JPS4975623A - - Google Patents

Info

Publication number
JPS4975623A
JPS4975623A JP11464173A JP11464173A JPS4975623A JP S4975623 A JPS4975623 A JP S4975623A JP 11464173 A JP11464173 A JP 11464173A JP 11464173 A JP11464173 A JP 11464173A JP S4975623 A JPS4975623 A JP S4975623A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11464173A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4975623A publication Critical patent/JPS4975623A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/0235—Ribbons
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/304—Including means to apply thermal shock to work
JP11464173A 1972-10-12 1973-10-12 Pending JPS4975623A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
LU66279 1972-10-12

Publications (1)

Publication Number Publication Date
JPS4975623A true JPS4975623A (ja) 1974-07-22

Family

ID=19727178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11464173A Pending JPS4975623A (ja) 1972-10-12 1973-10-12

Country Status (9)

Country Link
US (1) US3935419A (ja)
JP (1) JPS4975623A (ja)
AT (1) AT342232B (ja)
BE (1) BE805694A (ja)
DE (1) DE2350502A1 (ja)
FR (1) FR2202856B1 (ja)
GB (1) GB1441114A (ja)
IT (1) IT996776B (ja)
NL (1) NL7313900A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5430590A (en) * 1977-08-11 1979-03-07 Nippon Telegr & Teleph Corp <Ntt> Method of and apparatus for cutting optical fibers
WO2001057638A1 (en) * 2000-01-31 2001-08-09 Touch Panel Systems K.K. Touch panel and method for using the same
JP2008273837A (ja) * 1995-06-26 2008-11-13 Corning Inc 平面ガラスシートの製造方法およびガラス基板の分割方法
JP2012126642A (ja) * 1995-06-26 2012-07-05 Corning Inc 平面ガラスシートの製造方法およびガラス基板の分割方法
JP2016536149A (ja) * 2013-09-20 2016-11-24 コヒレント， インコーポレイテッド 一酸化炭素レーザを使用するプリント回路板内のビアホール穿孔

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1551657A (en) * 1977-05-17 1979-08-30 Standard Telephones Cables Ltd Manufacture of optical fibres
US4468534A (en) * 1982-09-30 1984-08-28 Boddicker Franc W Method and device for cutting glass
WO1984002296A1 (en) * 1982-12-17 1984-06-21 Inoue Japax Res Laser machining apparatus
JPS6014441A (ja) * 1983-07-04 1985-01-25 Semiconductor Energy Lab Co Ltd 半導体装置作製方法
US4677636A (en) * 1985-10-23 1987-06-30 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Multiplex electric discharge gas laser system
US4828900A (en) * 1987-12-23 1989-05-09 Ppg Industries, Inc. Discrete glass cutting and edge shaping
US4749400A (en) * 1986-12-12 1988-06-07 Ppg Industries, Inc. Discrete glass sheet cutting
US4743284A (en) * 1986-12-29 1988-05-10 Ppg Industries, Inc. Ribbon severing support
US4879449A (en) * 1987-01-30 1989-11-07 Duley Walter W Means of enhancing laser processing efficiency of metals
US4877939A (en) * 1987-01-30 1989-10-31 Duley Walter W Means of enhancing laser processing efficiency of metals
JPS63272092A (ja) * 1987-04-30 1988-11-09 Yoshiaki Arata 超強力複合レ−ザ・ビ−ム造出法
US4839497A (en) * 1987-09-03 1989-06-13 Digital Equipment Corporation Drilling apparatus and method
US5147126A (en) * 1987-09-08 1992-09-15 The United States Of America As Represented By The Secretary Of The Air Force Dual laser beam angular separation control apparatus
US4933205A (en) * 1987-10-09 1990-06-12 Duley Walter W Laser etching of foam substrate
US4972061A (en) * 1987-12-17 1990-11-20 Duley Walter W Laser surface treatment
US5132505A (en) * 1990-03-21 1992-07-21 U.S. Philips Corporation Method of cleaving a brittle plate and device for carrying out the method
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
US5871134A (en) * 1994-12-27 1999-02-16 Asahi Glass Company Ltd. Method and apparatus for breaking and cutting a glass ribbon
EP0847317B1 (en) * 1995-08-31 2003-08-27 Corning Incorporated Method and apparatus for breaking brittle materials
DE19609199A1 (de) * 1996-03-09 1997-09-11 Vetter & Co Apotheker Verfahren zur Bearbeitung von Werkstücken aus festen Materialien sowie Vorrichtung zur Durchführung des Verfahrens
US6168744B1 (en) * 1996-10-08 2001-01-02 Board Of Trustees University Of Arkansas Process for sequential multi beam laser processing of materials
JPH10128567A (ja) * 1996-10-30 1998-05-19 Nec Kansai Ltd レーザ割断方法
BE1011208A4 (fr) * 1997-06-11 1999-06-01 Cuvelier Georges Procede de decalottage de pieces en verre.
DE19839343A1 (de) * 1998-08-28 2000-03-16 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zum Bearbeiten eines Bauteils oder einer Bauteilanordnung mittels elektromagnetischer Strahlung sowie Vorrichtung zum Fügen, insbesondere Verlöten
US6211488B1 (en) 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
US6252197B1 (en) 1998-12-01 2001-06-26 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
US6259058B1 (en) * 1998-12-01 2001-07-10 Accudyne Display And Semiconductor Systems, Inc. Apparatus for separating non-metallic substrates
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6297869B1 (en) * 1998-12-04 2001-10-02 Samsung Electronics Co., Ltd. Substrate and a liquid crystal display panel capable of being cut by using a laser and a method for manufacturing the same
DE19952331C1 (de) * 1999-10-29 2001-08-30 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
AU1227501A (en) * 1999-11-01 2001-05-14 P.T.G. Precision Technology Center Llc Laser driven glass cut-initiation
DE19955824A1 (de) * 1999-11-20 2001-06-13 Schott Spezialglas Gmbh Verfahren und Vorrichtung zum Schneiden eines Werkstückes aus sprödbrüchigem Werkstoff
CN1413136A (zh) 1999-11-24 2003-04-23 应用光子学公司 非金属材料的分离方法和装置
DE102005038027A1 (de) * 2005-08-06 2007-02-08 Jenoptik Automatisierungstechnik Gmbh Verfahren zum Durchtrennen von spröden Flachmaterialien
DE102006024825A1 (de) * 2006-05-23 2007-11-29 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Randbeschneiden eines Floatglasbandes
KR100949152B1 (ko) * 2007-11-23 2010-03-25 삼성코닝정밀유리 주식회사 유리 기판 레이저 절단 장치
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
WO2013007504A1 (de) 2011-07-14 2013-01-17 Saint-Gobain Glass France Verfahren zur kantenglättung einer glasscheibe
DE102011084128A1 (de) * 2011-10-07 2013-04-11 Schott Ag Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante
US9938180B2 (en) * 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
US10274806B2 (en) 2015-11-06 2019-04-30 Coherent, Inc. Pulse-dividing method and apparatus for a pulsed carbon monoxide laser
US10423047B2 (en) 2016-07-27 2019-09-24 Coherent, Inc. Laser machining method and apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1244346B (de) * 1964-10-19 1967-07-13 Menzel Gerhard Glasbearbeitung Verfahren zum Schneiden von Glas
GB1246481A (en) * 1968-03-29 1971-09-15 Pilkington Brothers Ltd Improvements in or relating to the cutting of glass
US3589883A (en) * 1968-05-28 1971-06-29 Ppg Industries Inc Method and apparatus for thermally fracturing a ribbon of glass
US3588440A (en) * 1969-06-26 1971-06-28 Hughes Aircraft Co Laser combination energy system
US3800991A (en) * 1972-04-10 1974-04-02 Ppg Industries Inc Method of and an apparatus for cutting glass

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5430590A (en) * 1977-08-11 1979-03-07 Nippon Telegr & Teleph Corp <Ntt> Method of and apparatus for cutting optical fibers
JP2008273837A (ja) * 1995-06-26 2008-11-13 Corning Inc 平面ガラスシートの製造方法およびガラス基板の分割方法
JP2012126642A (ja) * 1995-06-26 2012-07-05 Corning Inc 平面ガラスシートの製造方法およびガラス基板の分割方法
WO2001057638A1 (en) * 2000-01-31 2001-08-09 Touch Panel Systems K.K. Touch panel and method for using the same
JP2016536149A (ja) * 2013-09-20 2016-11-24 コヒレント， インコーポレイテッド 一酸化炭素レーザを使用するプリント回路板内のビアホール穿孔

Also Published As

Publication number Publication date
BE805694A (fr) 1974-04-05
GB1441114A (en) 1976-06-30
FR2202856A1 (ja) 1974-05-10
NL7313900A (ja) 1974-04-16
FR2202856B1 (ja) 1977-03-11
ATA852273A (de) 1977-07-15
DE2350502A1 (de) 1974-04-18
US3935419A (en) 1976-01-27
IT996776B (it) 1975-12-10
AT342232B (de) 1978-03-28

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