NL6811007A - - Google Patents
Info
- Publication number
- NL6811007A NL6811007A NL6811007A NL6811007A NL6811007A NL 6811007 A NL6811007 A NL 6811007A NL 6811007 A NL6811007 A NL 6811007A NL 6811007 A NL6811007 A NL 6811007A NL 6811007 A NL6811007 A NL 6811007A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/251—Materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/923—Bond pads having multiple stacked layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/951—Materials of bond pads
- H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US65837767A | 1967-08-04 | 1967-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL6811007A true NL6811007A (https=) | 1969-02-06 |
Family
ID=24641005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6811007A NL6811007A (https=) | 1967-08-04 | 1968-08-02 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US3507756A (https=) |
| AT (1) | AT278906B (https=) |
| BE (1) | BE718867A (https=) |
| CH (1) | CH482306A (https=) |
| ES (1) | ES356784A1 (https=) |
| FR (1) | FR1578320A (https=) |
| GB (1) | GB1226814A (https=) |
| IL (1) | IL30464A (https=) |
| NL (1) | NL6811007A (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5515874B1 (https=) * | 1971-06-08 | 1980-04-26 |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3658489A (en) * | 1968-08-09 | 1972-04-25 | Nippon Electric Co | Laminated electrode for a semiconductor device |
| US3953266A (en) * | 1968-11-28 | 1976-04-27 | Toshio Takai | Process for fabricating a semiconductor device |
| US3620932A (en) * | 1969-05-05 | 1971-11-16 | Trw Semiconductors Inc | Beam leads and method of fabrication |
| DE1954499A1 (de) * | 1969-10-29 | 1971-05-06 | Siemens Ag | Verfahren zur Herstellung von Halbleiterschaltkreisen mit Leitbahnen |
| US3634202A (en) * | 1970-05-19 | 1972-01-11 | Lignes Telegraph Telephon | Process for the production of thick film conductors and circuits incorporating such conductors |
| US3668484A (en) * | 1970-10-28 | 1972-06-06 | Rca Corp | Semiconductor device with multi-level metalization and method of making the same |
| FR2209216B1 (https=) * | 1972-11-30 | 1977-09-30 | Ibm | |
| US4988412A (en) * | 1988-12-27 | 1991-01-29 | General Electric Company | Selective electrolytic desposition on conductive and non-conductive substrates |
| JP3166221B2 (ja) * | 1991-07-23 | 2001-05-14 | 日本電気株式会社 | 半導体装置及びその製造方法 |
| JP2861629B2 (ja) * | 1992-05-27 | 1999-02-24 | 日本電気株式会社 | 半導体装置 |
| US5679982A (en) * | 1993-02-24 | 1997-10-21 | Intel Corporation | Barrier against metal diffusion |
| EP0877417A1 (en) * | 1997-05-09 | 1998-11-11 | Lucent Technologies Inc. | Method for fabrication of electrodes and other electrically-conductive structures |
| US6836015B2 (en) * | 2003-05-02 | 2004-12-28 | International Business Machines Corporation | Optical assemblies for transmitting and manipulating optical beams |
| US6922294B2 (en) * | 2003-05-02 | 2005-07-26 | International Business Machines Corporation | Optical communication assembly |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3287612A (en) * | 1963-12-17 | 1966-11-22 | Bell Telephone Labor Inc | Semiconductor contacts and protective coatings for planar devices |
| US3386894A (en) * | 1964-09-28 | 1968-06-04 | Northern Electric Co | Formation of metallic contacts |
| US3388048A (en) * | 1965-12-07 | 1968-06-11 | Bell Telephone Labor Inc | Fabrication of beam lead semiconductor devices |
-
1967
- 1967-08-04 US US658377A patent/US3507756A/en not_active Expired - Lifetime
-
1968
- 1968-04-18 GB GB1226814D patent/GB1226814A/en not_active Expired
- 1968-07-17 ES ES356784A patent/ES356784A1/es not_active Expired
- 1968-07-29 IL IL30464A patent/IL30464A/en unknown
- 1968-07-31 BE BE718867D patent/BE718867A/xx unknown
- 1968-08-02 AT AT757268A patent/AT278906B/de not_active IP Right Cessation
- 1968-08-02 FR FR1578320D patent/FR1578320A/fr not_active Expired
- 1968-08-02 NL NL6811007A patent/NL6811007A/xx unknown
- 1968-08-05 CH CH1171068A patent/CH482306A/de unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5515874B1 (https=) * | 1971-06-08 | 1980-04-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| US3507756A (en) | 1970-04-21 |
| CH482306A (de) | 1969-11-30 |
| AT278906B (de) | 1970-02-25 |
| ES356784A1 (es) | 1970-02-01 |
| BE718867A (https=) | 1968-12-31 |
| IL30464A0 (en) | 1968-09-26 |
| GB1226814A (https=) | 1971-03-31 |
| FR1578320A (https=) | 1969-08-14 |
| IL30464A (en) | 1971-04-28 |