NL7217115A - - Google Patents
Info
- Publication number
- NL7217115A NL7217115A NL7217115A NL7217115A NL7217115A NL 7217115 A NL7217115 A NL 7217115A NL 7217115 A NL7217115 A NL 7217115A NL 7217115 A NL7217115 A NL 7217115A NL 7217115 A NL7217115 A NL 7217115A
- Authority
- NL
- Netherlands
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US20888571A | 1971-12-16 | 1971-12-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7217115A true NL7217115A (it) | 1973-06-19 |
Family
ID=22776434
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7217115A NL7217115A (it) | 1971-12-16 | 1972-12-15 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US3749649A (it) |
| JP (1) | JPS5629758B2 (it) |
| CA (1) | CA1115654A (it) |
| DE (1) | DE2256845A1 (it) |
| FR (1) | FR2163453B1 (it) |
| GB (1) | GB1408148A (it) |
| IT (1) | IT970627B (it) |
| NL (1) | NL7217115A (it) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3850765A (en) * | 1973-05-21 | 1974-11-26 | Oxy Metal Finishing Corp | Bright solder plating |
| SE390986B (sv) * | 1973-10-18 | 1977-01-31 | Modo Kemi Ab | Forfarande for elektropletering aw beleggningar av tenn eller tenn- blylegerinh ur ett surt elektrolytbad |
| US4135991A (en) * | 1977-08-12 | 1979-01-23 | R. O. Hull & Company, Inc. | Bath and method for electroplating tin and/or lead |
| NZ190645A (en) * | 1978-06-16 | 1980-11-14 | M & T Chemicals Inc | Aqueous acid tin plating bath containing 2,5-dimethoxy-benzaldehyde as brightening agent |
| US4376018A (en) * | 1979-12-31 | 1983-03-08 | Bell Telephone Laboratories, Incorporated | Electrodeposition of nickel |
| US4263106A (en) * | 1979-12-31 | 1981-04-21 | Bell Telephone Laboratories, Incorporated | Solder plating process |
| US4377448A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic gold plating |
| US4379738A (en) * | 1979-12-31 | 1983-04-12 | Bell Telephone Laboratories, Incorporated | Electroplating zinc |
| US4377449A (en) * | 1979-12-31 | 1983-03-22 | Bell Telephone Laboratories, Incorporated | Electrolytic silver plating |
| US4347107A (en) * | 1981-04-02 | 1982-08-31 | Hooker Chemicals & Plastics Corp. | Electroplating tin and tin alloys and baths therefor |
| SE8204505L (sv) * | 1981-09-08 | 1983-03-09 | Occidental Chem Co | Elektropletering for avsettning av tenn-blylegeringar pa olika underlag |
| US5066367B1 (en) * | 1981-09-11 | 1993-12-21 | I. Nobel Fred | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| US4871429A (en) * | 1981-09-11 | 1989-10-03 | Learonal, Inc | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| US5094726B1 (en) * | 1981-09-11 | 1993-12-21 | I. Nobel Fred | Limiting tin sludge formation in tin or tin/lead electroplating solutions |
| US4717460A (en) * | 1983-12-22 | 1988-01-05 | Learonal, Inc. | Tin lead electroplating solutions |
| US4701244A (en) * | 1983-12-22 | 1987-10-20 | Learonal, Inc. | Bath and process for electroplating tin, lead and tin/alloys |
| US4688899A (en) * | 1984-07-27 | 1987-08-25 | Casio Computer Co., Ltd. | Dual-frequency, dielectric anisotropy liquid crystal display |
| JPS61117297A (ja) * | 1984-11-13 | 1986-06-04 | Ebara Yuujiraito Kk | スズ属金属めつき液 |
| EP0652306B1 (en) * | 1987-12-10 | 2000-09-27 | LeaRonal, Inc. | Tin, lead or tin/lead alloy electrolytes for high-speed electroplating |
| US5174887A (en) * | 1987-12-10 | 1992-12-29 | Learonal, Inc. | High speed electroplating of tinplate |
| JP2752046B2 (ja) * | 1989-12-05 | 1998-05-18 | 株式会社村田製作所 | クエン酸系錫または錫合金系めっき浴 |
| CA2047502C (en) * | 1991-07-22 | 1995-05-09 | Peter Tsuk | Selectively plating electrically conductive pin |
| US6562221B2 (en) | 2001-09-28 | 2003-05-13 | David Crotty | Process and composition for high speed plating of tin and tin alloys |
| EP1342817A3 (en) * | 2002-03-05 | 2006-05-24 | Shipley Co. L.L.C. | Limiting the loss of tin through oxidation in tin or tin alloy electroplating bath solutions |
| CA2512591C (en) * | 2003-01-10 | 2011-11-01 | William E. Fristad | A coating composition |
| US20060172064A1 (en) * | 2003-01-10 | 2006-08-03 | Henkel Kommanditgesellschaft Auf Aktien | Process of coating metals prior to cold forming |
| US7063735B2 (en) * | 2003-01-10 | 2006-06-20 | Henkel Kommanditgesellschaft Auf Aktien | Coating composition |
| ES2354045T3 (es) | 2005-02-28 | 2011-03-09 | Rohm And Haas Electronic Materials, Llc | Procedimientos con fundente mejorados. |
| EP2617859B1 (en) | 2012-01-20 | 2016-11-30 | Rohm and Haas Electronic Materials LLC | Improved flux method for tin and tin alloys |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1141284A (en) * | 1965-02-13 | 1969-01-29 | Philips Electronic Associated | Improvements in acid tin electroplating solutions |
| FR1539596A (fr) * | 1967-10-06 | 1968-09-13 | Hyogo Prefectural Government | Procédé de revêtement électrolytique par un alliage brillant étain-plomb et nouveaux produits ainsi obtenus |
| US3785939A (en) * | 1970-10-22 | 1974-01-15 | Conversion Chem Corp | Tin/lead plating bath and method |
-
1971
- 1971-12-16 US US00208885A patent/US3749649A/en not_active Expired - Lifetime
-
1972
- 1972-11-20 DE DE2256845A patent/DE2256845A1/de not_active Ceased
- 1972-11-22 CA CA157,164A patent/CA1115654A/en not_active Expired
- 1972-11-27 FR FR7242053A patent/FR2163453B1/fr not_active Expired
- 1972-12-11 GB GB5712372A patent/GB1408148A/en not_active Expired
- 1972-12-15 IT IT9792/72A patent/IT970627B/it active
- 1972-12-15 NL NL7217115A patent/NL7217115A/xx not_active Application Discontinuation
- 1972-12-16 JP JP12667572A patent/JPS5629758B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| CA1115654A (en) | 1982-01-05 |
| AU4828472A (en) | 1974-05-02 |
| JPS5629758B2 (it) | 1981-07-10 |
| DE2256845A1 (de) | 1973-06-20 |
| IT970627B (it) | 1974-04-20 |
| GB1408148A (en) | 1975-10-01 |
| FR2163453A1 (it) | 1973-07-27 |
| US3749649A (en) | 1973-07-31 |
| JPS4866537A (it) | 1973-09-12 |
| FR2163453B1 (it) | 1977-01-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BA | A request for search or an international-type search has been filed | ||
| BB | A search report has been drawn up | ||
| BC | A request for examination has been filed | ||
| BV | The patent application has lapsed |