CN104562122B - 电镀铜厚的延时补偿方法和系统 - Google Patents
电镀铜厚的延时补偿方法和系统 Download PDFInfo
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- CN104562122B CN104562122B CN201410831665.7A CN201410831665A CN104562122B CN 104562122 B CN104562122 B CN 104562122B CN 201410831665 A CN201410831665 A CN 201410831665A CN 104562122 B CN104562122 B CN 104562122B
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- copper
- thick
- circuit board
- plated
- calculated
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- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000010949 copper Substances 0.000 claims abstract description 277
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 269
- 229910052802 copper Inorganic materials 0.000 claims abstract description 269
- 238000009713 electroplating Methods 0.000 claims abstract description 56
- 238000001514 detection method Methods 0.000 claims abstract description 33
- 230000001143 conditioned effect Effects 0.000 claims abstract description 10
- 238000012360 testing method Methods 0.000 claims description 38
- 239000000523 sample Substances 0.000 claims description 37
- 238000007747 plating Methods 0.000 claims description 24
- 238000005259 measurement Methods 0.000 claims description 19
- 238000004140 cleaning Methods 0.000 claims description 10
- 238000007789 sealing Methods 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 5
- 239000012530 fluid Substances 0.000 claims description 5
- 230000008859 change Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (10)
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CN201410831665.7A CN104562122B (zh) | 2014-12-26 | 2014-12-26 | 电镀铜厚的延时补偿方法和系统 |
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CN201410831665.7A CN104562122B (zh) | 2014-12-26 | 2014-12-26 | 电镀铜厚的延时补偿方法和系统 |
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CN104562122A CN104562122A (zh) | 2015-04-29 |
CN104562122B true CN104562122B (zh) | 2016-12-07 |
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CN201410831665.7A Active CN104562122B (zh) | 2014-12-26 | 2014-12-26 | 电镀铜厚的延时补偿方法和系统 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105696064B (zh) * | 2016-04-01 | 2018-06-22 | 广州兴森快捷电路科技有限公司 | 一种图形电镀参数的获取方法 |
CN107624001B (zh) * | 2017-09-27 | 2020-05-05 | 广州兴森快捷电路科技有限公司 | 电路板电镀方法 |
CN108398112A (zh) * | 2018-02-08 | 2018-08-14 | 广州兴森快捷电路科技有限公司 | 电路板镀铜检测系统及检测方法 |
CN112004331B (zh) * | 2019-05-27 | 2023-06-09 | 江西兴海容电路板有限公司 | 线路板及其制备方法 |
CN110187262B (zh) * | 2019-06-28 | 2021-08-24 | 广东正业科技股份有限公司 | 一种面铜厚检测测试点的选取方法 |
CN110940885B (zh) * | 2019-12-17 | 2022-04-26 | 东莞市五株电子科技有限公司 | Pcb板电镀生产装置、电镀夹具的性能检测装置及方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3769179A (en) * | 1972-01-19 | 1973-10-30 | Kewanee Oil Co | Copper plating process for printed circuits |
JP2990955B2 (ja) * | 1992-06-02 | 1999-12-13 | 東陶機器株式会社 | 銅メタライズ法 |
JPH10273796A (ja) * | 1997-03-28 | 1998-10-13 | Tokai Rubber Ind Ltd | 鋼材の銅めっき方法及び銅めっき鋼材 |
CN201362751Y (zh) * | 2008-12-31 | 2009-12-16 | 梅县金象铜箔有限公司 | 自动控制补偿器 |
CN101871109B (zh) * | 2009-04-21 | 2012-08-15 | 广州力加电子有限公司 | 一种双卷连续电沉积加厚装置 |
CN103225101B (zh) * | 2013-05-10 | 2015-05-13 | 华进半导体封装先导技术研发中心有限公司 | 一种整平剂抑制铜沉积所得效果的判定方法及其应用 |
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Denomination of invention: Delay compensation method and system of copper plating thickness Effective date of registration: 20200323 Granted publication date: 20161207 Pledgee: China Co. truction Bank Corp Huizhou branch Pledgor: HUIZHOU GLORYSKY ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2020980000897 |
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Address after: 516300 Jinpaishan Mountain, Taiyang Depression, Baihua Town, Huidong County, Huizhou City, Guangdong Province Patentee after: Huizhou techuang Electronic Technology Co.,Ltd. Address before: 516000 taiyangao Industrial Zone, Baihua Town, Huizhou City, Guangdong Province Patentee before: HUIZHOU GLORYSKY ELECTRONICS TECHNOLOGY Co.,Ltd. |
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Denomination of invention: Method and system of delay compensation for electroplating copper thickness Effective date of registration: 20221213 Granted publication date: 20161207 Pledgee: China Co. truction Bank Corp Huidong branch Pledgor: Huizhou techuang Electronic Technology Co.,Ltd. Registration number: Y2022980026914 |
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