NO120538B - - Google Patents
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- Publication number
- NO120538B NO120538B NO0232/68A NO23268A NO120538B NO 120538 B NO120538 B NO 120538B NO 0232/68 A NO0232/68 A NO 0232/68A NO 23268 A NO23268 A NO 23268A NO 120538 B NO120538 B NO 120538B
- Authority
- NO
- Norway
- Prior art keywords
- semiconductor body
- semiconductor
- ooo
- thickness
- semiconductor element
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 claims description 51
- 238000006073 displacement reaction Methods 0.000 claims description 21
- 238000005215 recombination Methods 0.000 claims description 19
- 230000006798 recombination Effects 0.000 claims description 19
- 239000000126 substance Substances 0.000 claims description 11
- 230000003247 decreasing effect Effects 0.000 claims description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 239000013078 crystal Substances 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims description 4
- 230000000717 retained effect Effects 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 18
- 229910052710 silicon Inorganic materials 0.000 description 17
- 239000010703 silicon Substances 0.000 description 17
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 230000000903 blocking effect Effects 0.000 description 8
- 238000001953 recrystallisation Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 2
- 238000005275 alloying Methods 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 240000001546 Byrsonima crassifolia Species 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- KMWBBMXGHHLDKL-UHFFFAOYSA-N [AlH3].[Si] Chemical compound [AlH3].[Si] KMWBBMXGHHLDKL-UHFFFAOYSA-N 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000004857 zone melting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/36—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the concentration or distribution of impurities in the bulk material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Thyristors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0107983 | 1967-01-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NO120538B true NO120538B (US20090163788A1-20090625-C00002.png) | 1970-11-02 |
Family
ID=7528495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO0232/68A NO120538B (US20090163788A1-20090625-C00002.png) | 1967-01-25 | 1968-01-19 |
Country Status (11)
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3860947A (en) * | 1970-03-19 | 1975-01-14 | Hiroshi Gamo | Thyristor with gold doping profile |
| US3668480A (en) * | 1970-07-21 | 1972-06-06 | Ibm | Semiconductor device having many fold iv characteristics |
| US3874956A (en) * | 1972-05-15 | 1975-04-01 | Mitsubishi Electric Corp | Method for making a semiconductor switching device |
| CH553480A (de) * | 1972-10-31 | 1974-08-30 | Siemens Ag | Tyristor. |
| DE2310570C3 (de) * | 1973-03-02 | 1980-08-07 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum Herstellen eines überkopfzündfesten Thyristors |
| US3988772A (en) * | 1974-05-28 | 1976-10-26 | General Electric Company | Current isolation means for integrated power devices |
| US3988771A (en) * | 1974-05-28 | 1976-10-26 | General Electric Company | Spatial control of lifetime in semiconductor device |
| US3988762A (en) * | 1974-05-28 | 1976-10-26 | General Electric Company | Minority carrier isolation barriers for semiconductor devices |
| DE2508802A1 (de) * | 1975-02-28 | 1976-09-09 | Siemens Ag | Verfahren zum abscheiden von elementarem silicium |
| JPS5942989B2 (ja) * | 1977-01-24 | 1984-10-18 | 株式会社日立製作所 | 高耐圧半導体素子およびその製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1052447A (US20090163788A1-20090625-C00002.png) * | 1962-09-15 | |||
| GB1060474A (en) * | 1963-03-27 | 1967-03-01 | Siemens Ag | The production of monocrystalline semiconductor bodies of silicon or germanium |
| DE1439347A1 (de) * | 1964-03-18 | 1968-11-07 | Siemens Ag | Verfahren zum Herstellen eines Halbleiterstromtores vom pnpn-Typ |
| US3356543A (en) * | 1964-12-07 | 1967-12-05 | Rca Corp | Method of decreasing the minority carrier lifetime by diffusion |
-
1967
- 1967-01-25 DE DE1614410A patent/DE1614410B2/de not_active Ceased
- 1967-11-17 CH CH1615067A patent/CH495630A/de not_active IP Right Cessation
- 1967-11-20 DK DK577367AA patent/DK116887B/da unknown
- 1967-11-20 AT AT1042467A patent/AT273300B/de active
-
1968
- 1968-01-15 FR FR1551485D patent/FR1551485A/fr not_active Expired
- 1968-01-19 NO NO0232/68A patent/NO120538B/no unknown
- 1968-01-22 NL NL6800940A patent/NL6800940A/xx unknown
- 1968-01-23 SE SE877/68A patent/SE323750B/xx unknown
- 1968-01-24 US US700189A patent/US3461359A/en not_active Expired - Lifetime
- 1968-01-24 BE BE709801D patent/BE709801A/xx not_active IP Right Cessation
- 1968-01-25 GB GB4051/68A patent/GB1200975A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| AT273300B (de) | 1969-08-11 |
| DE1614410A1 (de) | 1970-07-02 |
| FR1551485A (US20090163788A1-20090625-C00002.png) | 1968-12-27 |
| CH495630A (de) | 1970-08-31 |
| BE709801A (US20090163788A1-20090625-C00002.png) | 1968-07-24 |
| NL6800940A (US20090163788A1-20090625-C00002.png) | 1968-07-26 |
| DE1614410B2 (de) | 1973-12-13 |
| DK116887B (da) | 1970-02-23 |
| GB1200975A (en) | 1970-08-05 |
| US3461359A (en) | 1969-08-12 |
| SE323750B (US20090163788A1-20090625-C00002.png) | 1970-05-11 |
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