NL7308737A - - Google Patents

Info

Publication number
NL7308737A
NL7308737A NL7308737A NL7308737A NL7308737A NL 7308737 A NL7308737 A NL 7308737A NL 7308737 A NL7308737 A NL 7308737A NL 7308737 A NL7308737 A NL 7308737A NL 7308737 A NL7308737 A NL 7308737A
Authority
NL
Netherlands
Application number
NL7308737A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7308737A publication Critical patent/NL7308737A/xx

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01Manufacture or treatment
    • H10W70/05Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
NL7308737A 1972-06-23 1973-06-22 NL7308737A (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26555072A 1972-06-23 1972-06-23

Publications (1)

Publication Number Publication Date
NL7308737A true NL7308737A (https=) 1973-12-27

Family

ID=23010926

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7308737A NL7308737A (https=) 1972-06-23 1973-06-22

Country Status (10)

Country Link
US (1) US3801477A (https=)
JP (1) JPS4957373A (https=)
BE (1) BE801196A (https=)
CA (1) CA982699A (https=)
DE (1) DE2331534A1 (https=)
FR (1) FR2189873B1 (https=)
GB (1) GB1416650A (https=)
IT (1) IT989353B (https=)
NL (1) NL7308737A (https=)
SE (1) SE381777B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3983284A (en) * 1972-06-02 1976-09-28 Thomson-Csf Flat connection for a semiconductor multilayer structure
US4022930A (en) * 1975-05-30 1977-05-10 Bell Telephone Laboratories, Incorporated Multilevel metallization for integrated circuits
US4188438A (en) * 1975-06-02 1980-02-12 National Semiconductor Corporation Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices
JP2755594B2 (ja) * 1988-03-30 1998-05-20 株式会社 東芝 セラミックス回路基板
JP4815771B2 (ja) * 2004-09-01 2011-11-16 住友電気工業株式会社 電気部品の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3495324A (en) * 1967-11-13 1970-02-17 Sperry Rand Corp Ohmic contact for planar devices
GB1250248A (https=) * 1969-06-12 1971-10-20

Also Published As

Publication number Publication date
DE2331534A1 (de) 1974-01-17
CA982699A (en) 1976-01-27
AU5724073A (en) 1975-01-09
BE801196A (fr) 1973-10-15
SE381777B (sv) 1975-12-15
FR2189873B1 (https=) 1977-09-09
JPS4957373A (https=) 1974-06-04
FR2189873A1 (https=) 1974-01-25
IT989353B (it) 1975-05-20
GB1416650A (en) 1975-12-03
US3801477A (en) 1974-04-02

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Legal Events

Date Code Title Description
BV The patent application has lapsed