NL7101601A - - Google Patents

Info

Publication number
NL7101601A
NL7101601A NL7101601A NL7101601A NL7101601A NL 7101601 A NL7101601 A NL 7101601A NL 7101601 A NL7101601 A NL 7101601A NL 7101601 A NL7101601 A NL 7101601A NL 7101601 A NL7101601 A NL 7101601A
Authority
NL
Netherlands
Application number
NL7101601A
Other versions
NL158025B (nl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to NL7101601.A priority Critical patent/NL158025B/xx
Priority to DE2202337A priority patent/DE2202337C3/de
Priority to US00221164A priority patent/US3811183A/en
Priority to CA133,484A priority patent/CA964381A/en
Priority to JP47011437A priority patent/JPS5137145B1/ja
Priority to AU38539/72A priority patent/AU463626B2/en
Priority to GB489472A priority patent/GB1362603A/en
Priority to IT20143/72A priority patent/IT951756B/it
Priority to FR7203793A priority patent/FR2124488B1/fr
Publication of NL7101601A publication Critical patent/NL7101601A/xx
Priority to HK591/76*UA priority patent/HK59176A/xx
Publication of NL158025B publication Critical patent/NL158025B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
NL7101601.A 1971-02-05 1971-02-05 Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting, vervaardigd volgens deze werkwijze. NL158025B (nl)

Priority Applications (10)

Application Number Priority Date Filing Date Title
NL7101601.A NL158025B (nl) 1971-02-05 1971-02-05 Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting, vervaardigd volgens deze werkwijze.
DE2202337A DE2202337C3 (de) 1971-02-05 1972-01-19 Verfahren zur Herstellung einer Halbleiteranordnung
US00221164A US3811183A (en) 1971-02-05 1972-01-27 Method of manufacturing a semiconductor device and semiconductor device manufactured by the method
CA133,484A CA964381A (en) 1971-02-05 1972-01-31 Face-down-bonding using insulating adhesive
AU38539/72A AU463626B2 (en) 1971-02-05 1972-02-02 Method of manufacturing a semiconductor device and semiconductor device manufactured bythe method
JP47011437A JPS5137145B1 (cg-RX-API-DMAC7.html) 1971-02-05 1972-02-02
GB489472A GB1362603A (en) 1971-02-05 1972-02-02 Method of manufacturing a semiconductor device
IT20143/72A IT951756B (it) 1971-02-05 1972-02-02 Metodo per la fabbricazione di un dispositivo semiconduttore e dispo sitivo semiconduttore fabbricato con l impiego di tale metodo
FR7203793A FR2124488B1 (cg-RX-API-DMAC7.html) 1971-02-05 1972-02-04
HK591/76*UA HK59176A (en) 1971-02-05 1976-09-23 Method of manufacturing a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7101601.A NL158025B (nl) 1971-02-05 1971-02-05 Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting, vervaardigd volgens deze werkwijze.

Publications (2)

Publication Number Publication Date
NL7101601A true NL7101601A (cg-RX-API-DMAC7.html) 1972-08-08
NL158025B NL158025B (nl) 1978-09-15

Family

ID=19812418

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7101601.A NL158025B (nl) 1971-02-05 1971-02-05 Werkwijze voor het vervaardigen van een halfgeleiderinrichting en halfgeleiderinrichting, vervaardigd volgens deze werkwijze.

Country Status (10)

Country Link
US (1) US3811183A (cg-RX-API-DMAC7.html)
JP (1) JPS5137145B1 (cg-RX-API-DMAC7.html)
AU (1) AU463626B2 (cg-RX-API-DMAC7.html)
CA (1) CA964381A (cg-RX-API-DMAC7.html)
DE (1) DE2202337C3 (cg-RX-API-DMAC7.html)
FR (1) FR2124488B1 (cg-RX-API-DMAC7.html)
GB (1) GB1362603A (cg-RX-API-DMAC7.html)
HK (1) HK59176A (cg-RX-API-DMAC7.html)
IT (1) IT951756B (cg-RX-API-DMAC7.html)
NL (1) NL158025B (cg-RX-API-DMAC7.html)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111034A (en) * 1980-12-10 1982-07-10 Hitachi Ltd Semiconductor device and its manufacture
US4604644A (en) * 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
US5087961A (en) * 1987-01-28 1992-02-11 Lsi Logic Corporation Semiconductor device package
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
US5164328A (en) * 1990-06-25 1992-11-17 Motorola, Inc. Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip
US5469333A (en) * 1993-05-05 1995-11-21 International Business Machines Corporation Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads
US5311059A (en) * 1992-01-24 1994-05-10 Motorola, Inc. Backplane grounding for flip-chip integrated circuit
FR2704691B1 (fr) * 1993-04-30 1995-06-02 Commissariat Energie Atomique Procédé d'enrobage de composants électroniques hybrides par billes sur un substrat.
US6232152B1 (en) 1994-05-19 2001-05-15 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US6359335B1 (en) 1994-05-19 2002-03-19 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures
US5834339A (en) 1996-03-07 1998-11-10 Tessera, Inc. Methods for providing void-free layers for semiconductor assemblies
US6046076A (en) * 1994-12-29 2000-04-04 Tessera, Inc. Vacuum dispense method for dispensing an encapsulant and machine therefor
US5756395A (en) * 1995-08-18 1998-05-26 Lsi Logic Corporation Process for forming metal interconnect structures for use with integrated circuit devices to form integrated circuit structures
US5874782A (en) * 1995-08-24 1999-02-23 International Business Machines Corporation Wafer with elevated contact structures
US6137125A (en) * 1995-12-21 2000-10-24 The Whitaker Corporation Two layer hermetic-like coating for on-wafer encapsulatuon of GaAs MMIC's having flip-chip bonding capabilities
JPH1032221A (ja) * 1996-07-12 1998-02-03 Nec Corp プリント配線基板
JP3431406B2 (ja) * 1996-07-30 2003-07-28 株式会社東芝 半導体パッケージ装置
US6132850A (en) * 1996-11-25 2000-10-17 Raytheon Company Reworkable, thermally-conductive adhesives for electronic assemblies
US6074895A (en) * 1997-09-23 2000-06-13 International Business Machines Corporation Method of forming a flip chip assembly
JP4239310B2 (ja) * 1998-09-01 2009-03-18 ソニー株式会社 半導体装置の製造方法
JP2000091285A (ja) * 1998-09-08 2000-03-31 Disco Abrasive Syst Ltd 半導体物品の研削方法
US6214640B1 (en) 1999-02-10 2001-04-10 Tessera, Inc. Method of manufacturing a plurality of semiconductor packages
JP4423379B2 (ja) * 2008-03-25 2010-03-03 合同会社先端配線材料研究所 銅配線、半導体装置および銅配線の形成方法
KR20100104911A (ko) * 2009-03-19 2010-09-29 삼성전자주식회사 반도체 패키지
USD941799S1 (en) * 2020-04-28 2022-01-25 Guangzhou OPSMEN Tech.Co., Ltd Electronic earmuff headphone
USD1024004S1 (en) * 2021-10-22 2024-04-23 Guangzhou OPSMEN Tech. Co., Ltd Electronic hearing protector

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3285802A (en) * 1962-03-01 1966-11-15 Owens Illinois Inc Glass aerosol bottles and method for making same
US3297186A (en) * 1962-07-24 1967-01-10 Owens Illinois Inc Transparent glass container and method of making same
GB1015909A (en) * 1963-12-30 1966-01-05 Gen Micro Electronics Inc Method of and product for packaging electronic devices
US3341649A (en) * 1964-01-17 1967-09-12 Signetics Corp Modular package for semiconductor devices
DE1298637B (de) * 1964-03-06 1969-07-03 Itt Ind Gmbh Deutsche Verfahren zur serienmaessigen maschinellen Kontaktierung von Halbleiterbauelementelektroden
US3537175A (en) * 1966-11-09 1970-11-03 Advalloy Inc Lead frame for semiconductor devices and method for making same

Also Published As

Publication number Publication date
CA964381A (en) 1975-03-11
AU463626B2 (en) 1975-07-10
NL158025B (nl) 1978-09-15
FR2124488B1 (cg-RX-API-DMAC7.html) 1975-10-24
US3811183A (en) 1974-05-21
JPS5137145B1 (cg-RX-API-DMAC7.html) 1976-10-14
DE2202337A1 (de) 1972-08-17
DE2202337C3 (de) 1980-01-24
HK59176A (en) 1976-10-01
GB1362603A (en) 1974-08-07
FR2124488A1 (cg-RX-API-DMAC7.html) 1972-09-22
IT951756B (it) 1973-07-10
AU3853972A (en) 1973-08-09
DE2202337B2 (de) 1979-05-10

Similar Documents

Publication Publication Date Title
FR2121525B1 (cg-RX-API-DMAC7.html)
FR2121599A1 (cg-RX-API-DMAC7.html)
FR2124488B1 (cg-RX-API-DMAC7.html)
DK134529C (cg-RX-API-DMAC7.html)
FR2121697A1 (cg-RX-API-DMAC7.html)
FR2121796B1 (cg-RX-API-DMAC7.html)
FR2121337A5 (cg-RX-API-DMAC7.html)
CS150037B1 (cg-RX-API-DMAC7.html)
FR2109599A5 (cg-RX-API-DMAC7.html)
CS164784B2 (cg-RX-API-DMAC7.html)
FI46677B (cg-RX-API-DMAC7.html)
FI52942C (cg-RX-API-DMAC7.html)
FI52341B (cg-RX-API-DMAC7.html)
DE2120466A1 (cg-RX-API-DMAC7.html)
CS154158B1 (cg-RX-API-DMAC7.html)
CS148678B1 (cg-RX-API-DMAC7.html)
CS155407B1 (cg-RX-API-DMAC7.html)
CS149228B1 (cg-RX-API-DMAC7.html)
DE2119569A1 (cg-RX-API-DMAC7.html)
CS158143B1 (cg-RX-API-DMAC7.html)
BG18042A1 (cg-RX-API-DMAC7.html)
CH558451A (cg-RX-API-DMAC7.html)
DD95756A5 (cg-RX-API-DMAC7.html)
CH566022A5 (cg-RX-API-DMAC7.html)
DD100864A5 (cg-RX-API-DMAC7.html)

Legal Events

Date Code Title Description
V1 Lapsed because of non-payment of the annual fee
NL80 Information provided on patent owner name for an already discontinued patent

Owner name: PHILIPS