AT326444B - Verfahren zur herstellung einer elektrisch leitenden metallschicht auf einem träger - Google Patents

Verfahren zur herstellung einer elektrisch leitenden metallschicht auf einem träger

Info

Publication number
AT326444B
AT326444B AT254174A AT254174A AT326444B AT 326444 B AT326444 B AT 326444B AT 254174 A AT254174 A AT 254174A AT 254174 A AT254174 A AT 254174A AT 326444 B AT326444 B AT 326444B
Authority
AT
Austria
Prior art keywords
producing
support
metal layer
electrically conductive
conductive metal
Prior art date
Application number
AT254174A
Other languages
German (de)
English (en)
Other versions
ATA254174A (de
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of ATA254174A publication Critical patent/ATA254174A/de
Application granted granted Critical
Publication of AT326444B publication Critical patent/AT326444B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Chemical Treatment Of Metals (AREA)
AT254174A 1973-03-30 1974-03-27 Verfahren zur herstellung einer elektrisch leitenden metallschicht auf einem träger AT326444B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7304429A NL7304429A (enrdf_load_stackoverflow) 1973-03-30 1973-03-30

Publications (2)

Publication Number Publication Date
ATA254174A ATA254174A (de) 1975-02-15
AT326444B true AT326444B (de) 1975-12-10

Family

ID=19818532

Family Applications (1)

Application Number Title Priority Date Filing Date
AT254174A AT326444B (de) 1973-03-30 1974-03-27 Verfahren zur herstellung einer elektrisch leitenden metallschicht auf einem träger

Country Status (11)

Country Link
JP (1) JPS5631916B2 (enrdf_load_stackoverflow)
AT (1) AT326444B (enrdf_load_stackoverflow)
BE (1) BE812977A (enrdf_load_stackoverflow)
CA (1) CA1000415A (enrdf_load_stackoverflow)
DE (1) DE2412733C2 (enrdf_load_stackoverflow)
ES (1) ES424713A1 (enrdf_load_stackoverflow)
FR (1) FR2223477B1 (enrdf_load_stackoverflow)
GB (1) GB1457008A (enrdf_load_stackoverflow)
HK (1) HK39378A (enrdf_load_stackoverflow)
IT (1) IT1011156B (enrdf_load_stackoverflow)
NL (1) NL7304429A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58194911U (ja) * 1982-06-21 1983-12-24 富士重工業株式会社 リヤクオ−タ部窓ガラスの取付部構造
US4601916A (en) * 1984-07-18 1986-07-22 Kollmorgen Technologies Corporation Process for bonding metals to electrophoretically deposited resin coatings
DE19957130A1 (de) 1999-11-26 2001-05-31 Infineon Technologies Ag Metallisierungsverfahren für Dielektrika
DE10361419A1 (de) * 2003-12-22 2005-07-14 Infineon Technologies Ag Schichtenstruktur und ein Verfahren zur Herstellung einer Schichtenstruktur
CN109680552B (zh) * 2017-10-18 2021-11-05 江苏先诺新材料科技有限公司 聚酰亚胺/纳米纤维复合纸及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1621077A1 (de) * 1967-03-31 1971-04-22 Bayer Ag Verfahren zur Abscheidung von Metallueberzuegen
GB1229936A (enrdf_load_stackoverflow) * 1968-09-20 1971-04-28
US3698940A (en) * 1970-01-26 1972-10-17 Macdermid Inc Method of making additive printed circuit boards and product thereof

Also Published As

Publication number Publication date
FR2223477B1 (enrdf_load_stackoverflow) 1978-07-28
GB1457008A (en) 1976-12-01
NL7304429A (enrdf_load_stackoverflow) 1974-10-02
CA1000415A (en) 1976-11-23
AU6720474A (en) 1975-10-02
ATA254174A (de) 1975-02-15
DE2412733A1 (de) 1974-10-10
JPS5631916B2 (enrdf_load_stackoverflow) 1981-07-24
FR2223477A1 (enrdf_load_stackoverflow) 1974-10-25
DE2412733C2 (de) 1982-12-02
IT1011156B (it) 1977-01-20
JPS49128833A (enrdf_load_stackoverflow) 1974-12-10
HK39378A (en) 1978-07-21
ES424713A1 (es) 1976-06-01
BE812977A (fr) 1974-09-30

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee
ELJ Ceased due to non-payment of the annual fee