NO125120B - - Google Patents

Download PDF

Info

Publication number
NO125120B
NO125120B NO1622/69A NO162269A NO125120B NO 125120 B NO125120 B NO 125120B NO 1622/69 A NO1622/69 A NO 1622/69A NO 162269 A NO162269 A NO 162269A NO 125120 B NO125120 B NO 125120B
Authority
NO
Norway
Prior art keywords
rails
semiconductor elements
rail
cladding
semiconductor
Prior art date
Application number
NO1622/69A
Other languages
English (en)
Norwegian (no)
Inventor
G Mellgren
P Bylund
Original Assignee
Asea Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asea Ab filed Critical Asea Ab
Publication of NO125120B publication Critical patent/NO125120B/no

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
NO1622/69A 1968-04-23 1969-04-19 NO125120B (cs)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE05387/68A SE339716B (cs) 1968-04-23 1968-04-23

Publications (1)

Publication Number Publication Date
NO125120B true NO125120B (cs) 1972-07-17

Family

ID=20266361

Family Applications (1)

Application Number Title Priority Date Filing Date
NO1622/69A NO125120B (cs) 1968-04-23 1969-04-19

Country Status (6)

Country Link
DE (1) DE1917285B2 (cs)
DK (1) DK122296B (cs)
FI (1) FI47234C (cs)
GB (1) GB1255048A (cs)
NO (1) NO125120B (cs)
SE (1) SE339716B (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE340321B (cs) * 1970-03-23 1971-11-15 Asea Ab
DE2049012C3 (de) * 1970-09-30 1979-07-12 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Vorrichtung zum Einspannen eines scheibenförmigen Halbleiterbauelementes

Also Published As

Publication number Publication date
GB1255048A (en) 1971-11-24
DE1917285B2 (de) 1975-07-24
SE339716B (cs) 1971-10-18
FI47234B (cs) 1973-07-02
DK122296B (da) 1972-02-14
FI47234C (fi) 1973-10-10
DE1917285A1 (de) 1970-02-05

Similar Documents

Publication Publication Date Title
EP0886315B1 (fr) Module d'électronique de puissance et un dispositif d'électronique de puissance pourvu de tels modules
US5508560A (en) Semiconductor module
US3366171A (en) Heat sink for semi-conductor elements
EP0989794A3 (en) Surface mount thermal connections
US11212918B2 (en) Electrical assembly
JP2008300476A (ja) パワーモジュール
US10826266B2 (en) Refrigeration structure of semiconductor laser, and semiconductor laser and stack thereof
JPS6323660B2 (cs)
US3787958A (en) Thermo-electric modular structure and method of making same
NO125120B (cs)
CN101794742A (zh) 按照压力接触方式实施的功率半导体模块
US3703668A (en) Semiconductor device with semiconductor elements arranged side by side and provided with hollow cooling bodies
JP5548525B2 (ja) 冷却装置を備えて成る電流コンバータ装置構造を製造する方法
JPWO2017203650A1 (ja) 電力用半導体装置
US3270513A (en) Thermoelectric water cooler
JP6659863B2 (ja) Led照明モジュール及びledランプ
CN105047353B (zh) 一种低温下电绝缘传热部件
US4142577A (en) Cooling device for a liquid-cooled semiconductor power component
US3291648A (en) Multistage thermoelectric device
US3814633A (en) Thermo-electric modular structure and method of making same
JPH11233696A (ja) パワー半導体モジュール及びパワー半導体モジュールと冷却装置の接合体
AU2019201723B2 (en) Thermal conduction device and associated heat dissipation system
WO2021044698A1 (ja) 半導体レーザ装置
US6784676B2 (en) Pressurized electrical contact system
JP2017224751A (ja) 半導体装置