GB1189074A - Apparatus for Electroplating Metal or Alloy Films - Google Patents
Apparatus for Electroplating Metal or Alloy FilmsInfo
- Publication number
- GB1189074A GB1189074A GB53255/68A GB5325568A GB1189074A GB 1189074 A GB1189074 A GB 1189074A GB 53255/68 A GB53255/68 A GB 53255/68A GB 5325568 A GB5325568 A GB 5325568A GB 1189074 A GB1189074 A GB 1189074A
- Authority
- GB
- United Kingdom
- Prior art keywords
- plating
- dielectric
- anode
- electro
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000009713 electroplating Methods 0.000 title abstract 4
- 229910045601 alloy Inorganic materials 0.000 title abstract 2
- 239000000956 alloy Substances 0.000 title abstract 2
- 239000002184 metal Substances 0.000 title abstract 2
- 229910052751 metal Inorganic materials 0.000 title abstract 2
- 238000007747 plating Methods 0.000 abstract 3
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 abstract 2
- 229940081974 saccharin Drugs 0.000 abstract 2
- 235000019204 saccharin Nutrition 0.000 abstract 2
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 abstract 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 abstract 1
- 229910002549 Fe–Cu Inorganic materials 0.000 abstract 1
- 241000080590 Niso Species 0.000 abstract 1
- 235000011054 acetic acid Nutrition 0.000 abstract 1
- 150000001243 acetic acids Chemical class 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000003989 dielectric material Substances 0.000 abstract 1
- MOTZDAYCYVMXPC-UHFFFAOYSA-N dodecyl hydrogen sulfate Chemical compound CCCCCCCCCCCCOS(O)(=O)=O MOTZDAYCYVMXPC-UHFFFAOYSA-N 0.000 abstract 1
- 235000019253 formic acid Nutrition 0.000 abstract 1
- 150000004674 formic acids Chemical class 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 229910001004 magnetic alloy Inorganic materials 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 229910052697 platinum Inorganic materials 0.000 abstract 1
- 229920000193 polymethacrylate Polymers 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 abstract 1
- 229940095064 tartrate Drugs 0.000 abstract 1
- 238000004804 winding Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/007—Electroplating using magnetic fields, e.g. magnets
- C25D5/009—Deposition of ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/49073—Electromagnet, transformer or inductor by assembling coil and core
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
- Electroplating Methods And Accessories (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
1,189,074. Electro-plating apparatus. INTERNATIONAL BUSINESS MACHINES CORP. Nov. 11, 1968 [Dec. 26, 1967], No.53255/68. Heading C7B. Apparatus for electro-plating metal or alloy films, particularly a Ni-Fe-Cu magnetic alloy film, comprises a container 10, e.g. of glass or plastic such as polymethacrylate, for a plating bath, in which an anode 24, e. g. of Mo, Ni or Pt, and a cathode 14, e.g. a conductive sheet of Cu, Ag, Ni, Co or Au on an insulating board, are arranged and selectively masked, by dielectric material, e. g. on their edges by dielectric container walls, to provide uniform current density at the cathode and thus no variation in film thickness or composition during electro-plating. The electrodes may be mounted one above the other, as shown in Fig. 2a, or vertically Fig. 2b (not shown) with their three edges in contact with the dielectric container walls and their fourth edge in contact with air as dielectric. The bath may be mounted inside Helmholz coils 12 and agitated during plating by moving one of the electrodes relative to the other or a carrier 34 back and forth by a motor 32 via linkage 36, or by flowing solution. For increasing the surface area of the anode 24 to prevent anodic oxidation deposits forming, a wire winding 26 of the same material may be wound around, or the anode may be corrugated or grooved. For uniformly plating a wire, as shown in Fig. 4, the wire 14 continuously passes by rollers 31 through a perforated hollow cylindrical anode 24, the ends of which are enclosed by dielectric discs 27 to prevent current spreading. Baths are specified containing: (1) NiSO 4 , FeSO 4 , with or without CuSO 4 , saccharin, sulphamic acid and KNa tartrate; (2) NiCl 2 , FeCl 2 , H 3 BO 3 , saccharin and Na lauryl sulphate; and (3) Cu(NO 3 ) 2 , H 2 SO 2 , formic and acetic acids.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69337567A | 1967-12-26 | 1967-12-26 | |
US69803168A | 1968-01-15 | 1968-01-15 | |
US2570870A | 1970-04-06 | 1970-04-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1189074A true GB1189074A (en) | 1970-04-22 |
Family
ID=27362610
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB53255/68A Expired GB1189074A (en) | 1967-12-26 | 1968-11-11 | Apparatus for Electroplating Metal or Alloy Films |
GB60557/68A Expired GB1242080A (en) | 1967-12-26 | 1968-12-20 | Improvements relating to electrical components |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB60557/68A Expired GB1242080A (en) | 1967-12-26 | 1968-12-20 | Improvements relating to electrical components |
Country Status (5)
Country | Link |
---|---|
US (2) | US3477051A (en) |
CH (1) | CH488263A (en) |
FR (2) | FR1593898A (en) |
GB (2) | GB1189074A (en) |
NL (1) | NL6900382A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108893771A (en) * | 2018-07-25 | 2018-11-27 | 河南理工大学 | A kind of method that regular polygon cylinder anode and electro-deposition prepare large-area metal micro-structure |
Families Citing this family (87)
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US4103267A (en) * | 1977-06-13 | 1978-07-25 | Burr-Brown Research Corporation | Hybrid transformer device |
US4304641A (en) * | 1980-11-24 | 1981-12-08 | International Business Machines Corporation | Rotary electroplating cell with controlled current distribution |
US4509024A (en) * | 1983-01-26 | 1985-04-02 | Safetran Systems Corporation | Impedance bond |
EP0188095A1 (en) * | 1984-12-13 | 1986-07-23 | East Rock Technology Inc. | Process for the manufacture of a toroidal ballast choke and machine for use in such process |
US4696729A (en) * | 1986-02-28 | 1987-09-29 | International Business Machines | Electroplating cell |
FR2656951A1 (en) * | 1990-01-05 | 1991-07-12 | Scherrer Fernand | TORQUE TYPE TRANSFORMER. |
DE4027994A1 (en) * | 1990-09-04 | 1992-03-05 | Gw Elektronik Gmbh | HF MAGNETIC COIL ARRANGEMENT AND METHOD FOR THEIR PRODUCTION |
US5312532A (en) * | 1993-01-15 | 1994-05-17 | International Business Machines Corporation | Multi-compartment eletroplating system |
US5421987A (en) * | 1993-08-30 | 1995-06-06 | Tzanavaras; George | Precision high rate electroplating cell and method |
US5597469A (en) * | 1995-02-13 | 1997-01-28 | International Business Machines Corporation | Process for selective application of solder to circuit packages |
US5522975A (en) * | 1995-05-16 | 1996-06-04 | International Business Machines Corporation | Electroplating workpiece fixture |
US5516412A (en) * | 1995-05-16 | 1996-05-14 | International Business Machines Corporation | Vertical paddle plating cell |
US6946716B2 (en) * | 1995-12-29 | 2005-09-20 | International Business Machines Corporation | Electroplated interconnection structures on integrated circuit chips |
US6709562B1 (en) | 1995-12-29 | 2004-03-23 | International Business Machines Corporation | Method of making electroplated interconnection structures on integrated circuit chips |
US6001235A (en) * | 1997-06-23 | 1999-12-14 | International Business Machines Corporation | Rotary plater with radially distributed plating solution |
US6103096A (en) * | 1997-11-12 | 2000-08-15 | International Business Machines Corporation | Apparatus and method for the electrochemical etching of a wafer |
US6106687A (en) * | 1998-04-28 | 2000-08-22 | International Business Machines Corporation | Process and diffusion baffle to modulate the cross sectional distribution of flow rate and deposition rate |
US6919010B1 (en) | 2001-06-28 | 2005-07-19 | Novellus Systems, Inc. | Uniform electroplating of thin metal seeded wafers using rotationally asymmetric variable anode correction |
US6251251B1 (en) | 1998-11-16 | 2001-06-26 | International Business Machines Corporation | Anode design for semiconductor deposition |
WO2000037715A1 (en) * | 1998-11-18 | 2000-06-29 | The Johns Hopkins University | Bismuth thin film structure and method of construction |
US6113759A (en) * | 1998-12-18 | 2000-09-05 | International Business Machines Corporation | Anode design for semiconductor deposition having novel electrical contact assembly |
US6261426B1 (en) | 1999-01-22 | 2001-07-17 | International Business Machines Corporation | Method and apparatus for enhancing the uniformity of electrodeposition or electroetching |
US6454918B1 (en) * | 1999-03-23 | 2002-09-24 | Electroplating Engineers Of Japan Limited | Cup type plating apparatus |
KR19990064747A (en) * | 1999-05-06 | 1999-08-05 | 이종구 | Manufacturing method of Ni-Fe alloy thin plate and its apparatus |
US6547937B1 (en) * | 2000-01-03 | 2003-04-15 | Semitool, Inc. | Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
US8308931B2 (en) * | 2006-08-16 | 2012-11-13 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US8475636B2 (en) | 2008-11-07 | 2013-07-02 | Novellus Systems, Inc. | Method and apparatus for electroplating |
US6527920B1 (en) | 2000-05-10 | 2003-03-04 | Novellus Systems, Inc. | Copper electroplating apparatus |
US7622024B1 (en) | 2000-05-10 | 2009-11-24 | Novellus Systems, Inc. | High resistance ionic current source |
US6669833B2 (en) * | 2000-10-30 | 2003-12-30 | International Business Machines Corporation | Process and apparatus for electroplating microscopic features uniformly across a large substrate |
US6869515B2 (en) | 2001-03-30 | 2005-03-22 | Uri Cohen | Enhanced electrochemical deposition (ECD) filling of high aspect ratio openings |
US7682498B1 (en) | 2001-06-28 | 2010-03-23 | Novellus Systems, Inc. | Rotationally asymmetric variable electrode correction |
US7569131B2 (en) * | 2002-08-12 | 2009-08-04 | International Business Machines Corporation | Method for producing multiple magnetic layers of materials with known thickness and composition using a one-step electrodeposition process |
US6955747B2 (en) * | 2002-09-23 | 2005-10-18 | International Business Machines Corporation | Cam driven paddle assembly for a plating cell |
DE10247051A1 (en) * | 2002-10-09 | 2004-04-22 | Polymer Latex Gmbh & Co Kg | Latex and process for its manufacture |
US20040084318A1 (en) * | 2002-11-05 | 2004-05-06 | Uri Cohen | Methods and apparatus for activating openings and for jets plating |
US20050063798A1 (en) * | 2003-06-06 | 2005-03-24 | Davis Jeffry Alan | Interchangeable workpiece handling apparatus and associated tool for processing microfeature workpieces |
US7393439B2 (en) * | 2003-06-06 | 2008-07-01 | Semitool, Inc. | Integrated microfeature workpiece processing tools with registration systems for paddle reactors |
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US7371306B2 (en) * | 2003-06-06 | 2008-05-13 | Semitool, Inc. | Integrated tool with interchangeable wet processing components for processing microfeature workpieces |
US20050050767A1 (en) * | 2003-06-06 | 2005-03-10 | Hanson Kyle M. | Wet chemical processing chambers for processing microfeature workpieces |
US6881437B2 (en) * | 2003-06-16 | 2005-04-19 | Blue29 Llc | Methods and system for processing a microelectronic topography |
US20070144912A1 (en) * | 2003-07-01 | 2007-06-28 | Woodruff Daniel J | Linearly translating agitators for processing microfeature workpieces, and associated methods |
US7100954B2 (en) * | 2003-07-11 | 2006-09-05 | Nexx Systems, Inc. | Ultra-thin wafer handling system |
US8623193B1 (en) | 2004-06-16 | 2014-01-07 | Novellus Systems, Inc. | Method of electroplating using a high resistance ionic current source |
WO2006033315A1 (en) | 2004-09-24 | 2006-03-30 | Ibiden Co., Ltd. | Plating method and plating apparatus |
US7931786B2 (en) * | 2005-11-23 | 2011-04-26 | Semitool, Inc. | Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces |
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US20080178460A1 (en) * | 2007-01-29 | 2008-07-31 | Woodruff Daniel J | Protected magnets and magnet shielding for processing microfeature workpieces, and associated systems and methods |
US7799684B1 (en) | 2007-03-05 | 2010-09-21 | Novellus Systems, Inc. | Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers |
US20090134039A1 (en) * | 2007-11-28 | 2009-05-28 | Mehlin Dean Matthews | System and method for isotope selective chemical reacations |
US8177944B2 (en) * | 2007-12-04 | 2012-05-15 | Ebara Corporation | Plating apparatus and plating method |
US7964506B1 (en) | 2008-03-06 | 2011-06-21 | Novellus Systems, Inc. | Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers |
US8703615B1 (en) | 2008-03-06 | 2014-04-22 | Novellus Systems, Inc. | Copper electroplating process for uniform across wafer deposition and void free filling on ruthenium coated wafers |
US8513124B1 (en) | 2008-03-06 | 2013-08-20 | Novellus Systems, Inc. | Copper electroplating process for uniform across wafer deposition and void free filling on semi-noble metal coated wafers |
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US20120261254A1 (en) | 2011-04-15 | 2012-10-18 | Reid Jonathan D | Method and apparatus for filling interconnect structures |
US8475637B2 (en) * | 2008-12-17 | 2013-07-02 | Novellus Systems, Inc. | Electroplating apparatus with vented electrolyte manifold |
US8262871B1 (en) | 2008-12-19 | 2012-09-11 | Novellus Systems, Inc. | Plating method and apparatus with multiple internally irrigated chambers |
US9664711B2 (en) * | 2009-07-31 | 2017-05-30 | Pulse Electronics, Inc. | Current sensing devices and methods |
US9823274B2 (en) * | 2009-07-31 | 2017-11-21 | Pulse Electronics, Inc. | Current sensing inductive devices |
US9151782B2 (en) * | 2009-07-31 | 2015-10-06 | Pulse Electronics, Inc. | Current sensing devices and methods |
US8795480B2 (en) | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
US10094034B2 (en) | 2015-08-28 | 2018-10-09 | Lam Research Corporation | Edge flow element for electroplating apparatus |
US9624592B2 (en) | 2010-07-02 | 2017-04-18 | Novellus Systems, Inc. | Cross flow manifold for electroplating apparatus |
US10233556B2 (en) | 2010-07-02 | 2019-03-19 | Lam Research Corporation | Dynamic modulation of cross flow manifold during electroplating |
US9523155B2 (en) | 2012-12-12 | 2016-12-20 | Novellus Systems, Inc. | Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating |
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US20120249107A1 (en) * | 2011-04-01 | 2012-10-04 | Cowley Nicholas P | Coupled inductor to facilitate integrated power delivery |
US9304149B2 (en) | 2012-05-31 | 2016-04-05 | Pulse Electronics, Inc. | Current sensing devices and methods |
US8920616B2 (en) * | 2012-06-18 | 2014-12-30 | Headway Technologies, Inc. | Paddle for electroplating for selectively depositing greater thickness |
US20140125446A1 (en) | 2012-11-07 | 2014-05-08 | Pulse Electronics, Inc. | Substrate inductive device methods and apparatus |
US9670588B2 (en) | 2013-05-01 | 2017-06-06 | Lam Research Corporation | Anisotropic high resistance ionic current source (AHRICS) |
US9449808B2 (en) | 2013-05-29 | 2016-09-20 | Novellus Systems, Inc. | Apparatus for advanced packaging applications |
US9677190B2 (en) | 2013-11-01 | 2017-06-13 | Lam Research Corporation | Membrane design for reducing defects in electroplating systems |
JP6411943B2 (en) * | 2014-05-26 | 2018-10-24 | 株式会社荏原製作所 | Substrate electrolytic treatment apparatus and paddle used for the substrate electrolytic treatment apparatus |
US9816194B2 (en) | 2015-03-19 | 2017-11-14 | Lam Research Corporation | Control of electrolyte flow dynamics for uniform electroplating |
DE102015104838B4 (en) * | 2015-03-30 | 2018-07-19 | Harting Electric Gmbh & Co. Kg | Sensor module of a modular connector |
US10014170B2 (en) | 2015-05-14 | 2018-07-03 | Lam Research Corporation | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
DE102015213499A1 (en) * | 2015-07-17 | 2017-01-19 | SUMIDA Components & Modules GmbH | bobbins |
US10364505B2 (en) | 2016-05-24 | 2019-07-30 | Lam Research Corporation | Dynamic modulation of cross flow manifold during elecroplating |
US10573458B2 (en) * | 2016-10-05 | 2020-02-25 | The Boeing Company | Superconducting air core inductor systems and methods |
DE102017109499A1 (en) * | 2017-05-03 | 2018-11-08 | Valeo Siemens Eautomotive Germany Gmbh | inverter |
US11001934B2 (en) | 2017-08-21 | 2021-05-11 | Lam Research Corporation | Methods and apparatus for flow isolation and focusing during electroplating |
US10781527B2 (en) | 2017-09-18 | 2020-09-22 | Lam Research Corporation | Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating |
JP6790016B2 (en) * | 2018-04-10 | 2020-11-25 | 上村工業株式会社 | Surface treatment equipment, surface treatment method and paddle |
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---|---|---|---|---|
US2826747A (en) * | 1956-10-24 | 1958-03-11 | Dinion Coil Co Inc | Pulse transformer construction |
US3008108A (en) * | 1956-11-13 | 1961-11-07 | Burroughs Corp | Toroidal coils |
US2982888A (en) * | 1957-05-23 | 1961-05-02 | Rea Magnet Wire Company Inc | Sleeve type encapsulated electrical component |
NL299926A (en) * | 1962-10-31 | |||
US3319207A (en) * | 1963-07-18 | 1967-05-09 | Davis Jesse | Grooved toroidal body with metal filling |
US3287795A (en) * | 1964-06-05 | 1966-11-29 | Western Electric Co | Methods of assembling electrical components with circuits |
US3377699A (en) * | 1965-05-03 | 1968-04-16 | Western Electric Co | Fluidized bed coating a core containing metal board, including circuit forming, core wiring and connecting steps |
US3316517A (en) * | 1965-05-19 | 1967-04-25 | Cons Electronics Ind | Variable transformer with winding holding core housing |
US3427231A (en) * | 1965-07-21 | 1969-02-11 | Litton Systems Inc | Method of electroplating and electroforming gold in an ultrasonic field |
US3390308A (en) * | 1966-03-31 | 1968-06-25 | Itt | Multiple chip integrated circuit assembly |
-
1968
- 1968-01-15 US US698031A patent/US3477051A/en not_active Expired - Lifetime
- 1968-11-11 GB GB53255/68A patent/GB1189074A/en not_active Expired
- 1968-11-20 FR FR1593898D patent/FR1593898A/fr not_active Expired
- 1968-11-20 FR FR1593893D patent/FR1593893A/fr not_active Expired
- 1968-12-16 CH CH1858968A patent/CH488263A/en not_active IP Right Cessation
- 1968-12-20 GB GB60557/68A patent/GB1242080A/en not_active Expired
-
1969
- 1969-01-10 NL NL6900382A patent/NL6900382A/xx not_active Application Discontinuation
-
1970
- 1970-04-06 US US25708A patent/US3652442A/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108893771A (en) * | 2018-07-25 | 2018-11-27 | 河南理工大学 | A kind of method that regular polygon cylinder anode and electro-deposition prepare large-area metal micro-structure |
Also Published As
Publication number | Publication date |
---|---|
US3652442A (en) | 1972-03-28 |
DE1900392A1 (en) | 1969-07-31 |
US3477051A (en) | 1969-11-04 |
NL6900382A (en) | 1969-07-17 |
CH488263A (en) | 1970-03-31 |
FR1593898A (en) | 1970-06-01 |
FR1593893A (en) | 1970-06-01 |
GB1242080A (en) | 1971-08-11 |
DE1900392B2 (en) | 1972-07-06 |
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PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |