NL6808229A - - Google Patents
Info
- Publication number
- NL6808229A NL6808229A NL6808229A NL6808229A NL6808229A NL 6808229 A NL6808229 A NL 6808229A NL 6808229 A NL6808229 A NL 6808229A NL 6808229 A NL6808229 A NL 6808229A NL 6808229 A NL6808229 A NL 6808229A
- Authority
- NL
- Netherlands
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US64502567A | 1967-06-15 | 1967-06-15 | |
| US654025A US3416597A (en) | 1967-06-15 | 1967-06-15 | Heat sink for forced air or convection cooling of semiconductors |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL6808229A true NL6808229A (en:Method) | 1968-12-16 |
Family
ID=27094610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL6808229A NL6808229A (en:Method) | 1967-06-15 | 1968-06-12 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3416597A (en:Method) |
| BE (1) | BE716446A (en:Method) |
| DE (1) | DE1764486C3 (en:Method) |
| FR (1) | FR1586363A (en:Method) |
| GB (1) | GB1172332A (en:Method) |
| NL (1) | NL6808229A (en:Method) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2640000C2 (de) * | 1976-09-04 | 1986-09-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Zylindrische Kühldose mit gegenüberliegenden Ein- und Ausflußöffnungen für flüssigkeitsgekühlte Leistungshalbleiterbauelemente und Verfahren zur Herstellung derselben |
| DE2739242C2 (de) * | 1977-08-31 | 1979-10-04 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Hochleistungsstromrichter |
| US4489363A (en) * | 1983-01-31 | 1984-12-18 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
| US4601202A (en) * | 1983-12-27 | 1986-07-22 | General Electric Company | Gas turbine engine component cooling system |
| US4608819A (en) * | 1983-12-27 | 1986-09-02 | General Electric Company | Gas turbine engine component cooling system |
| US4790373A (en) * | 1986-08-01 | 1988-12-13 | Hughes Tool Company | Cooling system for electrical components |
| DE3703873A1 (de) * | 1987-02-07 | 1988-08-18 | Sueddeutsche Kuehler Behr | Kuehlkoerper, insbesondere zum kuehlen elektronischer bauelemente |
| DE3704015C2 (de) * | 1987-02-10 | 1996-02-22 | Hess Joachim | Schutzgehäuse aus Kunststoff zur wiederholt dicht verschließbaren Aufnahme von Meß-, Schalt-, Überwachungs- und ähnlichen Geräten |
| US4858717A (en) * | 1988-03-23 | 1989-08-22 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Acoustic convective system |
| US4947287A (en) * | 1988-11-30 | 1990-08-07 | Sundstrand Corporation | Capacitor cooling arrangement |
| US5020586A (en) * | 1989-09-08 | 1991-06-04 | Hewlett-Packard Company | Air-cooled heat exchanger for electronic circuit modules |
| DE3940289A1 (de) * | 1989-12-06 | 1991-06-13 | Klein Kg Elektro Geraete G | Kuehlkoerper fuer geraete der elektrotechnik |
| JP4438526B2 (ja) * | 2004-06-16 | 2010-03-24 | 株式会社安川電機 | パワー部品冷却装置 |
| US8020608B2 (en) * | 2004-08-31 | 2011-09-20 | Hewlett-Packard Development Company, L.P. | Heat sink fin with stator blade |
| TWM339197U (en) * | 2007-12-13 | 2008-08-21 | Asia Vital Components Co Ltd | Heat dissipating unit |
| US20110036552A1 (en) * | 2009-08-11 | 2011-02-17 | Ventiva, Inc. | Heatsink having one or more ozone catalyzing fins |
| CN204406297U (zh) * | 2015-02-02 | 2015-06-17 | 北京京东方茶谷电子有限公司 | 一种主机机箱和主机 |
| GB201608523D0 (en) * | 2016-05-16 | 2016-06-29 | Rolls Royce Plc | Heat sink |
| US10952352B2 (en) | 2017-10-27 | 2021-03-16 | Micron Technology, Inc. | Assemblies including heat dispersing elements and related systems and methods |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH82679A (de) * | 1919-05-02 | 1919-10-16 | Oerlikon Maschf | Kühleinrichtung an elektrischen Flachleitern |
| DE929521C (de) * | 1953-03-06 | 1955-06-27 | Eduard Dipl-Ing Schmieg | Rippenrohr |
| US2818237A (en) * | 1955-10-27 | 1957-12-31 | Carlton G Lehr | Cooling means |
| US3086283A (en) * | 1959-08-24 | 1963-04-23 | Charles A Webber | Method for improving assembly of heat exchanger for semiconductors |
| US3216496A (en) * | 1961-02-01 | 1965-11-09 | Astro Dynamics Inc | Heat sink for electronic devices |
| US3171069A (en) * | 1961-10-12 | 1965-02-23 | Udylite Corp | Diode heat sink structure |
| US3261396A (en) * | 1963-11-13 | 1966-07-19 | Staver Co | Heat dissipator for electronic circuitry |
| US3313340A (en) * | 1965-03-23 | 1967-04-11 | Lambda Electronics Corp | Heat exchanger |
-
1967
- 1967-06-15 US US654025A patent/US3416597A/en not_active Expired - Lifetime
-
1968
- 1968-06-10 GB GB27493/68A patent/GB1172332A/en not_active Expired
- 1968-06-12 NL NL6808229A patent/NL6808229A/xx unknown
- 1968-06-12 BE BE716446D patent/BE716446A/xx unknown
- 1968-06-14 DE DE1764486A patent/DE1764486C3/de not_active Expired
- 1968-06-14 FR FR1586363D patent/FR1586363A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE1764486C3 (de) | 1973-12-13 |
| FR1586363A (en:Method) | 1970-02-20 |
| DE1764486A1 (de) | 1972-03-30 |
| US3416597A (en) | 1968-12-17 |
| GB1172332A (en) | 1969-11-26 |
| BE716446A (en:Method) | 1968-12-12 |
| DE1764486B2 (de) | 1973-05-30 |