NL7212062A - - Google Patents
Info
- Publication number
- NL7212062A NL7212062A NL7212062A NL7212062A NL7212062A NL 7212062 A NL7212062 A NL 7212062A NL 7212062 A NL7212062 A NL 7212062A NL 7212062 A NL7212062 A NL 7212062A NL 7212062 A NL7212062 A NL 7212062A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/16—Electroplating with layers of varying thickness
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US21911672A | 1972-01-19 | 1972-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7212062A true NL7212062A (en:Method) | 1973-07-23 |
Family
ID=22817946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7212062A NL7212062A (en:Method) | 1972-01-19 | 1972-09-05 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3769179A (en:Method) |
| JP (1) | JPS4882358A (en:Method) |
| CA (1) | CA966587A (en:Method) |
| FR (1) | FR2168282B2 (en:Method) |
| GB (1) | GB1379849A (en:Method) |
| NL (1) | NL7212062A (en:Method) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4283464A (en) * | 1979-05-08 | 1981-08-11 | Norman Hascoe | Prefabricated composite metallic heat-transmitting plate unit |
| US4242181A (en) * | 1979-11-09 | 1980-12-30 | The Harshaw Chemical Company | Copper plating process for printed circuit boards |
| US4673469A (en) * | 1984-06-08 | 1987-06-16 | Mcgean-Rohco, Inc. | Method of plating plastics |
| FR2618631A1 (fr) * | 1987-07-24 | 1989-01-27 | Thomson Csf | Procede de realisation de liaisons electriques entre faces de plaques a circuits imprimes resistant aux contraintes thermiques, en particulier de circuits triplaques |
| US5068013A (en) * | 1988-08-23 | 1991-11-26 | Shipley Company Inc. | Electroplating composition and process |
| US4897165A (en) * | 1988-08-23 | 1990-01-30 | Shipley Company Inc. | Electroplating composition and process for plating through holes in printed circuit boards |
| US5051154A (en) * | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
| US4990224A (en) * | 1988-12-21 | 1991-02-05 | International Business Machines Corporation | Copper plating bath and process for difficult to plate metals |
| US4954226A (en) * | 1988-12-21 | 1990-09-04 | International Business Machines Corporation | Additive plating bath and process |
| JPH0452296A (ja) * | 1990-06-20 | 1992-02-20 | Permelec Electrode Ltd | 銅めっき方法 |
| US5681441A (en) * | 1992-12-22 | 1997-10-28 | Elf Technologies, Inc. | Method for electroplating a substrate containing an electroplateable pattern |
| US6024857A (en) * | 1997-10-08 | 2000-02-15 | Novellus Systems, Inc. | Electroplating additive for filling sub-micron features |
| DE19937843C1 (de) * | 1999-08-13 | 2001-02-08 | Bolta Werke Gmbh | Verfahren zur Herstellung einer selbsttragenden Kupferfolie |
| DE60113333T2 (de) * | 2000-07-01 | 2006-07-06 | Shipley Co., L.L.C., Marlborough | Metalllegierungszusammensetzungen und damit verbundene Plattierungsmethoden |
| WO2010077859A2 (en) * | 2008-12-15 | 2010-07-08 | Advanced Liquid Logic, Inc. | Nucleic acid amplification and sequencing on a droplet actuator |
| CN104562122B (zh) * | 2014-12-26 | 2016-12-07 | 惠州市特创电子科技有限公司 | 电镀铜厚的延时补偿方法和系统 |
| CN114705747A (zh) * | 2022-03-31 | 2022-07-05 | 生益电子股份有限公司 | 一种基于伏安循环法监控深镀能力的方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2391289A (en) * | 1941-09-15 | 1945-12-18 | Jr John F Beaver | Bright copper plating |
| US2424887A (en) * | 1941-10-11 | 1947-07-29 | Houdaille Hershey Corp | Method and electrolyte for the electrodeposition of metals |
| USRE24253E (en) * | 1948-05-11 | 1956-12-11 | Method of producing a composite liquid | |
| US2897409A (en) * | 1954-10-06 | 1959-07-28 | Sprague Electric Co | Plating process |
| FR1152563A (fr) * | 1954-12-31 | 1958-02-20 | Gen Am Transport | Circuits électriques imprimés et leur procédé de fabrication |
| US3562117A (en) * | 1967-09-18 | 1971-02-09 | Allied Chem | Method of copper electroplating printed circuit boards |
| US3634205A (en) * | 1968-09-27 | 1972-01-11 | Bunker Ramo | Method of plating a uniform copper layer on an apertured printed circuit board |
-
1972
- 1972-01-19 US US00219116A patent/US3769179A/en not_active Expired - Lifetime
- 1972-08-14 CA CA149,378A patent/CA966587A/en not_active Expired
- 1972-08-15 GB GB3802472A patent/GB1379849A/en not_active Expired
- 1972-08-26 JP JP47085003A patent/JPS4882358A/ja active Pending
- 1972-09-05 NL NL7212062A patent/NL7212062A/xx unknown
- 1972-09-25 FR FR7233873A patent/FR2168282B2/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1379849A (en) | 1975-01-08 |
| FR2168282A2 (en:Method) | 1973-08-31 |
| CA966587A (en) | 1975-04-22 |
| US3769179A (en) | 1973-10-30 |
| FR2168282B2 (en:Method) | 1978-01-06 |
| JPS4882358A (en:Method) | 1973-11-02 |