NL7304429A - - Google Patents

Info

Publication number
NL7304429A
NL7304429A NL7304429A NL7304429A NL7304429A NL 7304429 A NL7304429 A NL 7304429A NL 7304429 A NL7304429 A NL 7304429A NL 7304429 A NL7304429 A NL 7304429A NL 7304429 A NL7304429 A NL 7304429A
Authority
NL
Netherlands
Application number
NL7304429A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7304429A priority Critical patent/NL7304429A/xx
Priority to DE19742412733 priority patent/DE2412733C2/de
Priority to GB1258974A priority patent/GB1457008A/en
Priority to IT4968174A priority patent/IT1011156B/it
Priority to CA196,165A priority patent/CA1000415A/en
Priority to JP3363974A priority patent/JPS5631916B2/ja
Priority to AU67204/74A priority patent/AU486258B2/en
Priority to AT254174A priority patent/AT326444B/de
Priority to ES424713A priority patent/ES424713A1/es
Priority to FR7410785A priority patent/FR2223477B1/fr
Priority to BE142575A priority patent/BE812977A/xx
Publication of NL7304429A publication Critical patent/NL7304429A/xx
Priority to US05/628,100 priority patent/US4084968A/en
Priority to HK39378A priority patent/HK39378A/xx

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1603Process or apparatus coating on selected surface areas
    • C23C18/1607Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • C23C18/1653Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073Multistep pretreatment
    • C23C18/2086Multistep pretreatment with use of organic or inorganic compounds other than metals, first

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Chemical Treatment Of Metals (AREA)
NL7304429A 1973-03-30 1973-03-30 NL7304429A (enrdf_load_stackoverflow)

Priority Applications (13)

Application Number Priority Date Filing Date Title
NL7304429A NL7304429A (enrdf_load_stackoverflow) 1973-03-30 1973-03-30
DE19742412733 DE2412733C2 (de) 1973-03-30 1974-03-16 Verfahren zur Herstellung elektrisch leitender Metallschichten auf Trägern
GB1258974A GB1457008A (en) 1973-03-30 1974-03-21 Metallizing insulating substrates
IT4968174A IT1011156B (it) 1973-03-30 1974-03-26 Metodo per la fabbricazione di strati di metallo elettricamente conduttivi su substrati
JP3363974A JPS5631916B2 (enrdf_load_stackoverflow) 1973-03-30 1974-03-27
CA196,165A CA1000415A (en) 1973-03-30 1974-03-27 Method of manufacturing electrically conductive metal layers on substrates
AU67204/74A AU486258B2 (en) 1973-03-30 1974-03-27 Method of manufacturing electrically conductive metal layers on substrates
AT254174A AT326444B (de) 1973-03-30 1974-03-27 Verfahren zur herstellung einer elektrisch leitenden metallschicht auf einem träger
ES424713A ES424713A1 (es) 1973-03-30 1974-03-28 Metodo de recubrir fotoquimicamente con metal, uniformemen-te o de acuerdo con un diseno, sustratos de resina polimeri-zada y moldeada flexibles o rigidos.
FR7410785A FR2223477B1 (enrdf_load_stackoverflow) 1973-03-30 1974-03-28
BE142575A BE812977A (fr) 1973-03-30 1974-03-28 Procede permettant de realiser des couches metalliques electroconductrices sur des supports
US05/628,100 US4084968A (en) 1973-03-30 1975-11-03 Method of manufacturing electrically conductive metal layers on substrates
HK39378A HK39378A (en) 1973-03-30 1978-07-13 Metallizing insulating substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7304429A NL7304429A (enrdf_load_stackoverflow) 1973-03-30 1973-03-30

Publications (1)

Publication Number Publication Date
NL7304429A true NL7304429A (enrdf_load_stackoverflow) 1974-10-02

Family

ID=19818532

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7304429A NL7304429A (enrdf_load_stackoverflow) 1973-03-30 1973-03-30

Country Status (11)

Country Link
JP (1) JPS5631916B2 (enrdf_load_stackoverflow)
AT (1) AT326444B (enrdf_load_stackoverflow)
BE (1) BE812977A (enrdf_load_stackoverflow)
CA (1) CA1000415A (enrdf_load_stackoverflow)
DE (1) DE2412733C2 (enrdf_load_stackoverflow)
ES (1) ES424713A1 (enrdf_load_stackoverflow)
FR (1) FR2223477B1 (enrdf_load_stackoverflow)
GB (1) GB1457008A (enrdf_load_stackoverflow)
HK (1) HK39378A (enrdf_load_stackoverflow)
IT (1) IT1011156B (enrdf_load_stackoverflow)
NL (1) NL7304429A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194911U (ja) * 1982-06-21 1983-12-24 富士重工業株式会社 リヤクオ−タ部窓ガラスの取付部構造
US4601916A (en) * 1984-07-18 1986-07-22 Kollmorgen Technologies Corporation Process for bonding metals to electrophoretically deposited resin coatings
DE19957130A1 (de) 1999-11-26 2001-05-31 Infineon Technologies Ag Metallisierungsverfahren für Dielektrika
DE10361419A1 (de) * 2003-12-22 2005-07-14 Infineon Technologies Ag Schichtenstruktur und ein Verfahren zur Herstellung einer Schichtenstruktur
CN109680552B (zh) * 2017-10-18 2021-11-05 江苏先诺新材料科技有限公司 聚酰亚胺/纳米纤维复合纸及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1621077A1 (de) * 1967-03-31 1971-04-22 Bayer Ag Verfahren zur Abscheidung von Metallueberzuegen
GB1229936A (enrdf_load_stackoverflow) * 1968-09-20 1971-04-28
US3698940A (en) * 1970-01-26 1972-10-17 Macdermid Inc Method of making additive printed circuit boards and product thereof

Also Published As

Publication number Publication date
FR2223477B1 (enrdf_load_stackoverflow) 1978-07-28
GB1457008A (en) 1976-12-01
AT326444B (de) 1975-12-10
CA1000415A (en) 1976-11-23
AU6720474A (en) 1975-10-02
ATA254174A (de) 1975-02-15
DE2412733A1 (de) 1974-10-10
JPS5631916B2 (enrdf_load_stackoverflow) 1981-07-24
FR2223477A1 (enrdf_load_stackoverflow) 1974-10-25
DE2412733C2 (de) 1982-12-02
IT1011156B (it) 1977-01-20
JPS49128833A (enrdf_load_stackoverflow) 1974-12-10
HK39378A (en) 1978-07-21
ES424713A1 (es) 1976-06-01
BE812977A (fr) 1974-09-30

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