JPS5644599B2 - - Google Patents
Info
- Publication number
- JPS5644599B2 JPS5644599B2 JP4683173A JP4683173A JPS5644599B2 JP S5644599 B2 JPS5644599 B2 JP S5644599B2 JP 4683173 A JP4683173 A JP 4683173A JP 4683173 A JP4683173 A JP 4683173A JP S5644599 B2 JPS5644599 B2 JP S5644599B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H10W76/60—
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
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- H10W70/611—
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- H10W90/00—
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- H10W90/401—
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09881—Coating only between conductors, i.e. flush with the conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H10W72/01—
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- H10W72/5363—
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- H10W72/932—
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- H10W90/20—
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- H10W90/22—
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- H10W90/291—
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- H10W90/297—
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- H10W90/754—
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US24800272A | 1972-04-27 | 1972-04-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4949157A JPS4949157A (enExample) | 1974-05-13 |
| JPS5644599B2 true JPS5644599B2 (enExample) | 1981-10-20 |
Family
ID=22937240
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4683173A Expired JPS5644599B2 (enExample) | 1972-04-27 | 1973-04-26 |
Country Status (8)
| Country | Link |
|---|---|
| JP (1) | JPS5644599B2 (enExample) |
| CA (1) | CA977451A (enExample) |
| CH (1) | CH560500A5 (enExample) |
| DE (1) | DE2317404A1 (enExample) |
| GB (1) | GB1429078A (enExample) |
| NL (1) | NL7304648A (enExample) |
| SE (1) | SE385538B (enExample) |
| ZA (1) | ZA731895B (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5262782U (enExample) * | 1975-11-04 | 1977-05-09 | ||
| JPS54111661U (enExample) * | 1978-01-20 | 1979-08-06 | ||
| JPS6253221U (enExample) * | 1985-09-24 | 1987-04-02 | ||
| JPS6270107A (ja) * | 1985-09-24 | 1987-03-31 | Okura Yusoki Co Ltd | 搬送装置 |
| JPS62156847A (ja) * | 1985-12-28 | 1987-07-11 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
| JPS6487417A (en) * | 1987-09-25 | 1989-03-31 | Nippon Denso Co | Method and device for transferring pallet |
| US5006923A (en) * | 1989-09-14 | 1991-04-09 | Litton Systems, Inc. | Stackable multilayer substrate for mounting integrated circuits |
| JP2833947B2 (ja) * | 1992-12-24 | 1998-12-09 | 加茂精工株式会社 | カムによる間欠回転装置 |
| US5423119A (en) * | 1994-07-08 | 1995-06-13 | Hualon Microelectronics Corporation | Method for manufacturing a hybrid circuit charge-coupled device image sensor |
| DE102012212249B4 (de) * | 2012-07-12 | 2016-02-25 | Infineon Technologies Ag | Verfahren zur Herstellung eines Verbundes und eines Halbleitermoduls |
| US20250379129A1 (en) * | 2024-06-05 | 2025-12-11 | Qualcomm Incorporated | Conductive structure and interconnects for electrically connecting a substrate and an interposer |
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1973
- 1973-03-13 CA CA166,300A patent/CA977451A/en not_active Expired
- 1973-03-19 ZA ZA731895A patent/ZA731895B/xx unknown
- 1973-04-04 NL NL7304648A patent/NL7304648A/xx not_active Application Discontinuation
- 1973-04-06 DE DE2317404A patent/DE2317404A1/de active Pending
- 1973-04-13 CH CH536773A patent/CH560500A5/xx not_active IP Right Cessation
- 1973-04-25 GB GB1971573A patent/GB1429078A/en not_active Expired
- 1973-04-25 SE SE7305845A patent/SE385538B/xx unknown
- 1973-04-26 JP JP4683173A patent/JPS5644599B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2317404A1 (de) | 1973-11-15 |
| JPS4949157A (enExample) | 1974-05-13 |
| ZA731895B (en) | 1973-12-19 |
| AU5343873A (en) | 1974-09-19 |
| CA977451A (en) | 1975-11-04 |
| CH560500A5 (enExample) | 1975-03-27 |
| SE385538B (sv) | 1976-07-05 |
| GB1429078A (en) | 1976-03-24 |
| NL7304648A (enExample) | 1973-10-30 |