NL7204574A - - Google Patents

Info

Publication number
NL7204574A
NL7204574A NL7204574A NL7204574A NL7204574A NL 7204574 A NL7204574 A NL 7204574A NL 7204574 A NL7204574 A NL 7204574A NL 7204574 A NL7204574 A NL 7204574A NL 7204574 A NL7204574 A NL 7204574A
Authority
NL
Netherlands
Application number
NL7204574A
Other versions
NL159818B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7204574.A priority Critical patent/NL159818B/xx
Priority to DE2314247A priority patent/DE2314247C3/de
Priority to US00345136A priority patent/US3825803A/en
Priority to CA167,681A priority patent/CA974663A/en
Priority to GB1590473A priority patent/GB1418520A/en
Priority to CH475673A priority patent/CH551690A/xx
Priority to JP48037490A priority patent/JPS5113993B2/ja
Priority to IT22533/73A priority patent/IT981860B/it
Priority to FR7312123A priority patent/FR2179103B1/fr
Publication of NL7204574A publication Critical patent/NL7204574A/xx
Publication of NL159818B publication Critical patent/NL159818B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
NL7204574.A 1972-04-06 1972-04-06 Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen. NL159818B (nl)

Priority Applications (9)

Application Number Priority Date Filing Date Title
NL7204574.A NL159818B (nl) 1972-04-06 1972-04-06 Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen.
DE2314247A DE2314247C3 (de) 1972-04-06 1973-03-22 Halbleiteranordnung mit einer biegsamen isolierenden Folie
US00345136A US3825803A (en) 1972-04-06 1973-03-26 Semiconductor lead and heat sink structure
CA167,681A CA974663A (en) 1972-04-06 1973-04-02 Semiconductor device package
GB1590473A GB1418520A (en) 1972-04-06 1973-04-03 Semiconductor devices
CH475673A CH551690A (de) 1972-04-06 1973-04-03 Halbleiteranordnung.
JP48037490A JPS5113993B2 (cg-RX-API-DMAC7.html) 1972-04-06 1973-04-03
IT22533/73A IT981860B (it) 1972-04-06 1973-04-03 Dispositivo semiconduttore
FR7312123A FR2179103B1 (cg-RX-API-DMAC7.html) 1972-04-06 1973-04-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7204574.A NL159818B (nl) 1972-04-06 1972-04-06 Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen.

Publications (2)

Publication Number Publication Date
NL7204574A true NL7204574A (cg-RX-API-DMAC7.html) 1973-10-09
NL159818B NL159818B (nl) 1979-03-15

Family

ID=19815786

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7204574.A NL159818B (nl) 1972-04-06 1972-04-06 Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen.

Country Status (9)

Country Link
US (1) US3825803A (cg-RX-API-DMAC7.html)
JP (1) JPS5113993B2 (cg-RX-API-DMAC7.html)
CA (1) CA974663A (cg-RX-API-DMAC7.html)
CH (1) CH551690A (cg-RX-API-DMAC7.html)
DE (1) DE2314247C3 (cg-RX-API-DMAC7.html)
FR (1) FR2179103B1 (cg-RX-API-DMAC7.html)
GB (1) GB1418520A (cg-RX-API-DMAC7.html)
IT (1) IT981860B (cg-RX-API-DMAC7.html)
NL (1) NL159818B (cg-RX-API-DMAC7.html)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1478797A (en) * 1974-09-17 1977-07-06 Siemens Ag Semiconductor arrangements
DE2742882C2 (de) * 1977-09-23 1986-10-09 Blaupunkt-Werke Gmbh, 3200 Hildesheim Elektronisches Bauelement
FR2521350B1 (fr) * 1982-02-05 1986-01-24 Hitachi Ltd Boitier porteur de puce semi-conductrice
US4602314A (en) * 1983-10-14 1986-07-22 Intel Corporation Heat conduction mechanism for semiconductor devices
JPS6092829U (ja) * 1983-11-30 1985-06-25 アルプス電気株式会社 マイクロ波トランジスタの取付構造体
DE3402538A1 (de) * 1984-01-26 1985-08-01 Robert Bosch Gmbh, 7000 Stuttgart Waermeableitende befestigung
US4835598A (en) * 1985-06-13 1989-05-30 Matsushita Electric Works, Ltd. Wiring board
DE3627372C3 (de) * 1986-08-12 1994-04-14 Loewe Opta Gmbh Anordnung, bestehend aus einer Leiterplatte, einem Kühlkörper und zu kühlenden elektronischen Bauelementen
US4962416A (en) * 1988-04-18 1990-10-09 International Business Machines Corporation Electronic package with a device positioned above a substrate by suction force between the device and heat sink
US4849856A (en) * 1988-07-13 1989-07-18 International Business Machines Corp. Electronic package with improved heat sink
JPH0310224A (ja) * 1989-06-07 1991-01-17 Sharp Corp 表示装置
GB2237682A (en) * 1989-09-28 1991-05-08 Redpoint Limited Heatsink for semiconductor devices
GB2240425B (en) * 1990-01-20 1994-01-12 Motorola Ltd Radio transmitter power amplifier with cooling apparatus
US5263245A (en) * 1992-01-27 1993-11-23 International Business Machines Corporation Method of making an electronic package with enhanced heat sinking
US5278724A (en) * 1992-07-06 1994-01-11 International Business Machines Corporation Electronic package and method of making same
ATE203355T1 (de) * 1995-06-27 2001-08-15 Braun Gmbh Wärmeleite-befestigung eines elektronischen leistungsbauelementes auf einer leiterplatte mit kühlblech
IT1285396B1 (it) * 1996-06-04 1998-06-03 Magneti Marelli Spa Dispositivo dissipatore per circuiti integrati.
FR2764114B1 (fr) * 1997-06-02 2003-04-25 Sgs Thomson Microelectronics Dispositif semi-conducteur muni d'un dissipateur thermique
JP2915892B2 (ja) * 1997-06-27 1999-07-05 松下電子工業株式会社 樹脂封止型半導体装置およびその製造方法
US6861735B2 (en) * 1997-06-27 2005-03-01 Matsushita Electric Industrial Co., Ltd. Resin molded type semiconductor device and a method of manufacturing the same
JP3003638B2 (ja) * 1997-08-05 2000-01-31 日本電気株式会社 半導体装置、その製造方法
US7023087B1 (en) * 1998-08-05 2006-04-04 Agere Systems Inc. Integrated circuit carrier and method of manufacturing and integrated circuit
DE19853777A1 (de) * 1998-11-21 2000-05-25 Wuerth Elektronik Gmbh & Co Kg Kühlelement für Leiterplatten
DE19905055A1 (de) 1999-02-08 2000-08-17 Siemens Ag Halbleiterbauelement mit einem Chipträger mit Öffnungen zur Kontaktierung
TW428295B (en) 1999-02-24 2001-04-01 Matsushita Electronics Corp Resin-sealing semiconductor device, the manufacturing method and the lead frame thereof
US6215663B1 (en) * 2000-03-16 2001-04-10 Philips Electronics North America Corporation Printed circuit board assembly with improved thermal performance
DE102004057494A1 (de) 2004-11-29 2006-06-08 Siemens Ag Metallisierte Folie zur flächigen Kontaktierung
DE102010013334A1 (de) * 2010-03-30 2012-05-10 Borgwarner Beru Systems Gmbh Leiterplatte mit Bauelement und Verfahren zum Bestücken einer Leiterplatte
US8987875B2 (en) 2013-03-08 2015-03-24 Delphi Technologies, Inc. Balanced stress assembly for semiconductor devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3614832A (en) * 1966-03-09 1971-10-26 Ibm Decal connectors and methods of forming decal connections to solid state devices
US3480836A (en) * 1966-08-11 1969-11-25 Ibm Component mounted in a printed circuit
US3544857A (en) * 1966-08-16 1970-12-01 Signetics Corp Integrated circuit assembly with lead structure and method
US3624462A (en) * 1969-07-03 1971-11-30 Fairchild Camera Instr Co Face-bonded photoarray package
US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
US3711625A (en) * 1971-03-31 1973-01-16 Microsystems Int Ltd Plastic support means for lead frame ends

Also Published As

Publication number Publication date
JPS5113993B2 (cg-RX-API-DMAC7.html) 1976-05-06
CH551690A (de) 1974-07-15
DE2314247B2 (de) 1978-10-26
NL159818B (nl) 1979-03-15
CA974663A (en) 1975-09-16
GB1418520A (en) 1975-12-24
FR2179103B1 (cg-RX-API-DMAC7.html) 1978-05-26
FR2179103A1 (cg-RX-API-DMAC7.html) 1973-11-16
DE2314247C3 (de) 1979-07-05
IT981860B (it) 1974-10-10
US3825803A (en) 1974-07-23
JPS4917969A (cg-RX-API-DMAC7.html) 1974-02-16
DE2314247A1 (de) 1973-10-18

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Legal Events

Date Code Title Description
VJC Lapsed due to non-payment of the due maintenance fee for the patent or patent application
NL80 Information provided on patent owner name for an already discontinued patent

Owner name: PHILIPS