001 - 1.0, preferably 0.0002 - 0.1%.

Disse loddelegeringer har fått god innpass i praksis. These solder alloys have found good use in practice.

De stiller imidlertid ved lodning dessuten for-holdsvis store krav til nærvær av en ikke oksyderende atmosfære resp. et lavt vakuum. However, when soldering, they also make relatively high demands on the presence of a non-oxidizing atmosphere or a low vacuum.

Til grunn for oppfinnelsen ligger den oppgave å tilveiebringe loddelegeringer til lodding i en ikke oksyderende atmosfære resp. i et lavt vakuum, hvor det er mulig å nedsette nevnte krav. The invention is based on the task of providing soldering alloys for soldering in a non-oxidizing atmosphere or in a low vacuum, where it is possible to reduce said requirements.

Oppfinnelsens gjenstand er således anvendelse av The object of the invention is thus the application of

en loddelegering, bestående av H - 20% silicium og 0,01 til 10%, fortrinnsvis 0,05 til 2% av hvert av metallene wismut, strontium, barium og/eller antimon, eventuelt 0,00001 til 1,0, fortrinnsvis 0,0002 til 0,1% beryllium samt istedenfor eller fordelaktig sammen med disse elementer 0,0001 til 1%, fortrinnsvis 0,005 til 0,1% natrium, kalium og/eller litium, resten aluminium og frem- a solder alloy, consisting of H - 20% silicon and 0.01 to 10%, preferably 0.05 to 2% of each of the metals bismuth, strontium, barium and/or antimony, optionally 0.00001 to 1.0, preferably 0 .0002 to 0.1% beryllium and instead or advantageously together with these elements 0.0001 to 1%, preferably 0.005 to 0.1% sodium, potassium and/or lithium, the rest aluminum and

stillingsbetingede forurensninger som loddemiddel til flussmiddelfri lodding av aluminiummaterialer i en ikke oksyderende atmosfære resp. i et lavt vakuum. Forsøket har vist at ved anvendelse av disse loddemidler behøves det ikke mer å stilles så strenge krav som tidligere med hensyn til loddeatmosfærens oksygeninnhold resp. vakuumets høyde, mens det er oppnåelig like eller bedre resultater, som resp. som ifølge overnevnte søknader. position-related contaminants such as solder for flux-free soldering of aluminum materials in a non-oxidizing atmosphere or in a low vacuum. The experiment has shown that when using these solders, there is no longer any need to set as strict requirements as previously with regard to the oxygen content of the soldering atmosphere or the height of the vacuum, while equal or better results are achievable, as resp. as per the above applications.

Tilsetningen av alkalimetalier har vist seg spesielt gunstige.med hensyn til korrosjonsbestandighet av de loddede forbindelser, spesielt ved tilgang av fuktighet.. Dette gjelder i fremragende grad fremfor alt, når det foruten alkalimetall til loddemidlet dessuten settes beryllium. The addition of alkali metals has proven to be particularly beneficial with regard to the corrosion resistance of the soldered connections, especially when moisture is present.

Når man vurderer korrosjonsbestandigheten .med tall fra 0 til 5, idet med'0 er å forstå det tall som id»f>"H; resp. praktisk talt ikke er - oppnåelig, så er prøvene med tilsetning av. beryllium og alkalimetall å vurdere med 1, prøvene uten beryllium, me.n med alkalimetall med 2, og slike uten innhold av alkalimetall og beryllium med 3-When evaluating the corrosion resistance with a number from 0 to 5, with 0 being understood as the number that id»f>"H; or practically not - achievable, then the samples with the addition of beryllium and alkali metal are to be evaluated with 1, the samples without beryllium, i.e. with alkali metal with 2, and those without alkali metal and beryllium content with 3-

Det har vist seg hensiktsmessig å tilmåle den samlede mengde av legerlngselementene wismut, strontium, barium, antimon, beryllium og natrium til maksimalt 10%. It has proven appropriate to measure the total amount of the alloying elements bismuth, strontium, barium, antimony, beryllium and sodium to a maximum of 10%.

Claims (1)

Anvendelse av en loddelegering, bestå.ende av i| - 20% silicium og 0,01 til 10%, fortrinnsvis 0,05 til 2% av hvert av metallene wismut, strontium, barium og/eller antimon, eventuelt 0,00001 til 1,0, fortrinnsvis 0,0002 til 0,1% beryllium samt istedenfor eller fortrinnsvis sammen med disse elementer 0,0001 til 1%, fortrinnsvis 0,005 til 0,1% natrium, kalium og/eller litium, resten aluminium og fremstillingsbetingede forurensninger, som loddemiddel til flussmiddelfri lodding av aluminiummaterialer i en ikke oksyderende atmosfære resp. i et lavt vakuum.Application of a soldering alloy, consisting of i| - 20% silicon and 0.01 to 10%, preferably 0.05 to 2% of each of the metals bismuth, strontium, barium and/or antimony, optionally 0.00001 to 1.0, preferably 0.0002 to 0.1 % beryllium as well as instead of or preferably together with these elements 0.0001 to 1%, preferably 0.005 to 0.1% sodium, potassium and/or lithium, the rest aluminum and production-related impurities, as solder for flux-free soldering of aluminum materials in a non-oxidizing atmosphere respectively in a low vacuum.
NO742535A 1973-07-14 1974-07-11 NO134248C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2335940A DE2335940B2 (en) 1973-07-14 1973-07-14 Use of a solder alloy
DE19742412844 DE2412844B1 (en) 1974-03-18 1974-03-18 Use of a solder alloy

Publications (3)

Publication Number Publication Date
NO742535L NO742535L (en) 1975-02-10
NO134248B true NO134248B (en) 1976-05-31
NO134248C NO134248C (en) 1976-09-08

Family

ID=25765493

Family Applications (1)

Application Number Title Priority Date Filing Date
NO742535A NO134248C (en) 1973-07-14 1974-07-11

Country Status (12)

Country Link
JP (1) JPS5070251A (en)
AT (1) AT333096B (en)
CA (1) CA1051693A (en)
CH (1) CH562653A5 (en)
DK (1) DK140687B (en)
FR (1) FR2236608B2 (en)
GB (1) GB1480502A (en)
IT (1) IT1046934B (en)
LU (1) LU70516A1 (en)
NL (1) NL7409347A (en)
NO (1) NO134248C (en)
SE (1) SE412180C (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5330448A (en) * 1976-09-02 1978-03-22 Sumitomo Light Metal Ind Brazing aluminum alloy clad with pseudooanode effect
DE3166780D1 (en) * 1980-04-29 1984-11-29 Marston Palmer Ltd A sheet of foil, clad sheet of aluminium and method of brazing using a strontium containing brazing alloy
JPS58113347A (en) * 1981-12-25 1983-07-06 Kobe Steel Ltd Heat exchanger made of brazed aluminum
JPS60206597A (en) * 1984-03-30 1985-10-18 Sumitomo Precision Prod Co Ltd Aluminum alloy solder
JP6188511B2 (en) * 2013-09-20 2017-08-30 株式会社Uacj Aluminum alloy brazing sheet for fluxless brazing and manufacturing method thereof
CA3000886C (en) * 2015-10-05 2019-03-26 Hydro Aluminium Rolled Products Gmbh Aluminum composite material for use in thermal flux-free joining methods and method for producing same
CA3000882C (en) * 2015-10-05 2019-03-26 Hydro Aluminium Rolled Products Gmbh Aluminium composite material for use in thermal flux-free joining methods and method for producing same

Also Published As

Publication number Publication date
GB1480502A (en) 1977-07-20
DK140687B (en) 1979-10-29
DK376074A (en) 1975-03-10
LU70516A1 (en) 1974-11-28
NO134248C (en) 1976-09-08
IT1046934B (en) 1980-07-31
FR2236608B2 (en) 1980-03-28
ATA563574A (en) 1976-02-15
AT333096B (en) 1976-11-10
SE412180B (en) 1980-02-25
CH562653A5 (en) 1975-06-13
NL7409347A (en) 1975-01-16
DK140687C (en) 1980-03-24
JPS5070251A (en) 1975-06-11
CA1051693A (en) 1979-04-03
NO742535L (en) 1975-02-10
SE7409156L (en) 1975-01-15
SE412180C (en) 1981-09-17
FR2236608A2 (en) 1975-02-07

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