NL7304429A - - Google Patents

Info

Publication number
NL7304429A
NL7304429A NL7304429A NL7304429A NL7304429A NL 7304429 A NL7304429 A NL 7304429A NL 7304429 A NL7304429 A NL 7304429A NL 7304429 A NL7304429 A NL 7304429A NL 7304429 A NL7304429 A NL 7304429A
Authority
NL
Netherlands
Application number
NL7304429A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7304429A priority Critical patent/NL7304429A/xx
Priority to DE19742412733 priority patent/DE2412733C2/de
Priority to GB1258974A priority patent/GB1457008A/en
Priority to IT4968174A priority patent/IT1011156B/it
Priority to CA196,165A priority patent/CA1000415A/en
Priority to JP3363974A priority patent/JPS5631916B2/ja
Priority to AU67204/74A priority patent/AU486258B2/en
Priority to AT254174A priority patent/AT326444B/de
Priority to ES424713A priority patent/ES424713A1/es
Priority to BE142575A priority patent/BE812977A/xx
Priority to FR7410785A priority patent/FR2223477B1/fr
Publication of NL7304429A publication Critical patent/NL7304429A/xx
Priority to US05/628,100 priority patent/US4084968A/en
Priority to HK39378A priority patent/HK39378A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
NL7304429A 1973-03-30 1973-03-30 NL7304429A (xx)

Priority Applications (13)

Application Number Priority Date Filing Date Title
NL7304429A NL7304429A (xx) 1973-03-30 1973-03-30
DE19742412733 DE2412733C2 (de) 1973-03-30 1974-03-16 Verfahren zur Herstellung elektrisch leitender Metallschichten auf Trägern
GB1258974A GB1457008A (en) 1973-03-30 1974-03-21 Metallizing insulating substrates
IT4968174A IT1011156B (it) 1973-03-30 1974-03-26 Metodo per la fabbricazione di strati di metallo elettricamente conduttivi su substrati
JP3363974A JPS5631916B2 (xx) 1973-03-30 1974-03-27
CA196,165A CA1000415A (en) 1973-03-30 1974-03-27 Method of manufacturing electrically conductive metal layers on substrates
AU67204/74A AU486258B2 (en) 1973-03-30 1974-03-27 Method of manufacturing electrically conductive metal layers on substrates
AT254174A AT326444B (de) 1973-03-30 1974-03-27 Verfahren zur herstellung einer elektrisch leitenden metallschicht auf einem träger
ES424713A ES424713A1 (es) 1973-03-30 1974-03-28 Metodo de recubrir fotoquimicamente con metal, uniformemen-te o de acuerdo con un diseno, sustratos de resina polimeri-zada y moldeada flexibles o rigidos.
BE142575A BE812977A (fr) 1973-03-30 1974-03-28 Procede permettant de realiser des couches metalliques electroconductrices sur des supports
FR7410785A FR2223477B1 (xx) 1973-03-30 1974-03-28
US05/628,100 US4084968A (en) 1973-03-30 1975-11-03 Method of manufacturing electrically conductive metal layers on substrates
HK39378A HK39378A (en) 1973-03-30 1978-07-13 Metallizing insulating substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7304429A NL7304429A (xx) 1973-03-30 1973-03-30

Publications (1)

Publication Number Publication Date
NL7304429A true NL7304429A (xx) 1974-10-02

Family

ID=19818532

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7304429A NL7304429A (xx) 1973-03-30 1973-03-30

Country Status (11)

Country Link
JP (1) JPS5631916B2 (xx)
AT (1) AT326444B (xx)
BE (1) BE812977A (xx)
CA (1) CA1000415A (xx)
DE (1) DE2412733C2 (xx)
ES (1) ES424713A1 (xx)
FR (1) FR2223477B1 (xx)
GB (1) GB1457008A (xx)
HK (1) HK39378A (xx)
IT (1) IT1011156B (xx)
NL (1) NL7304429A (xx)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194911U (ja) * 1982-06-21 1983-12-24 富士重工業株式会社 リヤクオ−タ部窓ガラスの取付部構造
US4601916A (en) * 1984-07-18 1986-07-22 Kollmorgen Technologies Corporation Process for bonding metals to electrophoretically deposited resin coatings
DE19957130A1 (de) * 1999-11-26 2001-05-31 Infineon Technologies Ag Metallisierungsverfahren für Dielektrika
DE10361419A1 (de) * 2003-12-22 2005-07-14 Infineon Technologies Ag Schichtenstruktur und ein Verfahren zur Herstellung einer Schichtenstruktur
CN109680552B (zh) * 2017-10-18 2021-11-05 江苏先诺新材料科技有限公司 聚酰亚胺/纳米纤维复合纸及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1621077A1 (de) * 1967-03-31 1971-04-22 Bayer Ag Verfahren zur Abscheidung von Metallueberzuegen
GB1229936A (xx) * 1968-09-20 1971-04-28
US3698940A (en) * 1970-01-26 1972-10-17 Macdermid Inc Method of making additive printed circuit boards and product thereof

Also Published As

Publication number Publication date
JPS5631916B2 (xx) 1981-07-24
AT326444B (de) 1975-12-10
ATA254174A (de) 1975-02-15
ES424713A1 (es) 1976-06-01
DE2412733C2 (de) 1982-12-02
FR2223477B1 (xx) 1978-07-28
CA1000415A (en) 1976-11-23
GB1457008A (en) 1976-12-01
DE2412733A1 (de) 1974-10-10
JPS49128833A (xx) 1974-12-10
FR2223477A1 (xx) 1974-10-25
IT1011156B (it) 1977-01-20
HK39378A (en) 1978-07-21
BE812977A (fr) 1974-09-30
AU6720474A (en) 1975-10-02

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