NL7304648A - - Google Patents

Info

Publication number
NL7304648A
NL7304648A NL7304648A NL7304648A NL7304648A NL 7304648 A NL7304648 A NL 7304648A NL 7304648 A NL7304648 A NL 7304648A NL 7304648 A NL7304648 A NL 7304648A NL 7304648 A NL7304648 A NL 7304648A
Authority
NL
Netherlands
Application number
NL7304648A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7304648A publication Critical patent/NL7304648A/xx

Links

Classifications

    • H10W76/60—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H10W70/611—
    • H10W90/00—
    • H10W90/401—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H10W72/01—
    • H10W72/5363—
    • H10W72/932—
    • H10W90/20—
    • H10W90/22—
    • H10W90/291—
    • H10W90/297—
    • H10W90/754—

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
NL7304648A 1972-04-27 1973-04-04 NL7304648A (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24800272A 1972-04-27 1972-04-27

Publications (1)

Publication Number Publication Date
NL7304648A true NL7304648A (enExample) 1973-10-30

Family

ID=22937240

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7304648A NL7304648A (enExample) 1972-04-27 1973-04-04

Country Status (8)

Country Link
JP (1) JPS5644599B2 (enExample)
CA (1) CA977451A (enExample)
CH (1) CH560500A5 (enExample)
DE (1) DE2317404A1 (enExample)
GB (1) GB1429078A (enExample)
NL (1) NL7304648A (enExample)
SE (1) SE385538B (enExample)
ZA (1) ZA731895B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5262782U (enExample) * 1975-11-04 1977-05-09
JPS54111661U (enExample) * 1978-01-20 1979-08-06
JPS6253221U (enExample) * 1985-09-24 1987-04-02
JPS6270107A (ja) * 1985-09-24 1987-03-31 Okura Yusoki Co Ltd 搬送装置
JPS62156847A (ja) * 1985-12-28 1987-07-11 Ibiden Co Ltd 多層プリント配線板の製造方法
JPS6487417A (en) * 1987-09-25 1989-03-31 Nippon Denso Co Method and device for transferring pallet
US5006923A (en) * 1989-09-14 1991-04-09 Litton Systems, Inc. Stackable multilayer substrate for mounting integrated circuits
JP2833947B2 (ja) * 1992-12-24 1998-12-09 加茂精工株式会社 カムによる間欠回転装置
US5423119A (en) * 1994-07-08 1995-06-13 Hualon Microelectronics Corporation Method for manufacturing a hybrid circuit charge-coupled device image sensor
DE102012212249B4 (de) * 2012-07-12 2016-02-25 Infineon Technologies Ag Verfahren zur Herstellung eines Verbundes und eines Halbleitermoduls
US20250379129A1 (en) * 2024-06-05 2025-12-11 Qualcomm Incorporated Conductive structure and interconnects for electrically connecting a substrate and an interposer

Also Published As

Publication number Publication date
DE2317404A1 (de) 1973-11-15
JPS5644599B2 (enExample) 1981-10-20
JPS4949157A (enExample) 1974-05-13
ZA731895B (en) 1973-12-19
AU5343873A (en) 1974-09-19
CA977451A (en) 1975-11-04
CH560500A5 (enExample) 1975-03-27
SE385538B (sv) 1976-07-05
GB1429078A (en) 1976-03-24

Similar Documents

Publication Publication Date Title
CS160326B1 (enExample)
JPS4943978A (enExample)
JPS4955369U (enExample)
CS151658B1 (enExample)
CS151676B1 (enExample)
CS153157B1 (enExample)
CS157348B1 (enExample)
CS160022B1 (enExample)
CS159989B1 (enExample)
CS159988B1 (enExample)
CS159929B1 (enExample)
CS158481B1 (enExample)
CH569045A5 (enExample)
CH577642A5 (enExample)
CH562235A5 (enExample)
CH564568A5 (enExample)
CH565479A5 (enExample)
CH566510A5 (enExample)
CH566898A5 (enExample)
CH567388A5 (enExample)
CH567912A5 (enExample)
CH568635A5 (enExample)
CH568693A5 (enExample)
CH568853A5 (enExample)
CH561007A5 (enExample)

Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BV The patent application has lapsed