NL7405530A - - Google Patents

Info

Publication number
NL7405530A
NL7405530A NL7405530A NL7405530A NL7405530A NL 7405530 A NL7405530 A NL 7405530A NL 7405530 A NL7405530 A NL 7405530A NL 7405530 A NL7405530 A NL 7405530A NL 7405530 A NL7405530 A NL 7405530A
Authority
NL
Netherlands
Application number
NL7405530A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7405530A publication Critical patent/NL7405530A/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1435Expandable constructions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Vibration Prevention Devices (AREA)
NL7405530A 1973-06-18 1974-04-24 NL7405530A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00370901A US3833836A (en) 1973-06-18 1973-06-18 Printed circuit board package with cooling and vibration damping means

Publications (1)

Publication Number Publication Date
NL7405530A true NL7405530A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-12-20

Family

ID=23461648

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7405530A NL7405530A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-06-18 1974-04-24

Country Status (12)

Country Link
US (1) US3833836A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5032475A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
BE (1) BE814271A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA998159A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CH (1) CH585499A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2420739A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2233789A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1471309A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IL (1) IL44527A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT1014774B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL (1) NL7405530A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
SE (1) SE7407696L (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5538602Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1977-04-07 1980-09-09
DE2744341C2 (de) * 1977-10-01 1987-04-30 Teldix Gmbh, 6900 Heidelberg Anordnung zur Aufnahme von Leiterplatten mit hoher Vibrationsfestigkeit
JPS5538603Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1977-12-20 1980-09-09
US4184539A (en) * 1978-07-10 1980-01-22 The United States Of America As Represented By The Secretary Of The Navy Electronic card mount and heat transfer assembly for underwater vehicles
DE3310109A1 (de) * 1983-03-21 1984-09-27 Siemens AG, 1000 Berlin und 8000 München Isolierender abstandshalter fuer leiterplatten
US4823952A (en) * 1983-07-29 1989-04-25 Termiflex Corporation Modular packaging system, particularly for electronics
GB2186431B (en) * 1986-02-07 1989-11-01 Sperry Sun Inc Assemblies for supporting electrical circuit boards within tubes
DE69025624T2 (de) * 1989-12-22 1996-10-24 The Foxboro Co., Foxboro, Mass. Leichte anordnung für versiegelte schaltungsplatte
US5208729A (en) * 1992-02-14 1993-05-04 International Business Machines Corporation Multi-chip module
US5552209A (en) * 1994-07-29 1996-09-03 Minnesota Mining And Manufacturing Company Internally damped circuit articles
US5812374A (en) * 1996-10-28 1998-09-22 Shuff; Gregg Douglas Electrical circuit cooling device
DE19712099A1 (de) * 1997-03-22 1998-05-14 Bosch Gmbh Robert Gehäuse für ein elektrisches Gerät
RU2323556C1 (ru) * 2007-01-09 2008-04-27 Открытое акционерное общество "Климов" Радиоэлектронный блок
DE112008003655T5 (de) * 2008-01-31 2011-01-05 Hewlett-Packard Co., Fort Collins Modulare Datenverarbeitungskomponenten und -Systeme
US8098492B2 (en) * 2008-03-31 2012-01-17 Hewlett-Packard Development Company, L.P. Data processing modules and systems
DE102010063158A1 (de) * 2010-12-15 2012-06-21 Robert Bosch Gmbh Steuergerät und Verfahren zum Herstellen eines Steuergeräts
US8462510B2 (en) * 2011-05-11 2013-06-11 Taiwan Semiconductor Manufacturing Company, Ltd. Board-level package with tuned mass damping structure

Also Published As

Publication number Publication date
BE814271A (fr) 1974-08-16
AU6978874A (en) 1975-12-11
DE2420739A1 (de) 1975-01-09
IL44527A (en) 1976-09-30
JPS5032475A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1975-03-29
GB1471309A (en) 1977-04-21
IT1014774B (it) 1977-04-30
IL44527A0 (en) 1974-06-30
CA998159A (en) 1976-10-05
FR2233789A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1975-01-10
CH585499A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1977-02-28
US3833836A (en) 1974-09-03
SE7407696L (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-12-19

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