NL8402040A - Werkwijze voor continue vervaardiging van een gedrukt circuit, alsmede toepassing van dit circuit. - Google Patents

Werkwijze voor continue vervaardiging van een gedrukt circuit, alsmede toepassing van dit circuit. Download PDF

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Publication number
NL8402040A
NL8402040A NL8402040A NL8402040A NL8402040A NL 8402040 A NL8402040 A NL 8402040A NL 8402040 A NL8402040 A NL 8402040A NL 8402040 A NL8402040 A NL 8402040A NL 8402040 A NL8402040 A NL 8402040A
Authority
NL
Netherlands
Prior art keywords
substrate
micro
wires
electrically conductive
printed circuit
Prior art date
Application number
NL8402040A
Other languages
English (en)
Dutch (nl)
Original Assignee
Cortaillod Cables Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9290556&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=NL8402040(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cortaillod Cables Sa filed Critical Cortaillod Cables Sa
Publication of NL8402040A publication Critical patent/NL8402040A/nl

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H10W70/699—
    • H10W72/077—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H10W72/07141—
    • H10W72/07521—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/701—
    • H10W74/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
NL8402040A 1983-07-04 1984-06-28 Werkwijze voor continue vervaardiging van een gedrukt circuit, alsmede toepassing van dit circuit. NL8402040A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8311210 1983-07-04
FR8311210A FR2548857B1 (fr) 1983-07-04 1983-07-04 Procede de fabrication en continu d'une carte imprimee

Publications (1)

Publication Number Publication Date
NL8402040A true NL8402040A (nl) 1985-02-01

Family

ID=9290556

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8402040A NL8402040A (nl) 1983-07-04 1984-06-28 Werkwijze voor continue vervaardiging van een gedrukt circuit, alsmede toepassing van dit circuit.

Country Status (4)

Country Link
CH (1) CH656285A5 (cg-RX-API-DMAC10.html)
DE (1) DE3424241A1 (cg-RX-API-DMAC10.html)
FR (1) FR2548857B1 (cg-RX-API-DMAC10.html)
NL (1) NL8402040A (cg-RX-API-DMAC10.html)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2579798B1 (fr) * 1985-04-02 1990-09-28 Ebauchesfabrik Eta Ag Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede
FR2580416B1 (fr) * 1985-04-12 1987-06-05 Radiotechnique Compelec Procede et dispositif pour fabriquer une carte d'identification electronique
FR2615325A1 (fr) * 1987-05-15 1988-11-18 Neiman Sa Procede pour la realisation de composants de puissance destines a l'industrie automobile
US5304513A (en) * 1987-07-16 1994-04-19 Gao Gesellschaft Fur Automation Und Organisation Mbh Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame
DE3723547C2 (de) * 1987-07-16 1996-09-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
FR2620586A1 (fr) * 1987-09-14 1989-03-17 Em Microelectronic Marin Sa Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits
US4996629A (en) * 1988-11-14 1991-02-26 International Business Machines Corporation Circuit board with self-supporting connection between sides
EP0472766A1 (de) * 1990-08-30 1992-03-04 Siemens Aktiengesellschaft Verfahren zum Abdecken eines kontaktierten Halbleiterchips
FR2671418B1 (fr) * 1991-01-04 1995-03-24 Solais Procede pour la fabrication d'une carte a memoire et carte a memoire ainsi obtenue.
DE4326816A1 (de) * 1993-08-10 1995-02-16 Giesecke & Devrient Gmbh Elektronisches Modul für Karten und Herstellung eines solchen Moduls
EP0688051B1 (fr) * 1994-06-15 1999-09-15 De La Rue Cartes Et Systemes Procédé de fabrication et d'assemblage de carte à circuit intégré.
DE19532223C1 (de) * 1995-09-01 1996-11-21 Orga Kartensysteme Gmbh Chipkarte
FR2736740A1 (fr) * 1995-07-11 1997-01-17 Trt Telecom Radio Electr Procede de production et d'assemblage de carte a circuit integre et carte ainsi obtenue
PL327234A1 (en) * 1995-12-22 1998-12-07 Sempac Sa Method of making a chip card for contactless operation
ATE207243T1 (de) 1996-05-17 2001-11-15 Infineon Technologies Ag Trägerelement für einen halbleiterchip
US6077022A (en) * 1997-02-18 2000-06-20 Zevatech Trading Ag Placement machine and a method to control a placement machine
US6157870A (en) * 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
EP0923111B1 (de) 1997-12-07 2007-05-02 Oerlikon Assembly Equipment AG, Steinhausen Halbleiter-Montageeinrichtung mit einem hin und her geführten Chipgreifer
US6031242A (en) * 1998-01-23 2000-02-29 Zevatech, Inc. Semiconductor die in-flight registration and orientation method and apparatus
SG71189A1 (en) * 1998-01-26 2000-03-21 Esec Sa Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder
DE10318688A1 (de) * 2003-04-24 2004-11-25 W. C. Heraeus Gmbh & Co. Kg Verfahren zum Trennen der elektrischen Verbindungsknoten bei IC-Frames und Verfahren zur Herstellung eines elektronischen Bauteils sowie von Frames dafür
EP3726415A1 (en) * 2019-04-18 2020-10-21 Thales Dis France SA Security element on module

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3315133A (en) * 1965-09-29 1967-04-18 Motorola Inc Integrated circuit interconnect and method
US3448516A (en) * 1966-02-14 1969-06-10 Norman R Buck Method of preparing printed wiring
DE2151765C2 (de) * 1970-11-05 1983-06-16 Honeywell Information Systems Italia S.p.A., Caluso, Torino Verfahren zum Kontaktieren von integrierten Schaltungen mit Beam-Lead-Anschlüssen
FR2210882A1 (en) * 1972-12-15 1974-07-12 Fortin Laminating Corp Metal faced laminate - for making printed circuits
DE2214163A1 (de) * 1972-03-23 1973-10-11 Bosch Gmbh Robert Elektrische schaltungsanordnung
US4216577A (en) * 1975-12-31 1980-08-12 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card
FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
JPS548871A (en) * 1977-06-23 1979-01-23 Suwa Seikosha Kk Semiconductor device
DE2854271A1 (de) * 1977-12-14 1979-06-28 Fontainemelon Horlogerie Verfahren zur herstellung eines elektronischen moduls fuer uhren
DE2920012C2 (de) * 1979-05-17 1988-09-29 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
FR2487152A1 (fr) * 1980-07-17 1982-01-22 Ebauchesfabrik Eta Ag Procedes de fabrication d'un substrat et d'un module comprenant ce substrat
DE3051195C2 (de) * 1980-08-05 1997-08-28 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten

Also Published As

Publication number Publication date
FR2548857B1 (fr) 1987-11-27
FR2548857A1 (fr) 1985-01-11
DE3424241A1 (de) 1985-01-17
DE3424241C2 (cg-RX-API-DMAC10.html) 1992-05-14
CH656285A5 (fr) 1986-06-13

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BB A search report has been drawn up
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