NL7313900A - - Google Patents

Info

Publication number
NL7313900A
NL7313900A NL7313900A NL7313900A NL7313900A NL 7313900 A NL7313900 A NL 7313900A NL 7313900 A NL7313900 A NL 7313900A NL 7313900 A NL7313900 A NL 7313900A NL 7313900 A NL7313900 A NL 7313900A
Authority
NL
Netherlands
Application number
NL7313900A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7313900A publication Critical patent/NL7313900A/xx

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/0235Ribbons
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00Severing by tearing or breaking
    • Y10T225/30Breaking or tearing apparatus
    • Y10T225/304Including means to apply thermal shock to work

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
NL7313900A 1972-10-12 1973-10-10 NL7313900A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
LU66279 1972-10-12

Publications (1)

Publication Number Publication Date
NL7313900A true NL7313900A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-04-16

Family

ID=19727178

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7313900A NL7313900A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-10-12 1973-10-10

Country Status (9)

Country Link
US (1) US3935419A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS4975623A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AT (1) AT342232B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
BE (1) BE805694A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2350502A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2202856B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1441114A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT996776B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL (1) NL7313900A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1551657A (en) * 1977-05-17 1979-08-30 Standard Telephones Cables Ltd Manufacture of optical fibres
JPS5430590A (en) * 1977-08-11 1979-03-07 Nippon Telegr & Teleph Corp <Ntt> Method of and apparatus for cutting optical fibers
US4468534A (en) * 1982-09-30 1984-08-28 Boddicker Franc W Method and device for cutting glass
WO1984002296A1 (en) * 1982-12-17 1984-06-21 Inoue Japax Res Laser machining apparatus
JPS6014441A (ja) * 1983-07-04 1985-01-25 Semiconductor Energy Lab Co Ltd 半導体装置作製方法
US4677636A (en) * 1985-10-23 1987-06-30 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Multiplex electric discharge gas laser system
US4828900A (en) * 1987-12-23 1989-05-09 Ppg Industries, Inc. Discrete glass cutting and edge shaping
US4749400A (en) * 1986-12-12 1988-06-07 Ppg Industries, Inc. Discrete glass sheet cutting
US4743284A (en) * 1986-12-29 1988-05-10 Ppg Industries, Inc. Ribbon severing support
US4877939A (en) * 1987-01-30 1989-10-31 Duley Walter W Means of enhancing laser processing efficiency of metals
US4879449A (en) * 1987-01-30 1989-11-07 Duley Walter W Means of enhancing laser processing efficiency of metals
JPS63272092A (ja) * 1987-04-30 1988-11-09 Yoshiaki Arata 超強力複合レ−ザ・ビ−ム造出法
US4839497A (en) * 1987-09-03 1989-06-13 Digital Equipment Corporation Drilling apparatus and method
US5147126A (en) * 1987-09-08 1992-09-15 The United States Of America As Represented By The Secretary Of The Air Force Dual laser beam angular separation control apparatus
US4933205A (en) * 1987-10-09 1990-06-12 Duley Walter W Laser etching of foam substrate
US4972061A (en) * 1987-12-17 1990-11-20 Duley Walter W Laser surface treatment
US5132505A (en) * 1990-03-21 1992-07-21 U.S. Philips Corporation Method of cleaving a brittle plate and device for carrying out the method
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
US5871134A (en) * 1994-12-27 1999-02-16 Asahi Glass Company Ltd. Method and apparatus for breaking and cutting a glass ribbon
JP5081086B2 (ja) * 1995-06-26 2012-11-21 コーニング インコーポレイテッド 平面ガラスシートの製造方法およびガラス基板の分割方法
JPH09150286A (ja) * 1995-06-26 1997-06-10 Corning Inc 脆弱性材料切断方法および装置
WO1997007927A1 (en) * 1995-08-31 1997-03-06 Corning Incorporated Method and apparatus for breaking brittle materials
DE19609199A1 (de) * 1996-03-09 1997-09-11 Vetter & Co Apotheker Verfahren zur Bearbeitung von Werkstücken aus festen Materialien sowie Vorrichtung zur Durchführung des Verfahrens
WO1998015380A1 (en) * 1996-10-08 1998-04-16 The University Of Arkansas Process and apparatus for sequential multi-beam laser processing of materials
JPH10128567A (ja) * 1996-10-30 1998-05-19 Nec Kansai Ltd レーザ割断方法
BE1011208A4 (fr) * 1997-06-11 1999-06-01 Cuvelier Georges Procede de decalottage de pieces en verre.
DE19839343A1 (de) * 1998-08-28 2000-03-16 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zum Bearbeiten eines Bauteils oder einer Bauteilanordnung mittels elektromagnetischer Strahlung sowie Vorrichtung zum Fügen, insbesondere Verlöten
US6211488B1 (en) 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6259058B1 (en) * 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6252197B1 (en) 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
JP2000167681A (ja) * 1998-12-04 2000-06-20 Samsung Electronics Co Ltd レ―ザ切断用基板,液晶表示装置パネルおよび液晶表示装置パネルの製造方法
DE19952331C1 (de) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
AU1227501A (en) * 1999-11-01 2001-05-14 P.T.G. Precision Technology Center Llc Laser driven glass cut-initiation
DE19955824A1 (de) * 1999-11-20 2001-06-13 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Schneiden eines Werkstückes aus sprödbrüchigem Werkstoff
ES2304987T3 (es) 1999-11-24 2008-11-01 Applied Photonics, Inc. Metodo y aparato para separar materiales no metalicos.
AU2001227036A1 (en) * 2000-01-31 2001-08-14 Touch Panel Systems K.K. Touch panel and method for using the same
DE102005038027A1 (de) * 2005-08-06 2007-02-08 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Durchtrennen von spröden Flachmaterialien
RU2342333C2 (ru) * 2006-04-18 2008-12-27 Учреждение образования "Гомельский государственный университет имени Франциска Скорины" Способ разделения хрупких неметаллических материалов под действием термоупругих напряжений
DE102006024825A1 (de) * 2006-05-23 2007-11-29 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Randbeschneiden eines Floatglasbandes
KR100949152B1 (ko) * 2007-11-23 2010-03-25 삼성코닝정밀유리 주식회사 유리 기판 레이저 절단 장치
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
WO2013007504A1 (de) 2011-07-14 2013-01-17 Saint-Gobain Glass France Verfahren zur kantenglättung einer glasscheibe
DE102011084128A1 (de) * 2011-10-07 2013-04-11 Schott Ag Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante
US9938180B2 (en) * 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
US9414498B2 (en) * 2013-09-20 2016-08-09 Coherent, Inc. Via-hole drilling in a printed circuit board using a carbon monoxide laser
US10274806B2 (en) 2015-11-06 2019-04-30 Coherent, Inc. Pulse-dividing method and apparatus for a pulsed carbon monoxide laser
US10423047B2 (en) 2016-07-27 2019-09-24 Coherent, Inc. Laser machining method and apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1244346B (de) * 1964-10-19 1967-07-13 Menzel Gerhard Glasbearbeitung Verfahren zum Schneiden von Glas
GB1246481A (en) * 1968-03-29 1971-09-15 Pilkington Brothers Ltd Improvements in or relating to the cutting of glass
US3589883A (en) * 1968-05-28 1971-06-29 Ppg Industries Inc Method and apparatus for thermally fracturing a ribbon of glass
US3588440A (en) * 1969-06-26 1971-06-28 Hughes Aircraft Co Laser combination energy system
US3800991A (en) * 1972-04-10 1974-04-02 Ppg Industries Inc Method of and an apparatus for cutting glass

Also Published As

Publication number Publication date
GB1441114A (en) 1976-06-30
FR2202856B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1977-03-11
IT996776B (it) 1975-12-10
BE805694A (fr) 1974-04-05
AT342232B (de) 1978-03-28
JPS4975623A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-07-22
DE2350502A1 (de) 1974-04-18
FR2202856A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-05-10
US3935419A (en) 1976-01-27
ATA852273A (de) 1977-07-15

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Legal Events

Date Code Title Description
BV The patent application has lapsed