NL8204404A - Afstandshouder voor het verhinderen van kortsluiting tussen geleidende platen in neerslaginrichtingen met radiofrequentieplasma. - Google Patents

Afstandshouder voor het verhinderen van kortsluiting tussen geleidende platen in neerslaginrichtingen met radiofrequentieplasma. Download PDF

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Publication number
NL8204404A
NL8204404A NL8204404A NL8204404A NL8204404A NL 8204404 A NL8204404 A NL 8204404A NL 8204404 A NL8204404 A NL 8204404A NL 8204404 A NL8204404 A NL 8204404A NL 8204404 A NL8204404 A NL 8204404A
Authority
NL
Netherlands
Prior art keywords
conductive
insulating spacer
conductive material
cylindrical piece
grooves
Prior art date
Application number
NL8204404A
Other languages
English (en)
Dutch (nl)
Original Assignee
Advanced Semiconductor Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Mat filed Critical Advanced Semiconductor Mat
Publication of NL8204404A publication Critical patent/NL8204404A/nl

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
NL8204404A 1981-11-12 1982-11-12 Afstandshouder voor het verhinderen van kortsluiting tussen geleidende platen in neerslaginrichtingen met radiofrequentieplasma. NL8204404A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32045381A 1981-11-12 1981-11-12
US32045381 1981-11-12

Publications (1)

Publication Number Publication Date
NL8204404A true NL8204404A (nl) 1983-06-01

Family

ID=23246502

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8204404A NL8204404A (nl) 1981-11-12 1982-11-12 Afstandshouder voor het verhinderen van kortsluiting tussen geleidende platen in neerslaginrichtingen met radiofrequentieplasma.

Country Status (5)

Country Link
JP (1) JPS607937B2 (ja)
DE (1) DE3235504A1 (ja)
FR (1) FR2516339B1 (ja)
GB (1) GB2109010B (ja)
NL (1) NL8204404A (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60211823A (ja) * 1984-04-06 1985-10-24 Agency Of Ind Science & Technol 薄膜半導体形成装置
US5527439A (en) * 1995-01-23 1996-06-18 The Boc Group, Inc. Cylindrical magnetron shield structure
DE102011109444A1 (de) * 2011-08-04 2013-02-07 Centrotherm Photovoltaics Ag Abstandselement für Platten eines Waferbootes
CN110660698B (zh) * 2018-06-28 2022-04-22 北京北方华创微电子装备有限公司 压环组件、工艺腔室和半导体处理设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3566185A (en) * 1969-03-12 1971-02-23 Atomic Energy Commission Sputter-type penning discharge for metallic ions
US4058748A (en) * 1976-05-13 1977-11-15 Hitachi, Ltd. Microwave discharge ion source
US4223048A (en) * 1978-08-07 1980-09-16 Pacific Western Systems Plasma enhanced chemical vapor processing of semiconductive wafers
US4287851A (en) * 1980-01-16 1981-09-08 Dozier Alfred R Mounting and excitation system for reaction in the plasma state

Also Published As

Publication number Publication date
JPS607937B2 (ja) 1985-02-28
DE3235504A1 (de) 1983-05-19
FR2516339A1 (fr) 1983-05-13
GB2109010B (en) 1985-11-20
FR2516339B1 (fr) 1986-04-11
JPS5884037A (ja) 1983-05-20
GB2109010A (en) 1983-05-25

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Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
A85 Still pending on 85-01-01
BB A search report has been drawn up
BV The patent application has lapsed