NO123439B - - Google Patents
Download PDFInfo
- Publication number
- NO123439B NO123439B NO4947/68A NO494768A NO123439B NO 123439 B NO123439 B NO 123439B NO 4947/68 A NO4947/68 A NO 4947/68A NO 494768 A NO494768 A NO 494768A NO 123439 B NO123439 B NO 123439B
- Authority
- NO
- Norway
- Prior art keywords
- nipple
- conical
- pipe
- hose
- tongues
- Prior art date
Links
- 239000002184 metal Substances 0.000 claims description 10
- 210000002445 nipple Anatomy 0.000 claims description 10
- 210000000481 breast Anatomy 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 210000002105 tongue Anatomy 0.000 claims 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
- H01L21/02639—Preparation of substrate for selective deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/043—Dual dielectric
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/051—Etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/10—Lift-off masking
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/122—Polycrystalline
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/969—Simultaneous formation of monocrystalline and polycrystalline regions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Element Separation (AREA)
- Quick-Acting Or Multi-Walled Pipe Joints (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7996167 | 1967-12-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
NO123439B true NO123439B (es) | 1971-11-15 |
Family
ID=13704886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NO4947/68A NO123439B (es) | 1967-12-12 | 1968-12-11 |
Country Status (10)
Country | Link |
---|---|
US (1) | US3692574A (es) |
AT (1) | AT283448B (es) |
BE (1) | BE725244A (es) |
CH (1) | CH486774A (es) |
DE (1) | DE1814029C3 (es) |
FR (1) | FR1593881A (es) |
GB (1) | GB1246294A (es) |
NL (1) | NL140101B (es) |
NO (1) | NO123439B (es) |
SE (1) | SE354382B (es) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4396933A (en) * | 1971-06-18 | 1983-08-02 | International Business Machines Corporation | Dielectrically isolated semiconductor devices |
US3928092A (en) * | 1974-08-28 | 1975-12-23 | Bell Telephone Labor Inc | Simultaneous molecular beam deposition of monocrystalline and polycrystalline III(a)-V(a) compounds to produce semiconductor devices |
US4022928A (en) * | 1975-05-22 | 1977-05-10 | Piwcyzk Bernhard P | Vacuum deposition methods and masking structure |
GB1520925A (en) * | 1975-10-06 | 1978-08-09 | Mullard Ltd | Semiconductor device manufacture |
EP0009910B1 (en) * | 1978-09-20 | 1985-02-13 | Fujitsu Limited | Semiconductor memory device and process for fabricating the device |
FR2525389A1 (fr) * | 1982-04-14 | 1983-10-21 | Commissariat Energie Atomique | Procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre |
US4477308A (en) * | 1982-09-30 | 1984-10-16 | At&T Bell Laboratories | Heteroepitaxy of multiconstituent material by means of a _template layer |
GB2228617A (en) * | 1989-02-27 | 1990-08-29 | Philips Electronic Associated | A method of manufacturing a semiconductor device having a mesa structure |
US5256594A (en) * | 1989-06-16 | 1993-10-26 | Intel Corporation | Masking technique for depositing gallium arsenide on silicon |
US6090646A (en) | 1993-05-26 | 2000-07-18 | Semiconductor Energy Laboratory Co., Ltd. | Method for producing semiconductor device |
KR100355938B1 (ko) | 1993-05-26 | 2002-12-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치제작방법 |
KR100186886B1 (ko) * | 1993-05-26 | 1999-04-15 | 야마자끼 승페이 | 반도체장치 제작방법 |
-
1968
- 1968-11-29 FR FR1593881D patent/FR1593881A/fr not_active Expired
- 1968-12-03 GB GB57279/68A patent/GB1246294A/en not_active Expired
- 1968-12-05 US US781542A patent/US3692574A/en not_active Expired - Lifetime
- 1968-12-05 AT AT11854/68A patent/AT283448B/de not_active IP Right Cessation
- 1968-12-09 NL NL686817602A patent/NL140101B/xx unknown
- 1968-12-09 CH CH1833168A patent/CH486774A/de not_active IP Right Cessation
- 1968-12-11 DE DE1814029A patent/DE1814029C3/de not_active Expired
- 1968-12-11 BE BE725244D patent/BE725244A/xx unknown
- 1968-12-11 NO NO4947/68A patent/NO123439B/no unknown
- 1968-12-12 SE SE17000/68A patent/SE354382B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
FR1593881A (es) | 1970-06-01 |
DE1814029A1 (de) | 1969-08-14 |
AT283448B (de) | 1970-08-10 |
GB1246294A (en) | 1971-09-15 |
CH486774A (de) | 1970-02-28 |
NL6817602A (es) | 1969-06-16 |
SE354382B (es) | 1973-03-05 |
US3692574A (en) | 1972-09-19 |
BE725244A (es) | 1969-05-16 |
DE1814029C3 (de) | 1979-08-23 |
NL140101B (nl) | 1973-10-15 |
DE1814029B2 (de) | 1978-02-09 |
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