CN105047353B - 一种低温下电绝缘传热部件 - Google Patents
一种低温下电绝缘传热部件 Download PDFInfo
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- CN105047353B CN105047353B CN201510507877.4A CN201510507877A CN105047353B CN 105047353 B CN105047353 B CN 105047353B CN 201510507877 A CN201510507877 A CN 201510507877A CN 105047353 B CN105047353 B CN 105047353B
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- Prior art keywords
- sheet metal
- heat transfer
- metallic
- metallic gasket
- low temperature
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 82
- 239000002184 metal Substances 0.000 claims abstract description 82
- 125000006850 spacer group Chemical group 0.000 claims abstract description 15
- 239000004484 Briquette Substances 0.000 claims description 28
- 238000009413 insulation Methods 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000004809 Teflon Substances 0.000 claims description 6
- 229920006362 Teflon® Polymers 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910017083 AlN Inorganic materials 0.000 claims description 4
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 239000010980 sapphire Substances 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000003365 glass fiber Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 1
- 230000006835 compression Effects 0.000 abstract description 4
- 238000007906 compression Methods 0.000 abstract description 4
- 238000001816 cooling Methods 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 241001124569 Lycaenidae Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Landscapes
- Gasket Seals (AREA)
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510507877.4A CN105047353B (zh) | 2015-08-18 | 2015-08-18 | 一种低温下电绝缘传热部件 |
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CN201510507877.4A CN105047353B (zh) | 2015-08-18 | 2015-08-18 | 一种低温下电绝缘传热部件 |
Publications (2)
Publication Number | Publication Date |
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CN105047353A CN105047353A (zh) | 2015-11-11 |
CN105047353B true CN105047353B (zh) | 2017-04-12 |
Family
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Family Applications (1)
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CN201510507877.4A Active CN105047353B (zh) | 2015-08-18 | 2015-08-18 | 一种低温下电绝缘传热部件 |
Country Status (1)
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CN (1) | CN105047353B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105825992B (zh) * | 2016-04-26 | 2018-04-24 | 江苏大学 | 一种用于高温超导电流引线的冷却结构 |
CN107104293B (zh) * | 2017-04-26 | 2019-07-02 | 中国科学院合肥物质科学研究院 | 二低温超导电缆终端连接接头组件及其制作方法 |
CN113690009B (zh) * | 2021-09-06 | 2024-05-31 | 上海电气(集团)总公司智惠医疗装备分公司 | 一种电绝缘导冷结构 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002364798A (ja) * | 2001-06-06 | 2002-12-18 | Ishikawajima Harima Heavy Ind Co Ltd | 側壁熱シールド構造 |
CN101336066B (zh) * | 2007-06-29 | 2011-03-02 | 联想(北京)有限公司 | 一种散热器 |
JP2011149600A (ja) * | 2010-01-20 | 2011-08-04 | Sumitomo Heavy Ind Ltd | パルスチューブ冷凍機 |
CN102142312B (zh) * | 2010-12-24 | 2012-12-19 | 中国科学院等离子体物理研究所 | 用于高温超导大电流引线的叠片式高效气冷阻性换热器 |
JP5708253B2 (ja) * | 2011-05-30 | 2015-04-30 | 住友電気工業株式会社 | 超電導コイルおよび超電導マグネット |
CN202581951U (zh) * | 2012-01-11 | 2012-12-05 | 重庆市威尔试验仪器有限公司 | 双系统板片式换热装置 |
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2015
- 2015-08-18 CN CN201510507877.4A patent/CN105047353B/zh active Active
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Publication number | Publication date |
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CN105047353A (zh) | 2015-11-11 |
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PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
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GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Low-temperature electrical-insulating heat transfer component Effective date of registration: 20190725 Granted publication date: 20170412 Pledgee: Chengdu high investment financing Company limited by guarantee Pledgor: AllTech Medical Systems, LLC Registration number: 2019510000086 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231220 Granted publication date: 20170412 Pledgee: Chengdu high investment financing Company limited by guarantee Pledgor: ALLTECH MEDICAL SYSTEMS, LLC Registration number: 2019510000086 |