NL6900382A - - Google Patents

Info

Publication number
NL6900382A
NL6900382A NL6900382A NL6900382A NL6900382A NL 6900382 A NL6900382 A NL 6900382A NL 6900382 A NL6900382 A NL 6900382A NL 6900382 A NL6900382 A NL 6900382A NL 6900382 A NL6900382 A NL 6900382A
Authority
NL
Netherlands
Application number
NL6900382A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL6900382A publication Critical patent/NL6900382A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/007—Electroplating using magnetic fields, e.g. magnets
    • C25D5/009—Deposition of ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/04—Fixed inductances of the signal type with magnetic core
    • H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
NL6900382A 1967-12-26 1969-01-10 NL6900382A (enrdf_load_stackoverflow)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US69337567A 1967-12-26 1967-12-26
US69803168A 1968-01-15 1968-01-15
US2570870A 1970-04-06 1970-04-06

Publications (1)

Publication Number Publication Date
NL6900382A true NL6900382A (enrdf_load_stackoverflow) 1969-07-17

Family

ID=27362610

Family Applications (1)

Application Number Title Priority Date Filing Date
NL6900382A NL6900382A (enrdf_load_stackoverflow) 1967-12-26 1969-01-10

Country Status (5)

Country Link
US (2) US3477051A (enrdf_load_stackoverflow)
CH (1) CH488263A (enrdf_load_stackoverflow)
FR (2) FR1593898A (enrdf_load_stackoverflow)
GB (2) GB1189074A (enrdf_load_stackoverflow)
NL (1) NL6900382A (enrdf_load_stackoverflow)

Families Citing this family (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4103267A (en) * 1977-06-13 1978-07-25 Burr-Brown Research Corporation Hybrid transformer device
US4304641A (en) * 1980-11-24 1981-12-08 International Business Machines Corporation Rotary electroplating cell with controlled current distribution
US4509024A (en) * 1983-01-26 1985-04-02 Safetran Systems Corporation Impedance bond
EP0188095A1 (en) * 1984-12-13 1986-07-23 East Rock Technology Inc. Process for the manufacture of a toroidal ballast choke and machine for use in such process
US4696729A (en) * 1986-02-28 1987-09-29 International Business Machines Electroplating cell
FR2656951A1 (fr) * 1990-01-05 1991-07-12 Scherrer Fernand Transformateur de type torique.
DE4027994A1 (de) * 1990-09-04 1992-03-05 Gw Elektronik Gmbh Hf-magnetspulenanordnung und verfahren zu ihrer herstellung
US5312532A (en) * 1993-01-15 1994-05-17 International Business Machines Corporation Multi-compartment eletroplating system
US5421987A (en) * 1993-08-30 1995-06-06 Tzanavaras; George Precision high rate electroplating cell and method
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages
US5516412A (en) * 1995-05-16 1996-05-14 International Business Machines Corporation Vertical paddle plating cell
US5522975A (en) * 1995-05-16 1996-06-04 International Business Machines Corporation Electroplating workpiece fixture
US6946716B2 (en) * 1995-12-29 2005-09-20 International Business Machines Corporation Electroplated interconnection structures on integrated circuit chips
US6709562B1 (en) 1995-12-29 2004-03-23 International Business Machines Corporation Method of making electroplated interconnection structures on integrated circuit chips
US6001235A (en) * 1997-06-23 1999-12-14 International Business Machines Corporation Rotary plater with radially distributed plating solution
US6103096A (en) * 1997-11-12 2000-08-15 International Business Machines Corporation Apparatus and method for the electrochemical etching of a wafer
US6106687A (en) * 1998-04-28 2000-08-22 International Business Machines Corporation Process and diffusion baffle to modulate the cross sectional distribution of flow rate and deposition rate
US6919010B1 (en) 2001-06-28 2005-07-19 Novellus Systems, Inc. Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction
US6251251B1 (en) 1998-11-16 2001-06-26 International Business Machines Corporation Anode design for semiconductor deposition
AU1731000A (en) * 1998-11-18 2000-07-12 Johns Hopkins University, The Bismuth thin film structure and method of construction
US6113759A (en) * 1998-12-18 2000-09-05 International Business Machines Corporation Anode design for semiconductor deposition having novel electrical contact assembly
US6261426B1 (en) 1999-01-22 2001-07-17 International Business Machines Corporation Method and apparatus for enhancing the uniformity of electrodeposition or electroetching
US6454918B1 (en) * 1999-03-23 2002-09-24 Electroplating Engineers Of Japan Limited Cup type plating apparatus
US6547937B1 (en) * 2000-01-03 2003-04-15 Semitool, Inc. Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece
US8475636B2 (en) * 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US8308931B2 (en) * 2006-08-16 2012-11-13 Novellus Systems, Inc. Method and apparatus for electroplating
US7622024B1 (en) 2000-05-10 2009-11-24 Novellus Systems, Inc. High resistance ionic current source
US6527920B1 (en) 2000-05-10 2003-03-04 Novellus Systems, Inc. Copper electroplating apparatus
US6669833B2 (en) * 2000-10-30 2003-12-30 International Business Machines Corporation Process and apparatus for electroplating microscopic features uniformly across a large substrate
US6869515B2 (en) * 2001-03-30 2005-03-22 Uri Cohen Enhanced electrochemical deposition (ECD) filling of high aspect ratio openings
US7682498B1 (en) 2001-06-28 2010-03-23 Novellus Systems, Inc. Rotationally asymmetric variable electrode correction
US7569131B2 (en) * 2002-08-12 2009-08-04 International Business Machines Corporation Method for producing multiple magnetic layers of materials with known thickness and composition using a one-step electrodeposition process
US6955747B2 (en) * 2002-09-23 2005-10-18 International Business Machines Corporation Cam driven paddle assembly for a plating cell
DE10247051A1 (de) * 2002-10-09 2004-04-22 Polymer Latex Gmbh & Co Kg Latex und Verfahren zu seiner Herstellung
US20040084318A1 (en) * 2002-11-05 2004-05-06 Uri Cohen Methods and apparatus for activating openings and for jets plating
US7390382B2 (en) * 2003-07-01 2008-06-24 Semitool, Inc. Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods
US20050063798A1 (en) * 2003-06-06 2005-03-24 Davis Jeffry Alan Interchangeable workpiece handling apparatus and associated tool for processing microfeature workpieces
WO2004110698A2 (en) * 2003-06-06 2004-12-23 Semitool, Inc. Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes
US7393439B2 (en) * 2003-06-06 2008-07-01 Semitool, Inc. Integrated microfeature workpiece processing tools with registration systems for paddle reactors
US20050034977A1 (en) * 2003-06-06 2005-02-17 Hanson Kyle M. Electrochemical deposition chambers for depositing materials onto microfeature workpieces
US20050050767A1 (en) * 2003-06-06 2005-03-10 Hanson Kyle M. Wet chemical processing chambers for processing microfeature workpieces
US6881437B2 (en) * 2003-06-16 2005-04-19 Blue29 Llc Methods and system for processing a microelectronic topography
US20070144912A1 (en) * 2003-07-01 2007-06-28 Woodruff Daniel J Linearly translating agitators for processing microfeature workpieces, and associated methods
US7100954B2 (en) * 2003-07-11 2006-09-05 Nexx Systems, Inc. Ultra-thin wafer handling system
US8623193B1 (en) 2004-06-16 2014-01-07 Novellus Systems, Inc. Method of electroplating using a high resistance ionic current source
WO2006033315A1 (ja) 2004-09-24 2006-03-30 Ibiden Co., Ltd. めっき方法及びめっき装置
US7931786B2 (en) * 2005-11-23 2011-04-26 Semitool, Inc. Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces
JP5270576B2 (ja) * 2007-01-11 2013-08-21 プラナーマグ インコーポレイテッド 平面型広帯域トランス
US20080178460A1 (en) * 2007-01-29 2008-07-31 Woodruff Daniel J Protected magnets and magnet shielding for processing microfeature workpieces, and associated systems and methods
US7799684B1 (en) 2007-03-05 2010-09-21 Novellus Systems, Inc. Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers
US20090134039A1 (en) * 2007-11-28 2009-05-28 Mehlin Dean Matthews System and method for isotope selective chemical reacations
US8177944B2 (en) * 2007-12-04 2012-05-15 Ebara Corporation Plating apparatus and plating method
US8513124B1 (en) 2008-03-06 2013-08-20 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers
US8703615B1 (en) 2008-03-06 2014-04-22 Novellus Systems, Inc. Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers
US7964506B1 (en) 2008-03-06 2011-06-21 Novellus Systems, Inc. Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers
JP5155755B2 (ja) * 2008-07-10 2013-03-06 株式会社荏原製作所 磁性体膜めっき装置及びめっき処理設備
US8475637B2 (en) * 2008-12-17 2013-07-02 Novellus Systems, Inc. Electroplating apparatus with vented electrolyte manifold
US8262871B1 (en) 2008-12-19 2012-09-11 Novellus Systems, Inc. Plating method and apparatus with multiple internally irrigated chambers
US9823274B2 (en) * 2009-07-31 2017-11-21 Pulse Electronics, Inc. Current sensing inductive devices
US9151782B2 (en) * 2009-07-31 2015-10-06 Pulse Electronics, Inc. Current sensing devices and methods
US9664711B2 (en) * 2009-07-31 2017-05-30 Pulse Electronics, Inc. Current sensing devices and methods
US10094034B2 (en) 2015-08-28 2018-10-09 Lam Research Corporation Edge flow element for electroplating apparatus
US8795480B2 (en) 2010-07-02 2014-08-05 Novellus Systems, Inc. Control of electrolyte hydrodynamics for efficient mass transfer during electroplating
US10233556B2 (en) 2010-07-02 2019-03-19 Lam Research Corporation Dynamic modulation of cross flow manifold during electroplating
US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US9624592B2 (en) 2010-07-02 2017-04-18 Novellus Systems, Inc. Cross flow manifold for electroplating apparatus
FR2966282B1 (fr) 2010-10-18 2013-02-15 Nexcis Controle de la stoechiometrie de couches i-iii-vi pour des applications photovoltaiques a partir de conditions d'electrolyse perfectionnees.
US20120249107A1 (en) * 2011-04-01 2012-10-04 Cowley Nicholas P Coupled inductor to facilitate integrated power delivery
US8575028B2 (en) 2011-04-15 2013-11-05 Novellus Systems, Inc. Method and apparatus for filling interconnect structures
US9304149B2 (en) 2012-05-31 2016-04-05 Pulse Electronics, Inc. Current sensing devices and methods
US8920616B2 (en) * 2012-06-18 2014-12-30 Headway Technologies, Inc. Paddle for electroplating for selectively depositing greater thickness
US20140125446A1 (en) 2012-11-07 2014-05-08 Pulse Electronics, Inc. Substrate inductive device methods and apparatus
US9670588B2 (en) 2013-05-01 2017-06-06 Lam Research Corporation Anisotropic high resistance ionic current source (AHRICS)
US9449808B2 (en) 2013-05-29 2016-09-20 Novellus Systems, Inc. Apparatus for advanced packaging applications
US9677190B2 (en) 2013-11-01 2017-06-13 Lam Research Corporation Membrane design for reducing defects in electroplating systems
JP6411943B2 (ja) * 2014-05-26 2018-10-24 株式会社荏原製作所 基板電解処理装置、および該基板電解処理装置に使用されるパドル
US9816194B2 (en) 2015-03-19 2017-11-14 Lam Research Corporation Control of electrolyte flow dynamics for uniform electroplating
DE102015104838B4 (de) * 2015-03-30 2018-07-19 Harting Electric Gmbh & Co. Kg Sensormodul eines modularen Steckverbinders
US10014170B2 (en) 2015-05-14 2018-07-03 Lam Research Corporation Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
DE102015213499B4 (de) * 2015-07-17 2024-07-04 SUMIDA Components & Modules GmbH Spulenkörper
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US10573458B2 (en) * 2016-10-05 2020-02-25 The Boeing Company Superconducting air core inductor systems and methods
DE102017109499A1 (de) * 2017-05-03 2018-11-08 Valeo Siemens Eautomotive Germany Gmbh Inverter
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
JP6790016B2 (ja) * 2018-04-10 2020-11-25 上村工業株式会社 表面処理装置、表面処理方法及びパドル
CN108893771B (zh) * 2018-07-25 2020-01-17 河南理工大学 一种正多边形柱体阳极及电沉积制备大面积金属微结构的方法
JP7413614B1 (ja) * 2023-03-10 2024-01-15 キヤノンアネルバ株式会社 Ｘ線発生装置、ｘ線撮像装置およびモールド変圧器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2826747A (en) * 1956-10-24 1958-03-11 Dinion Coil Co Inc Pulse transformer construction
US3008108A (en) * 1956-11-13 1961-11-07 Burroughs Corp Toroidal coils
US2982888A (en) * 1957-05-23 1961-05-02 Rea Magnet Wire Company Inc Sleeve type encapsulated electrical component
BE638864A (enrdf_load_stackoverflow) * 1962-10-31
US3319207A (en) * 1963-07-18 1967-05-09 Davis Jesse Grooved toroidal body with metal filling
US3287795A (en) * 1964-06-05 1966-11-29 Western Electric Co Methods of assembling electrical components with circuits
US3377699A (en) * 1965-05-03 1968-04-16 Western Electric Co Fluidized bed coating a core containing metal board, including circuit forming, core wiring and connecting steps
US3316517A (en) * 1965-05-19 1967-04-25 Cons Electronics Ind Variable transformer with winding holding core housing
US3427231A (en) * 1965-07-21 1969-02-11 Litton Systems Inc Method of electroplating and electroforming gold in an ultrasonic field
US3390308A (en) * 1966-03-31 1968-06-25 Itt Multiple chip integrated circuit assembly

Also Published As

Publication number Publication date
FR1593893A (enrdf_load_stackoverflow) 1970-06-01
GB1189074A (en) 1970-04-22
US3652442A (en) 1972-03-28
CH488263A (de) 1970-03-31
DE1900392B2 (de) 1972-07-06
DE1900392A1 (de) 1969-07-31
FR1593898A (enrdf_load_stackoverflow) 1970-06-01
US3477051A (en) 1969-11-04
GB1242080A (en) 1971-08-11

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