CH558999A - Verfahren zum bestuecken einer schichtschaltung mit bauteilen, insbesondere mit keramik-kleinkondensatoren, mittels tauchloeten, sowie gemaess dem verfahren bestueckte schichtschaltung. - Google Patents

Verfahren zum bestuecken einer schichtschaltung mit bauteilen, insbesondere mit keramik-kleinkondensatoren, mittels tauchloeten, sowie gemaess dem verfahren bestueckte schichtschaltung.

Info

Publication number
CH558999A
CH558999A CH384773A CH384773A CH558999A CH 558999 A CH558999 A CH 558999A CH 384773 A CH384773 A CH 384773A CH 384773 A CH384773 A CH 384773A CH 558999 A CH558999 A CH 558999A
Authority
CH
Switzerland
Prior art keywords
layering circuit
equipping
components
well
ceramic capacitors
Prior art date
Application number
CH384773A
Other languages
German (de)
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH558999A publication Critical patent/CH558999A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1527—Obliquely held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
CH384773A 1972-06-09 1973-03-16 Verfahren zum bestuecken einer schichtschaltung mit bauteilen, insbesondere mit keramik-kleinkondensatoren, mittels tauchloeten, sowie gemaess dem verfahren bestueckte schichtschaltung. CH558999A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722228218 DE2228218B1 (de) 1972-06-09 1972-06-09 Verfahren zum tauchloeten von traegerplaettchen

Publications (1)

Publication Number Publication Date
CH558999A true CH558999A (de) 1975-02-14

Family

ID=5847335

Family Applications (1)

Application Number Title Priority Date Filing Date
CH384773A CH558999A (de) 1972-06-09 1973-03-16 Verfahren zum bestuecken einer schichtschaltung mit bauteilen, insbesondere mit keramik-kleinkondensatoren, mittels tauchloeten, sowie gemaess dem verfahren bestueckte schichtschaltung.

Country Status (8)

Country Link
US (1) US3859722A (xx)
JP (1) JPS4961666A (xx)
CH (1) CH558999A (xx)
DE (1) DE2228218B1 (xx)
FR (1) FR2187486A1 (xx)
IT (1) IT989028B (xx)
NL (1) NL7307964A (xx)
SE (1) SE382369B (xx)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0013359A1 (de) * 1978-12-28 1980-07-23 Gebr. Schmid GmbH & Co. Vorrichtung zum Aufbringen einer Lötmittelschicht auf eine Leiterplatte

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3924794A (en) * 1973-08-14 1975-12-09 Us Energy Solder leveling process
JPS50149546U (xx) * 1974-05-31 1975-12-12
DE2513859C2 (de) * 1975-03-27 1981-11-12 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen eines Kondensator-Widerstands-Netzwerks
JPS5376372A (en) * 1976-12-17 1978-07-06 Matsushita Electric Ind Co Ltd Device for attaching chip circuit parts
US4234626A (en) * 1978-02-01 1980-11-18 E. I. Du Pont De Nemours And Company Producing printed circuits by conjoining metal powder images
JPS54105774A (en) * 1978-02-08 1979-08-20 Hitachi Ltd Method of forming pattern on thin film hybrid integrated circuit
JPS5724775U (xx) * 1980-07-17 1982-02-08
JPS5966189A (ja) * 1982-10-08 1984-04-14 株式会社日立製作所 部品実装方式
US4641222A (en) * 1984-05-29 1987-02-03 Motorola, Inc. Mounting system for stress relief in surface mounted components
US4799616A (en) * 1986-06-11 1989-01-24 International Business Machines Corporation Solder leveling method and apparatus
JPS63302595A (ja) * 1987-06-02 1988-12-09 Murata Mfg Co Ltd チップ部品の取付構造
JPH01112681A (ja) * 1987-07-31 1989-05-01 Toshiba Corp ハイブリッド化プリント基板
US4817850A (en) * 1988-03-28 1989-04-04 Hughes Aircraft Company Repairable flip-chip bumping
JPH0237805A (ja) * 1988-07-28 1990-02-07 Oki Electric Ind Co Ltd ページャー用アンテナ
GB2265325A (en) * 1992-03-18 1993-09-29 Ibm Solder application to a circuit board
US5804880A (en) * 1996-11-04 1998-09-08 National Semiconductor Corporation Solder isolating lead frame
TW554503B (en) * 2002-10-23 2003-09-21 Orient Semiconductor Elect Ltd Fabrication method of solder bump pattern in back-end wafer level package
EP2299501A1 (en) * 2009-09-16 2011-03-23 3S Industries AG Method and apparatus for providing a solar cell with a solder ribbon

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2703377A (en) * 1951-06-05 1955-03-01 Donald L Hings Molded wiring circuit
US2777193A (en) * 1952-07-17 1957-01-15 Philco Corp Circuit construction
US3019489A (en) * 1956-08-09 1962-02-06 Western Electric Co Method of making wired electrical mounting boards
US3294951A (en) * 1963-04-30 1966-12-27 United Aircraft Corp Micro-soldering
US3300851A (en) * 1964-01-02 1967-01-31 Gen Electric Method of making bonded wire circuits
US3714709A (en) * 1970-07-06 1973-02-06 Rca Corp Method of manufacturing thick-film hybrid integrated circuits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0013359A1 (de) * 1978-12-28 1980-07-23 Gebr. Schmid GmbH & Co. Vorrichtung zum Aufbringen einer Lötmittelschicht auf eine Leiterplatte

Also Published As

Publication number Publication date
DE2228218A1 (xx) 1973-05-10
IT989028B (it) 1975-05-20
FR2187486A1 (xx) 1974-01-18
DE2228218B1 (de) 1973-05-10
SE382369B (sv) 1976-01-26
NL7307964A (xx) 1973-12-11
JPS4961666A (xx) 1974-06-14
US3859722A (en) 1975-01-14
DE2228218C2 (xx) 1973-11-29

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