DE2744341C2 - - Google Patents

Info

Publication number
DE2744341C2
DE2744341C2 DE19772744341 DE2744341A DE2744341C2 DE 2744341 C2 DE2744341 C2 DE 2744341C2 DE 19772744341 DE19772744341 DE 19772744341 DE 2744341 A DE2744341 A DE 2744341A DE 2744341 C2 DE2744341 C2 DE 2744341C2
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19772744341
Other versions
DE2744341A1 (de
Inventor
Volker 6900 Heidelberg De Sillmann
Gerhard Dipl.-Ing. 6901 Gaiberg De Roeckl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rockwell Collins Deutschland GmbH
Original Assignee
Teldix GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teldix GmbH filed Critical Teldix GmbH
Priority to DE19772744341 priority Critical patent/DE2744341A1/de
Publication of DE2744341A1 publication Critical patent/DE2744341A1/de
Application granted granted Critical
Publication of DE2744341C2 publication Critical patent/DE2744341C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1435—Expandable constructions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H05K7/142—Spacers not being card guides

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
DE19772744341 1977-10-01 1977-10-01 Vorrichtung zur aufnahme von elektronik-leiterplatten Granted DE2744341A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19772744341 DE2744341A1 (de) 1977-10-01 1977-10-01 Vorrichtung zur aufnahme von elektronik-leiterplatten

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772744341 DE2744341A1 (de) 1977-10-01 1977-10-01 Vorrichtung zur aufnahme von elektronik-leiterplatten

Publications (2)

Publication Number Publication Date
DE2744341A1 DE2744341A1 (de) 1979-04-12
DE2744341C2 true DE2744341C2 (de) 1987-04-30

Family

ID=6020479

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772744341 Granted DE2744341A1 (de) 1977-10-01 1977-10-01 Vorrichtung zur aufnahme von elektronik-leiterplatten

Country Status (1)

Country Link
DE (1) DE2744341A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3331112A1 (de) * 1983-08-30 1985-03-14 Bodenseewerk Gerätetechnik GmbH, 7770 Überlingen Vorrichtung zur waermeabfuhr von leiterplatten
DE102007001407B4 (de) 2007-01-09 2016-02-25 Continental Automotive Gmbh Montageanordnung zur Fixierung übereinander angeordneter Leiterplatten in einem Gehäuse

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3479568A (en) * 1968-05-13 1969-11-18 Aerospace Res Instrument housing
DE2209632B2 (de) * 1972-02-29 1974-08-22 Rfe Raumfahrtelektronik Gmbh + Co Projektierung Entwicklung Fertigung, 8011 Goeggenhofen Steckkarten-Elektronikgehäuse, insbesondere für die Luft- und Raumfahrtelektronik
DD100379A1 (de) * 1972-11-15 1973-09-12
GB1458965A (en) * 1972-12-20 1976-12-22 Hawker Siddeley Dynamics Ltd Protection of boards carrying components especially electrical circuit boards carrying electronic components
US3833836A (en) * 1973-06-18 1974-09-03 Sanders Associates Inc Printed circuit board package with cooling and vibration damping means

Also Published As

Publication number Publication date
DE2744341A1 (de) 1979-04-12

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Legal Events

Date Code Title Description
OAM Search report available
OC Search report available
8110 Request for examination paragraph 44
8181 Inventor (new situation)

Free format text: SILLMANN, VOLKER, 6900 HEIDELBERG, DE ROECKL, GERHARD, DIPL.-ING., 6901 GAIBERG, DE

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee