JPS62110975A - Plating treatment of carbon fiber bundle - Google Patents
Plating treatment of carbon fiber bundleInfo
- Publication number
- JPS62110975A JPS62110975A JP60249582A JP24958285A JPS62110975A JP S62110975 A JPS62110975 A JP S62110975A JP 60249582 A JP60249582 A JP 60249582A JP 24958285 A JP24958285 A JP 24958285A JP S62110975 A JPS62110975 A JP S62110975A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- cathode
- carbon fiber
- fiber bundle
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Liquid Crystal (AREA)
- Treatment Of Fiber Materials (AREA)
- Reinforced Plastic Materials (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、炭素繊維束のメッキ処理方法に関し、詳しく
は、本メッキ処理工程に先立って前メッキ処理工程を配
置したメッキ処理方法に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for plating carbon fiber bundles, and more particularly to a plating method in which a pre-plating step is arranged prior to the main plating step.
〈従来技術〉
炭素繊維束に金属を被覆してなる金属被覆炭素m雄は熱
硬化性樹脂や熱可塑性樹脂の強化材として用いたり、電
磁遮蔽材として用いる竿、種々の用途に適用されている
。<Prior art> Metal-coated carbon fibers, which are made by coating carbon fiber bundles with metal, are used in various applications such as reinforcing materials for thermosetting resins and thermoplastic resins, and rods used as electromagnetic shielding materials. .
従来、この炭素Hkm東に金属メッキを施すには、メッ
キ槽内に陽極を配置し、さらに前記炭素繊維束を数個の
陰極ロール間を通して、蛇行状に走行させ、前記メッキ
槽内に浸漬させている。Conventionally, in order to apply metal plating to this carbon Hkm east, an anode is placed in a plating tank, and the carbon fiber bundle is passed between several cathode rolls, run in a meandering manner, and immersed in the plating tank. ing.
〈発明が解決しようとする問題点〉
ところで、前記炭Jm 、w束の繊維は、導電性はあっ
ても、金属に比して固有抵抗が大で、しかも7〜14p
mの極細状のフィラメントが1.000〜12.000
本程度、集束されてなるから、その表面抵抗も人きく、
メッキ被膜が形成される前は、中位長さちりの′電気抵
抗が大である。このため、該繊維にメッキ処理を施す場
合には整流器の電圧を高くしなければ、繊維束に電流を
流すことができない、しかも、従来の陰極ロールにおけ
る接点法では、ち然、被処理物表面への給電が優先され
ることから、かかる)R>K繊維束のような形状では1
表面部と中心部がムラになってメッキされ易く、そのメ
ンキ被膜の電気抵抗は小であることから、最初に形成さ
れた被膜に、さらに集中してメッキ被膜が形成される。<Problems to be Solved by the Invention> Incidentally, although the fibers of the charcoal Jm and w bundles have electrical conductivity, they have a higher specific resistance than metals, and moreover, they have a resistivity of 7 to 14p.
m ultrafine filament is 1.000 to 12.000
Since it is focused like a book, its surface resistance is also impressive.
Before the plating film is formed, the electrical resistance of medium length dust is high. For this reason, when plating the fibers, it is necessary to increase the voltage of the rectifier in order to pass current through the fiber bundle.Moreover, with the conventional contact method using the cathode roll, the plating process does not directly apply to the surface of the object to be treated. Since priority is given to power feeding to R>K fiber bundle, 1
Since the surface and center portions are likely to be plated unevenly and the electrical resistance of the plating film is low, the plating film is formed more concentrated on the first formed film.
このため、均一な被覆を形成し難い欠点がある。For this reason, there is a drawback that it is difficult to form a uniform coating.
本発明は、かかる技術的課題に対応して、前記した本メ
ッキ処理の前段階として、炭素繊維に、メンキ被膜を均
一に形成し得る前メッキ処理[程を備えたメッキ処理方
法の提供を目的とするものである。In response to such technical problems, the present invention aims to provide a plating process that includes a pre-plating process that can uniformly form a coating film on carbon fibers as a pre-stage of the above-mentioned main plating process. That is.
く問題点を解決するためのf段〉 本発明は、第1図に示すように、メッキ浴を。Step F to solve problems The present invention uses a plating bath as shown in FIG.
陰極4を配置した陰極室5と、陽極6を配置した陽極室
7とに、細孔3を形成された絶縁性隔壁2で区画し、炭
素繊維束Xを、絶縁性隔壁2の細孔3内を通過させて、
陰極室5から陽極室7へ連続走行させてなる前メッキ処
理工程を、本メッキ処理工程の1i)に配置したことを
特徴とするものである。A cathode chamber 5 in which the cathode 4 is disposed and an anode chamber 7 in which the anode 6 is disposed are partitioned by an insulating partition wall 2 in which pores 3 are formed, and the carbon fiber bundles X are separated from the pores 3 in the insulating partition wall 2. Let it pass through the inside,
The present invention is characterized in that the pre-plating process, in which the plating process is carried out continuously from the cathode chamber 5 to the anode chamber 7, is placed in 1i) of the main plating process.
く作用〉
絶縁性隔172の細孔3により、前記陰極室5と、陽極
室7とを区画すると、陽極7からの電流は、前記細孔3
を介して、陰極4に至ることとなる。そこで、前記細孔
3に、炭素繊維束Xを通過ゴセると、jノ東繊維東Xの
フィラメントは、前記411 孔3の前部の陰極室5側
で、フィラメントの周面は、みかけLの陽極として作用
し、また、前記細孔3の後部の陽極室7側で、みかけ」
二の陰極となる。ここで特筆すべきことは、被処理物が
通常の金属素材であれば、陰極室5側で、被処理物が陽
極化して、その表面が溶解する。このため、メ、キ液の
汚れが激しくなって、適正なメッキ作業が困難となり、
かつ各電解室を隔離する必要が生じる。また、被処理物
の表面の溶解により、該表面に欠陥を生じる。従って、
この処理方法は、実質的に適用不u)能である。しかる
に、炭素素材であれば、かかる現象が生じないため、陰
極室5と陽極室7とを隔離する必要が全くない。さらに
陽極室7で陰極化したam束のフィラメントがすべて液
中で給電されることになり、従来の陰極ロールにおける
接点法に比べ均一な給′屯が可能となる。このため、前
記細孔3の後部で、炭素繊維束Xの各フィラメントの周
面に、均一・なメンキが施される。また、陰極室5から
陽極室7へ移行するに際して、−・]−1,槽外へ導出
させる盛装がないので、炭ふ繊維束Xが陽極となる領域
と、陰極となる領域との間の距離を極めて短くすること
ができ、このため幣流寞の電圧は十分低い値であっても
通電が得られ1表面に薄膜状のメッキ被膜の形成が1′
+丁能となる。尚、陽極室と陰極室との間に什すJり板
を入れたのは、陽極板と陰極板との間を直接に流れる無
駄電流を抑−1するためである。Effect> When the cathode chamber 5 and the anode chamber 7 are partitioned by the pores 3 of the insulating partition 172, the current from the anode 7 flows through the pores 3.
It will reach the cathode 4 via. Therefore, when the carbon fiber bundle X is passed through the pore 3, the filament of J Noto Fiber East Also, on the anode chamber 7 side at the rear of the pore 3, the apparent
It becomes the second cathode. What should be noted here is that if the object to be treated is a normal metal material, the object will be anodized on the cathode chamber 5 side and its surface will be dissolved. As a result, the plating solution becomes extremely dirty, making it difficult to perform proper plating work.
Moreover, it becomes necessary to isolate each electrolytic chamber. Further, the dissolution of the surface of the object to be processed causes defects on the surface. Therefore,
This treatment method is practically inapplicable. However, if carbon material is used, such a phenomenon does not occur, so there is no need to isolate the cathode chamber 5 and the anode chamber 7. Further, all of the filaments of the am bundle cathodized in the anode chamber 7 are supplied with electricity in the liquid, which makes it possible to supply electricity more uniformly than in the conventional contact method using a cathode roll. Therefore, uniform coating is applied to the peripheral surface of each filament of the carbon fiber bundle X at the rear of the pore 3. In addition, when moving from the cathode chamber 5 to the anode chamber 7, -・]-1, since there is no embellishment to guide it out of the tank, there is a gap between the area where the charcoal fiber bundle X becomes the anode and the area where it becomes the cathode. The distance can be made extremely short, so even if the voltage of the current is sufficiently low, current can be obtained and a thin plating film can be formed on the surface.
+ Becomes Ding Noh. The purpose of inserting the J-plate between the anode chamber and the cathode chamber is to suppress wasteful current flowing directly between the anode plate and the cathode plate.
前記した前メンキ処理により、薄膜状のメッキ被膜か形
成された炭Z tJj維束Xは、さらに本メッキ処理が
施される。この場合に、フィラメントの周面には、すで
にメッキ被膜が均一に形成されているから、該被膜が陰
極となって、重畳的にメッキ処理が施され、所定厚の金
属被膜が形成される。The charcoal Z tJj fiber bundle X on which a thin plating film has been formed by the pre-plating process described above is further subjected to the main plating process. In this case, since a plating film has already been uniformly formed on the circumferential surface of the filament, the plating film serves as a cathode and plating is applied in an overlapping manner to form a metal film of a predetermined thickness.
〈実施例〉 第2.3図について本発明の−・実施例を説明する。<Example> An embodiment of the invention will now be described with reference to FIG. 2.3.
1は1本発明に適用する1t1メッキ処理用の電着槽で
あって、その中央には、細孔3が形成された絶縁性隔壁
2がひ設され、該電着槽1内を前後に区画している。そ
の前部の区画室には、左右に対向して、−個の陰極4.
4が配設されて、該室を陰極室5としている。またその
後部の区画室には、同じく左右に対向して二個の陽極6
,6が配設され、該室を陽極室7としている。Reference numeral 1 denotes an electrodeposition tank for 1t1 plating applied to the present invention, in the center of which is installed an insulating partition wall 2 in which pores 3 are formed. It is divided. In the front compartment, - cathodes 4.
4 is arranged, and this chamber is used as a cathode chamber 5. In addition, in the rear compartment, there are also two anodes 6 facing left and right.
, 6 are arranged, and this chamber is used as an anode chamber 7.
前記細孔3の前後位置で、陰極室5及び陽極室7には、
案内ロール8a、8bか浸漬配置され、前記案内ロール
8aJ−に配置した走行ロール9aに掛けた炭素繊維束
Xを案内ロール8aに掛渡し、前記案内ロール8a、8
b間で、前記細孔3を通過させて直線走行させ、さらに
後部の走行ロール9bにIn eして、前送りするよう
にしている。At the front and back positions of the pore 3, the cathode chamber 5 and the anode chamber 7 include:
The guide rolls 8a, 8b are arranged in a immersed manner, and the carbon fiber bundle
Between b and 3, the paper passes through the pores 3 and travels in a straight line, and is further fed forward by passing through the rear running rolls 9b.
前記電着槽1内で、陽極6.6と陰極4.4間には前記
細孔3を経由し、炭素繊維束Xを介して゛電流が流れる
。このため、前記細孔3を走行する炭素繊維束Xにあっ
て、細孔3の前部で、そのフィラメントの周面がみかけ
上の陽極の作用を生じる。このため、電気分解により、
前記炭素繊維束X内から酸素ガスが発生する。かかる酸
素ガスの発生により、炭素#am東Xはほぐされて開繊
し、次の前メッキ処理が、良好になされる。In the electrodeposition bath 1, a current flows between the anode 6.6 and the cathode 4.4 via the pores 3 and the carbon fiber bundles X. Therefore, in the carbon fiber bundle X running through the pores 3, the peripheral surface of the filament acts as an apparent anode at the front of the pores 3. Therefore, by electrolysis,
Oxygen gas is generated from within the carbon fiber bundle X. Due to the generation of such oxygen gas, the carbon #amTOX is loosened and opened, and the next pre-plating treatment can be performed satisfactorily.
前記細孔3の後部では、炭素mra東Xのフィラメント
の周面は陰極として作用する。このため。At the rear of said pore 3, the peripheral surface of the filament of carbon mra TOX acts as a cathode. For this reason.
該フィラメント周面にメッキ処理が均−比なされて、薄
膜状のメッキ被膜が形成される。The peripheral surface of the filament is uniformly plated to form a thin plating film.
前記のように前メッキ処理を施された炭素繊維束Xは1
本メッキ処理槽lO側に連続的に移送される。The carbon fiber bundle X subjected to the pre-plating treatment as described above is 1
It is continuously transferred to the main plating treatment tank IO side.
前記本メッキ処理槽lOは、第2図に示すように、槽内
に案内ロール11と、陽極12とが交互に配置され、さ
らに、前記陽極12上に陰極ロール13が配設される。As shown in FIG. 2, in the main plating tank IO, guide rolls 11 and anodes 12 are arranged alternately in the tank, and a cathode roll 13 is further arranged on the anode 12.
前記炭素繊維束Xは、陰極ロール13と、案内ロール1
1とを交互に掛渡されて、蛇行状に走行し、前記陰極ロ
ール13により負電荷を印加されて陰極となり、このた
め前記本メッキ処理槽lO内で、陽極12と対向するこ
とにより、そのフィラメント表面にメッキ被膜が形成さ
れる。The carbon fiber bundle X has a cathode roll 13 and a guide roll 1.
1 and 1 alternately run in a meandering manner, and a negative charge is applied by the cathode roll 13 to become a cathode. A plating film is formed on the filament surface.
かかる木メッキ処理に際して、前記フィラメントの表面
には、前記電着槽lで、既に、メッキ披11りを形成さ
れているから、該被膜が陰極となり。During this wood plating process, since a plating layer 11 has already been formed on the surface of the filament in the electrodeposition tank 1, this coating serves as a cathode.
該メッキ被膜にt畳してメッキ処理が施される。The plated film is then subjected to plating treatment.
重犯炭素繊維東Xは、その蛇行走行により1本メッキ処
理槽lO内の浸漬時間を長く確保されているから、充分
な厚の金属被膜が形成される。Because the serious carbon fiber TOX is immersed in the plating tank IO for a long time due to its serpentine running, a sufficiently thick metal coating is formed.
炭素繊維束Xはかかる本メッキ処理を施されて1次の処
理槽30側に順次移行する。The carbon fiber bundles X are subjected to the main plating treatment and sequentially transferred to the primary treatment tank 30 side.
第4図は、本発明の他の実施例を示す。FIG. 4 shows another embodiment of the invention.
すなわち、前記本メッキ処理槽lOの入口部に、ド底の
中央に細孔41が形成され、かつ内面には、陰極壁42
が形成された筒状の絶縁性隔壁40を配設したものであ
り、炭素繊維束Xを該絶縁性隔壁40内を走行させて、
細孔41を通過させ、案内ロール11を下方から掛渡し
、さらに陰極ロール13.案内ロール11間を蛇行状に
走行させるようにしたものである。That is, a pore 41 is formed at the center of the bottom at the entrance of the main plating tank IO, and a cathode wall 42 is formed on the inner surface.
A cylindrical insulating partition wall 40 in which a carbon fiber bundle
The guide roll 11 is passed through the pores 41 from below, and the cathode roll 13. It is configured to run in a meandering manner between the guide rolls 11.
前記実施例にあって、絶縁性隔壁40内で、陰極室5が
構成され、かつ本メッキ処理槽10内が、前メッキ処理
用の陽極室7と、本メッキ処理槽とを兼用していること
となる。In the embodiment described above, the cathode chamber 5 is configured within the insulating partition 40, and the interior of the main plating tank 10 serves as both the anode chamber 7 for pre-plating and the main plating tank. That will happen.
かかる構成にあっても、細孔41の出「1部で、炭素繊
維束Xのフィラメントに前処理メッキが施され、メッキ
被膜が形成される。Even with such a configuration, pretreatment plating is applied to the filaments of the carbon fiber bundle X at a portion of the pores 41, thereby forming a plating film.
ただし、かかる手段にあっては、前記陰極壁42にメッ
キ被膜が析出形成されるから、適宜に交換する必要を生
ずる。However, in such a method, a plating film is deposited on the cathode wall 42, so that it becomes necessary to replace the cathode wall 42 as needed.
〈発明の効果〉
本発明は、上述のように、隔壁の細孔を炭素繊維束xを
通過させて、そのフィラメントにメッキ被膜を形成して
前メッキ処理をし、その後に1本メッキ処理を施すよう
にしたから、炭素m雄型Xのフィラメントの金属被膜の
形成をムラ無く、かつ低電圧で良好に施すことができる
等の優れた効果がある。<Effects of the Invention> As described above, the present invention allows the carbon fiber bundle x to pass through the pores of the partition wall, forms a plating film on the filament, performs a pre-plating process, and then performs a single plating process. As a result, the metal coating of the carbon m-male type X filament can be formed evenly and satisfactorily at a low voltage.
添付図面は本考案の実施例を示し第1図は本発明方法の
原理図、第2図は第一実施例の側面図、第3図は電着槽
lのf面図、第4図は第二実施例の側面図である。
l:電着槽 2,40;絶縁性隔壁 3.41;細孔
4;陰極 5:陰極室 6;陽極 7:陽極室 10.
本メッキ処理槽 11;案内ロール 12;陽極 13
;陰極ロール 42;陰極壁 X:炭素m雄型
出願人 株式会社 中央製作所奥野製薬玉業株
式会社
代理人 弁理1: 松 浦 喜 多 男 ・・:゛
′
第1 口
第4図
2「 糸走 肴ロ J、E 書
昭和61年3月5日The accompanying drawings show an embodiment of the present invention, and FIG. 1 is a diagram of the principle of the method of the present invention, FIG. 2 is a side view of the first embodiment, FIG. It is a side view of a second example. l: Electrodeposition tank 2,40; Insulating partition wall 3.41; Pore
4; Cathode 5: Cathode chamber 6; Anode 7: Anode chamber 10.
Main plating tank 11; Guide roll 12; Anode 13
; Cathode roll 42; Cathode wall Sakero J, E Book March 5, 1986
Claims (1)
陽極室とに、細孔を形成された絶縁性隔壁で区画し、炭
素繊維束を、絶縁性隔壁の細孔内を通過させて、陰極室
から陽極室へ連続走行させてなる前メッキ処理工程を、
本メッキ処理工程の前に配置したことを特徴とする炭素
繊維束のメッキ処理方法。The plating bath is divided into a cathode chamber in which a cathode is disposed and an anode chamber in which an anode is disposed by an insulating partition wall having pores formed therein, and the carbon fiber bundle is passed through the pores of the insulating partition wall. , the pre-plating process consists of continuous movement from the cathode chamber to the anode chamber.
A method for plating carbon fiber bundles, characterized in that the plating process is performed before the main plating process.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60249582A JPS62110975A (en) | 1985-11-07 | 1985-11-07 | Plating treatment of carbon fiber bundle |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60249582A JPS62110975A (en) | 1985-11-07 | 1985-11-07 | Plating treatment of carbon fiber bundle |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62110975A true JPS62110975A (en) | 1987-05-22 |
Family
ID=17195150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60249582A Pending JPS62110975A (en) | 1985-11-07 | 1985-11-07 | Plating treatment of carbon fiber bundle |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62110975A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006055952A (en) * | 2004-08-20 | 2006-03-02 | Asahi Diamond Industrial Co Ltd | Device and method of manufacturing ultra-long tool |
JP2009533557A (en) * | 2006-04-20 | 2009-09-17 | ヴァーレ、インコ、リミテッド | Apparatus and foam electroplating method |
JP4517010B1 (en) * | 2010-03-18 | 2010-08-04 | 株式会社ムラタ | Apparatus and method for plating against carbon fiber |
EP2529888A1 (en) * | 2011-06-01 | 2012-12-05 | Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense | Method and apparatus for making a fixed abrasive wire |
JP2013155413A (en) * | 2012-01-31 | 2013-08-15 | Fudauchi Kogyo Co Ltd | Noncontact plating method and device therefor |
-
1985
- 1985-11-07 JP JP60249582A patent/JPS62110975A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006055952A (en) * | 2004-08-20 | 2006-03-02 | Asahi Diamond Industrial Co Ltd | Device and method of manufacturing ultra-long tool |
JP2009533557A (en) * | 2006-04-20 | 2009-09-17 | ヴァーレ、インコ、リミテッド | Apparatus and foam electroplating method |
JP4517010B1 (en) * | 2010-03-18 | 2010-08-04 | 株式会社ムラタ | Apparatus and method for plating against carbon fiber |
JP2011089194A (en) * | 2010-03-18 | 2011-05-06 | Murata:Kk | Device and method for plating carbon fiber |
EP2529888A1 (en) * | 2011-06-01 | 2012-12-05 | Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense | Method and apparatus for making a fixed abrasive wire |
JP2013155413A (en) * | 2012-01-31 | 2013-08-15 | Fudauchi Kogyo Co Ltd | Noncontact plating method and device therefor |
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