NL7307964A - - Google Patents

Info

Publication number
NL7307964A
NL7307964A NL7307964A NL7307964A NL7307964A NL 7307964 A NL7307964 A NL 7307964A NL 7307964 A NL7307964 A NL 7307964A NL 7307964 A NL7307964 A NL 7307964A NL 7307964 A NL7307964 A NL 7307964A
Authority
NL
Netherlands
Application number
NL7307964A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7307964A publication Critical patent/NL7307964A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1527—Obliquely held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
NL7307964A 1972-06-09 1973-06-07 NL7307964A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722228218 DE2228218B1 (de) 1972-06-09 1972-06-09 Verfahren zum tauchloeten von traegerplaettchen

Publications (1)

Publication Number Publication Date
NL7307964A true NL7307964A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-12-11

Family

ID=5847335

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7307964A NL7307964A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-06-09 1973-06-07

Country Status (8)

Country Link
US (1) US3859722A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS4961666A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CH (1) CH558999A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2228218B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2187486A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT989028B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL (1) NL7307964A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
SE (1) SE382369B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3924794A (en) * 1973-08-14 1975-12-09 Us Energy Solder leveling process
JPS50149546U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1974-05-31 1975-12-12
DE2513859C2 (de) * 1975-03-27 1981-11-12 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen eines Kondensator-Widerstands-Netzwerks
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
US4234626A (en) * 1978-02-01 1980-11-18 E. I. Du Pont De Nemours And Company Producing printed circuits by conjoining metal powder images
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit
DE2856460C3 (de) * 1978-12-28 1982-02-11 Gebr. Schmid GmbH & Co, 7290 Freudenstadt Vorrichtung zum Aufbringen einer Lotschicht auf eine Leiterplatte
JPS5724775U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1980-07-17 1982-02-08
JPS5966189A (ja) * 1982-10-08 1984-04-14 株式会社日立製作所 部品実装方式
US4641222A (en) * 1984-05-29 1987-02-03 Motorola, Inc. Mounting system for stress relief in surface mounted components
US4799616A (en) * 1986-06-11 1989-01-24 International Business Machines Corporation Solder leveling method and apparatus
JPS63302595A (ja) * 1987-06-02 1988-12-09 Murata Mfg Co Ltd チップ部品の取付構造
JPH01112681A (ja) * 1987-07-31 1989-05-01 Toshiba Corp ハイブリッド化プリント基板
US4817850A (en) * 1988-03-28 1989-04-04 Hughes Aircraft Company Repairable flip-chip bumping
JPH0237805A (ja) * 1988-07-28 1990-02-07 Oki Electric Ind Co Ltd ページャー用アンテナ
GB2265325A (en) * 1992-03-18 1993-09-29 Ibm Solder application to a circuit board
US5804880A (en) * 1996-11-04 1998-09-08 National Semiconductor Corporation Solder isolating lead frame
TW554503B (en) * 2002-10-23 2003-09-21 Orient Semiconductor Elect Ltd Fabrication method of solder bump pattern in back-end wafer level package
EP2299501A1 (en) * 2009-09-16 2011-03-23 3S Industries AG Method and apparatus for providing a solar cell with a solder ribbon

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2703377A (en) * 1951-06-05 1955-03-01 Donald L Hings Molded wiring circuit
US2777193A (en) * 1952-07-17 1957-01-15 Philco Corp Circuit construction
US3019489A (en) * 1956-08-09 1962-02-06 Western Electric Co Method of making wired electrical mounting boards
US3294951A (en) * 1963-04-30 1966-12-27 United Aircraft Corp Micro-soldering
US3300851A (en) * 1964-01-02 1967-01-31 Gen Electric Method of making bonded wire circuits
US3714709A (en) * 1970-07-06 1973-02-06 Rca Corp Method of manufacturing thick-film hybrid integrated circuits

Also Published As

Publication number Publication date
US3859722A (en) 1975-01-14
DE2228218C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-11-29
IT989028B (it) 1975-05-20
FR2187486A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-01-18
JPS4961666A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-06-14
DE2228218A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-05-10
CH558999A (de) 1975-02-14
DE2228218B1 (de) 1973-05-10
SE382369B (sv) 1976-01-26

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