NL7114112A - - Google Patents
Info
- Publication number
- NL7114112A NL7114112A NL7114112A NL7114112A NL7114112A NL 7114112 A NL7114112 A NL 7114112A NL 7114112 A NL7114112 A NL 7114112A NL 7114112 A NL7114112 A NL 7114112A NL 7114112 A NL7114112 A NL 7114112A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
- H10W40/778—Auxiliary members characterised by their shape in encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/453—Leadframes comprising flexible metallic tapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/124—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed the encapsulations having cavities other than that occupied by chips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10386—Clip leads; Terminals gripping the edge of a substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7114112A NL7114112A (https=) | 1971-10-14 | 1971-10-14 | |
| AU47525/72A AU474165B2 (en) | 1971-10-14 | 1972-10-09 | Semiconductor device |
| SE7213119A SE378706B (https=) | 1971-10-14 | 1972-10-11 | |
| GB4690372A GB1403786A (en) | 1971-10-14 | 1972-10-11 | Semiconductor devices |
| CH1486572A CH545006A (de) | 1971-10-14 | 1972-10-11 | Halbleiteranordnung |
| JP10122072A JPS5329273B2 (https=) | 1971-10-14 | 1972-10-11 | |
| DE2249730A DE2249730C3 (de) | 1971-10-14 | 1972-10-11 | Halbleiteranordnung mit einer mit Leiterbahnen versehenen isolierenden FoUe |
| IT30376/72A IT968868B (it) | 1971-10-14 | 1972-10-11 | Dispoitivo semiconduttore |
| CA153,632A CA964382A (en) | 1971-10-14 | 1972-10-11 | Semiconductor device assembly |
| FR7236357A FR2156343B1 (https=) | 1971-10-14 | 1972-10-13 | |
| US433387A US3868725A (en) | 1971-10-14 | 1974-01-14 | Integrated circuit lead structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7114112A NL7114112A (https=) | 1971-10-14 | 1971-10-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7114112A true NL7114112A (https=) | 1973-04-17 |
Family
ID=19814253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7114112A NL7114112A (https=) | 1971-10-14 | 1971-10-14 |
Country Status (10)
| Country | Link |
|---|---|
| JP (1) | JPS5329273B2 (https=) |
| AU (1) | AU474165B2 (https=) |
| CA (1) | CA964382A (https=) |
| CH (1) | CH545006A (https=) |
| DE (1) | DE2249730C3 (https=) |
| FR (1) | FR2156343B1 (https=) |
| GB (1) | GB1403786A (https=) |
| IT (1) | IT968868B (https=) |
| NL (1) | NL7114112A (https=) |
| SE (1) | SE378706B (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL189379C (nl) * | 1977-05-05 | 1993-03-16 | Richardus Henricus Johannes Fi | Werkwijze voor inkapselen van micro-elektronische elementen. |
| US4377316A (en) * | 1981-02-27 | 1983-03-22 | International Business Machines Corporation | High density interconnection means for chip carriers |
| DE3530827A1 (de) * | 1985-08-29 | 1987-03-05 | Vdo Schindling | Kontaktvorrichtung |
| DE10342295B4 (de) * | 2003-09-12 | 2012-02-02 | Infineon Technologies Ag | Anordnung eines elektrischen Bauelements mit einer elektrischen Isolationsfolie auf einem Substrat und Verfahren zum Herstellen der Anordnung |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3544857A (en) * | 1966-08-16 | 1970-12-01 | Signetics Corp | Integrated circuit assembly with lead structure and method |
| FR1534329A (fr) * | 1966-08-16 | 1968-07-26 | Signetics Corp | Procédé de montage de circuits intégrés |
-
1971
- 1971-10-14 NL NL7114112A patent/NL7114112A/xx not_active Application Discontinuation
-
1972
- 1972-10-09 AU AU47525/72A patent/AU474165B2/en not_active Expired
- 1972-10-11 DE DE2249730A patent/DE2249730C3/de not_active Expired
- 1972-10-11 CH CH1486572A patent/CH545006A/de not_active IP Right Cessation
- 1972-10-11 IT IT30376/72A patent/IT968868B/it active
- 1972-10-11 SE SE7213119A patent/SE378706B/xx unknown
- 1972-10-11 JP JP10122072A patent/JPS5329273B2/ja not_active Expired
- 1972-10-11 GB GB4690372A patent/GB1403786A/en not_active Expired
- 1972-10-11 CA CA153,632A patent/CA964382A/en not_active Expired
- 1972-10-13 FR FR7236357A patent/FR2156343B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| CH545006A (de) | 1973-11-30 |
| DE2249730A1 (de) | 1973-04-19 |
| DE2249730C3 (de) | 1980-11-13 |
| FR2156343B1 (https=) | 1977-12-23 |
| AU4752572A (en) | 1974-04-26 |
| FR2156343A1 (https=) | 1973-05-25 |
| JPS4847275A (https=) | 1973-07-05 |
| SE378706B (https=) | 1975-09-08 |
| IT968868B (it) | 1974-03-20 |
| AU474165B2 (en) | 1976-07-15 |
| JPS5329273B2 (https=) | 1978-08-19 |
| DE2249730B2 (de) | 1980-01-24 |
| GB1403786A (en) | 1975-08-28 |
| CA964382A (en) | 1975-03-11 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BI | The patent application has been withdrawn |