NL7314375A - - Google Patents
Info
- Publication number
- NL7314375A NL7314375A NL7314375A NL7314375A NL7314375A NL 7314375 A NL7314375 A NL 7314375A NL 7314375 A NL7314375 A NL 7314375A NL 7314375 A NL7314375 A NL 7314375A NL 7314375 A NL7314375 A NL 7314375A
- Authority
- NL
- Netherlands
Links
Classifications
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- H10P14/683—
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- H10P14/6506—
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- H10P14/662—
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- H10P14/6922—
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- H10P95/00—
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- H10W72/012—
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- H10W74/147—
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
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- H10P14/69215—
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- H10W70/60—
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- H10W72/075—
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- H10W72/07533—
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- H10W72/07553—
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- H10W72/251—
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- H10W72/29—
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- H10W72/531—
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- H10W72/536—
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- H10W72/59—
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- H10W72/922—
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- H10W72/923—
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- H10W72/934—
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- H10W72/952—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47103588A JPS5131185B2 (en:Method) | 1972-10-18 | 1972-10-18 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| NL7314375A true NL7314375A (en:Method) | 1974-04-22 |
| NL163368B NL163368B (nl) | 1980-03-17 |
| NL163368C NL163368C (nl) | 1980-08-15 |
Family
ID=14357916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7314375.A NL163368C (nl) | 1972-10-18 | 1973-10-18 | Halfgeleiderinrichting met een polyimideharslaag. |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS5131185B2 (en:Method) |
| FR (1) | FR2209218B1 (en:Method) |
| GB (1) | GB1414245A (en:Method) |
| HK (1) | HK29979A (en:Method) |
| MY (1) | MY7900031A (en:Method) |
| NL (1) | NL163368C (en:Method) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4017886A (en) | 1972-10-18 | 1977-04-12 | Hitachi, Ltd. | Discrete semiconductor device having polymer resin as insulator and method for making the same |
| US5940732A (en) * | 1995-11-27 | 1999-08-17 | Semiconductor Energy Laboratory Co., | Method of fabricating semiconductor device |
| US6294799B1 (en) * | 1995-11-27 | 2001-09-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating same |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5421073B2 (en:Method) * | 1974-04-15 | 1979-07-27 | ||
| JPS516474A (en) * | 1974-07-05 | 1976-01-20 | Hitachi Ltd | Pureenakozono handotaisochi |
| JPS51102569A (en:Method) * | 1975-03-07 | 1976-09-10 | Hitachi Ltd | |
| JPS57115834A (en) * | 1981-01-10 | 1982-07-19 | Nec Corp | Manufacture of semiconductor device |
| JPS57160833A (en) * | 1981-03-27 | 1982-10-04 | Showa Aircraft Ind Co Ltd | Method of handling air cargo containers and pallets, conveyors and dollies for use in this method |
| US4758476A (en) * | 1984-12-12 | 1988-07-19 | Hitachi Chemical Company, Ltd. | Polyimide precursor resin composition and semiconductor device using the same |
| US5883422A (en) * | 1996-06-28 | 1999-03-16 | The Whitaker Corporation | Reduced parasitic capacitance semiconductor devices |
| JP2003151981A (ja) * | 2001-11-16 | 2003-05-23 | Shinko Electric Ind Co Ltd | 半導体装置およびその製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1230421A (en:Method) * | 1967-09-15 | 1971-05-05 |
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1972
- 1972-10-18 JP JP47103588A patent/JPS5131185B2/ja not_active Expired
-
1973
- 1973-10-17 GB GB4840673A patent/GB1414245A/en not_active Expired
- 1973-10-18 FR FR7337180A patent/FR2209218B1/fr not_active Expired
- 1973-10-18 NL NL7314375.A patent/NL163368C/xx not_active IP Right Cessation
-
1979
- 1979-05-10 HK HK299/79A patent/HK29979A/xx unknown
- 1979-12-30 MY MY31/79A patent/MY7900031A/xx unknown
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4017886A (en) | 1972-10-18 | 1977-04-12 | Hitachi, Ltd. | Discrete semiconductor device having polymer resin as insulator and method for making the same |
| US5940732A (en) * | 1995-11-27 | 1999-08-17 | Semiconductor Energy Laboratory Co., | Method of fabricating semiconductor device |
| US6294799B1 (en) * | 1995-11-27 | 2001-09-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating same |
| US6740599B2 (en) * | 1995-11-27 | 2004-05-25 | Shunpei Yamazaki | Method of fabricating contact holes in a semiconductor device |
| US6972263B2 (en) | 1995-11-27 | 2005-12-06 | Semiconductor Energy Laboratory Co., Ltd. | Fabricating a tapered hole incorporating a resinous silicon containing film |
| US7727898B2 (en) | 1995-11-27 | 2010-06-01 | Semiconductor Energy Laboratory Co., Ltd | Semiconductor device and method of fabricating same |
| US7786553B1 (en) | 1995-11-27 | 2010-08-31 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating semiconductor device |
| US7800235B2 (en) | 1995-11-27 | 2010-09-21 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating semiconductor device |
| US8283788B2 (en) | 1995-11-27 | 2012-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2209218B1 (en:Method) | 1978-05-26 |
| JPS5131185B2 (en:Method) | 1976-09-04 |
| HK29979A (en) | 1979-05-18 |
| FR2209218A1 (en:Method) | 1974-06-28 |
| NL163368B (nl) | 1980-03-17 |
| DE2352329A1 (de) | 1974-05-02 |
| DE2352329B2 (de) | 1977-02-24 |
| NL163368C (nl) | 1980-08-15 |
| GB1414245A (en) | 1975-11-19 |
| MY7900031A (en) | 1979-12-31 |
| JPS4962081A (en:Method) | 1974-06-15 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| V4 | Discontinued because of reaching the maximum lifetime of a patent |